The Future of CMP: More Process Steps, More Growth Ahead
San Diego, CA, September 2, 2025: TECHCET — the electronic materials advisory firm providing semiconductor materials supply chain information— reports the global CMP consumables market, covering pads and slurries, will grow 6% in 2025, reaching ~$3.6B, up from ~$3.4B in 2024. CMP continues to enable advanced logic, DRAM, and 3D NAND scaling by reducing defects, improving yield, and supporting an increasing number of thin layers and interconnects. Growth is being fueled by the expansion of 3D NAND stacks (toward >1,000 layers), GAA transistors, and backside power delivery, which require more CMP steps per wafer. Longer term, the CMP consumables market is projected to grow at a CAGR of 9% from 2024–2029 according to TECHCET’s 2025-2026 Critical Materials Report™ on CMP.
Slurry and pad suppliers are responding with major investments to meet expected rise in demand. FujiFilm and Entegris remain slurry market leaders, and DuPont (soon to be QNITY) dominated CMP pads at >70% share in 2024. Anji Microelectronics in China surged in overall slurry market share, while Hubei Dinglong posted huge pad revenue growth, both reflecting strong domestic support and local fab growth. Supplier expansions continue including Entegris’ U.S. R&D center and new Korea facility, FujiFilm’s global materials investments, and DuPont’s Edison Ikonic™ 9000 pad line. These moves are included in TECHCET’s updated forecasts as well as demand from new applications in oxide, Cu, Co, Mo, and Ru.
Looking ahead, growth in advanced packaging is blurring the historical boundary between the wafer fab and packaging, and configurations like FOWLP, 3D TSV, and hybrid bonding increasingly rely on CMP for surface planarity and defect control.
For more details on the CMP market growth trajectory, go to: https://techcet.com/product/cmp-consumables/
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