Rising Copper Plating Demand in Semiconductors Driven by Advanced Packaging and FE Interconnects
San Diego, CA, November 24, 2025: TECHCET — the global plating chemicals market is projected to reach US$1,381M in 2025, up 9.3% from 2024. Copper leads the market, split between US$495M for device interconnects and US$509M for advanced packaging in 2025. The advanced laminate substrates applications currently see the bulk of demand within the packaging segment. But this is expected to shift as more plating and CMP are required to support larger interposers, panel level packaging and hybrid bonding, now starting to emerge. Growth is fueled by rising interconnect densities in advanced logic, demand from HPC and AI, and increasing adoption of advanced packaging according to TECHCET’s 2025-2026 Critical Materials Report™ on Metal Chemicals.
Industry momentum is reinforced by major investments: MacDermid Alpha launched MICROFAB SC-40 PLUS for Cu pillar plating; MKS/Atotech is building a $40M chemicals plant in Thailand; and Moses Lake Industries opened a $100M Arizona R&D facility for high-purity electrolytes and Cu plating. Meanwhile, TSMC, Amkor, and ASE are expanding U.S. packaging capacity to support demand from AI, datacenter, and automotive markets.
For more details on drivers and trends in metal plating materials, go to www.techcet.com. For the report, go to https://techcet.com/product/metal-chemicals/. The Metal Chemicals report specifically covers copper (Cu) pillar, micro-bump (µBump), wafer-level packaging (WLP), redistribution layers (RDL), and through-silicon-via (TSV), with updated modeling that more accurately reflects Cu content in packaging, driving higher forecasts for both volume and revenue.
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