Chapters of this report can be purchased directly from TECHCET here – see available chapters below. If you would like to purchase the entire report, please do so at the SEMI website.

• Provides detailed market analysis including market size, forecasts, and market share for packaging materials markets including substrates, leadframes, bonding wire, encapsulation materials, underfill materials, die attach, solder balls, wafer level package dielectrics, and wafer-level plating chemicals.
• Includes a regional market analysis.
• Forecasts for units and revenues out to 2028
• Information for supply-chain managers, procurement teams, marketing managers, and financial analysts
• Includes supply-chain, market, and technical trends information impacting the packaging materials industry.
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