Metal Plating Chemicals on Track for Growth

Copper Leading the Way San Diego, CA, January 23, 2025: TECHCET— the electronic materials advisory firm providing semiconductor materials supply chain information — expects 2025 metal plating chemicals to rise to US$1,060 M in 2025, growing 9% over 2024. The largest segment is Cu plating chemicals used for device level interconnect, and SnAg/Sn for package… Continue reading Metal Plating Chemicals on Track for Growth

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Categorized as Metal Chem