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Rising Copper Demand in Semiconductors Drives Plating Chemicals for Advanced Packaging and Interconnects

San Diego, CA, September 10, 2025: TECHCET — the electronic materials advisory firm providing semiconductor materials supply chain information— announces the release of its latest report, TECHCET’s 2025-2026 Critical Materials Report™ on Metal Chemicals, focused on electroplating materials for device interconnects and advanced packaging. The report covers copper (Cu) pillar, micro-bump (µBump), wafer-level packaging (WLP), redistribution layers (RDL), and through-silicon-via (TSV), with updated modeling that more accurately reflects Cu content in packaging, driving higher forecasts for both volume and revenue.

The global plating chemicals market is projected to reach US$1,373M in 2025, up 8.7% from 2024. Copper leads the market, split between US$489M for device interconnects and US$509M for advanced packaging in 2025. Growth is fueled by rising interconnect densities in advanced logic, demand from HPC and AI, and increasing adoption of advanced packaging.

Industry momentum is reinforced by major investments: MacDermid Alpha launched MICROFAB SC-40 PLUS for Cu pillar plating; MKS/Atotech is building a $40M chemicals plant in Thailand; and Moses Lake Industries opened a $100M Arizona R&D facility for high-purity electrolytes and Cu plating. Meanwhile, TSMC, Amkor, and ASE are expanding U.S. packaging capacity to support demand from AI, datacenter, and automotive markets. For more details on drivers and trends in metal plating materials, go to www.techcet.com or attend the CMC Seminar, October 28-29: https://techcet.com/event/fall-2025-cmc-seminar/ to gain knowledge from TECHCET analysts and the semiconductor ecosystem.

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ABOUT: TECHCET CA LLC is an advisory services firm expert in market and supply chain analysis of electronic markets and supply chains for the semiconductor, display, solar, and LED markets. TECHCET offers custom consulting, subscription data service, and the Critical Materials Council and DSS memberships. For additional information, please email us, call +1-480-382-8336, or go to www.techcet.com