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Device Trends and Process Materials Requirements

$8,268.00

The Device Trends report provides a comprehensive look at semiconductor materials requirements for current and future devices.

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Product Description

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1. Executive Summary 8

     1.1. Supply-Chain Challenges             8

2. Scope 8

3. Introduction 9

     3.1. The Start and Growth of the Semiconductor Industry             11

     3.2. The Asian Semiconductor Industry             16

     3.3. The Changing Market             17

     3.4. Where have we come from?             19

4. Future Trends 20

     4.1.        Economics             20

     4.2.        MegaFabs and Gigafabs             23

     4.3.        Inflection Points             26

     4.4.        TECHCET’s Wafer Forecast Model             27

5. Device Technologies 30

5.1.1.            LOGIC                  32

5.1.2.            Memory                  36

5.1.3.            NON-VOLATILE MEMORY                  37

5.1.4.            3D NAND                  38

5.1.5.            STORAGE CLASS MEMORY DEVICES                  42

5.1.5.1.        3D XPoint             42

5.2.        New Device Structures             43

5.2.1.            Memory Structures                  43

5.2.2.            Logic Structures                  44

5.3.        New Memory             48

5.3.1.            RRAM or ReRAM                  48

5.3.2.            STT-RAM                  49

5.3.3.            PCRAM                  51

5.3.4.            FeRAM                  52

5.4.        Limited or Research stage             54

5.4.1.            MVO                  54

5.4.2.            CBRAM                  55

5.4.3.            NRAM                  57

5.4.4.            Molecular/Carbon                  58

5.4.5.            Transistors For CMOS Extensions (ITRS 2015)                  59

5.4.5.1.        Carbon Nanotube FETs             59

5.4.5.2.        Nanowire FETs             59

5.4.6.            III-V Channel Replacement Devices                  60

5.5.        IoT Impacts             61

6. Device to Process to Material 65

6.1.        3D NAND Process Challenge             65

6.2.        New Materials used in Memory             68

6.2.        Device Formation             69

6.3.        Interconnect             71

6.4.        Lithography             77

6.5.        ALD             81

6.6.        ALE – Atomic Layer Etching             84

6.7.        Cleaning             86

6.8.        Materials             88

6.8.1.            ALD/CVD PRECURSORS                  88

6.8.2.            Device Formation                  88

6.8.3.            Interconnect                  89

6.8.4.            Market Environment                  89

6.8.5.            Gases                  90

6.8.6.            Inert Gases                  92

6.8.7.            Bulk Chemicals                  93

6.8.8.            Dielectrics Precursors                  94

6.9.        CMP             97

6.10.        Sputtering Targets             97

6.11.        Photoresists, Ancillaries & Extension Materials             99

7. Process Materials Concerns & Issues 101

7.11.        Materials Supply Chain Management             101

7.12.        Quality and Purity Issues             101

7.13.        Materials Supply Chain Issues             104

7.14.        Future Materials Requirements and Rare Earths Minerals and Metals             105

8. Changes in the Materials Market Opportunities 106

8.1.        IoT opportunities             106

9. Global and Operation issues 107

9.1.        Recycling             107

9.2.        Cost Structure Changes             107

9.3.        WIP Management             109

9.4.        Semiconductor Center of Gravity Shifts West             109

9.5.        Meeting the China Challenges             111

10. Conclusions & Take Aways 114

11. Bibliography 116

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