Sputter Targets

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This report provides supply chain information as well as business and technical trends on sputter targets used for semiconductor devices.

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Description

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1: Executive Summary………………………….…10

2: Scope & Methodology……………………..…14

3: Semiconductor Market Overview………..18

3.1 Forecast Trends…………………………20

3.2 Wafer StartForecast……………………21

4: Raw Material Economic Overview………..22

4.1 Copper………………………………………23

4.2 Tantalum…………………………………..25

4.3 Aluminum………………………………….27

4.4 Titanium Sponge………………………..29

4.5 Tungsten……………………………………31

5: Supply Chain Update……………………..…33

5.1 Copper Supply Tightens………………34

5.2 Titanium……………………………………35

5.3 Tungsten China Update………………36

6: Supply Chain Analysis & Pricing……………………….37

6.1 Copper………………………………………………….44

6.2. Tantalum…………………………………………….46

6.3 Aluminum…………………………………………….48

6.4 Titanium………………………………………………52

6.5 Tungsten……………………………………………..56

6.6 Other…………………………………………………..60

6.7 Total……………………………………………………61

6.8 Cumulative Target Price Forecast…………62

7: Technology Trends…………………………………………..64

7.1 Technology Updates…………………………….65

7.2 Cobalt Integration……………………………….66

7.3 Material Challenges……………………………..67

7.4 Beyond Copper……………………………………68

7.5 Approaches to Solve Barrier Problems…69

7.6 TSV……………………………………………………..70

7: Regulatory Update…………………………72

10.1 Conflict Minerals: Dodd Frank…73

10.2 European Union (EU) Commission, Council and Parliament………………..77

8: Business Trends and Analysis…………..78

8.1 2013 Supplier Market Share ……79

8.2 Target Production………………….80

8.3 Competitive Environment – Cu & Al………………………………………………..82

8.4 Tungsten………………………………..83

8.5 Cobalt ……………………………………84

8.6 Sn Update………………………………85

8.7 Conflict Minerals ……………………86

8.8 Precious Metals ……………………..87

8.9 Rare Earths …………………………….88

8.10 Summary ………………………………89

12: Supplier News and Profiles………….136

12.1 Honeywell…………………………137

12.2 JX Nippon…………………………140

12.3 Praxair……………………………..143

12.4 Tosoh SMD……………………….147

11.2 KFMI…………………………………128

11.3 Grikin………………………………..131

Appendix A: Key Manufacturing Cost Drivers……..44

A.1 Cost Components………………………………..45

A.2 Key Cost Drivers of Copper Targets………48

A.3 Key Cost Drivers of Tantalum Targets..…52

A.4 Key Cost Drivers of Aluminum Targets….57

A.5 Key Cost Drivers of Titanium Targets…….61

A.6 Key Cost Drivers of Tungsten Targets……65

11: China Perspective………………………..126

11.1 China Perspective……………….127

8.5 Silicide Approach…………………..106

8.7 7 nm Logic Challenges……………108

8.8 Material Challenges……………….110

8.9 Limits of Barrier Thickness…….111

8.10 Approaches to Solve Barrier Problems…………………………………..112

8.11 450 mm Devices……………………113

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