Advanced Packaging and Next Generation Devices Accelerating CMP Consumables Growth

2021 Slurry Market is Forecasted to Reach US$1.80 B up 8% from US$1.66 B in 2020

San Diego, CA, August 3, 2021:  TECHCET—the electronic materials advisory firm providing business and technology information— announced CMP (chemical mechanical planarization) consumables for advanced packaging exhibited high growth of approximately 14.1% in 2021 over 2020 and expected to grow at a CAGR of 12.7% over the next 5 years. Applications such as 3DTSV, and FOWLP represent solid opportunities for CMP, adding 1 to 2 CMP steps per wafer.

“In addition to the advanced packaging segment, we are seeing high growth of CMP consumables in next-generation logic and memory devices. The number of CMP process steps continues to increase, driving healthy growth over the next 5 years,” said TECHCET’s President, Lita Shon-Roy. 3D 7nm logic devices require as many as 45 CMP steps, while 3D NAND 128L devices have ~ 34 CMP process steps. These continue to increase as more layers and CMP steps are added into each new generation.

As indicated in TECHCET’s newly released Critical Materials Report™ on CMP Consumables 2021, the total slurry market is forecasted to reach US$1.80 B in 2021 up 8% from US$1.66 B in 2020, with a 5-year CAGR of 6%. Cu bulk, Cu barrier, tungsten, and oxide (both ceria and silica-based) slurries represent the largest segments of the slurry TAM. The resurgence of tungsten slurry growth is being fueled by the rapid increase in layers for 3D NAND. New applications related to HKMG and Co continue to grow as well.

CMP has continued to be one of the critical process steps that make ultra-flat and smooth surfaces enabling advanced electronic device manufacturing with an increasing number of thin layers. The consumables industry fared well during COVID. Despite concerns about an economic slowdown caused by the Covid-19 pandemic, the CMP consumables industry remains strong and is seeing growth as a result of the overall Semiconductor boom. The 2021 pad market is forecasted to reach US$1.11 B up 9% from US$1.02 B in 2020, with a 5-year CAGR of 5.1%.

For more information on the CMP Consumables Critical Materials Report™: https://techcet.com/product/cmp-slurry-and-pads-only/ 

ABOUT TECHCET:  TECHCET CA LLC is an advisory services firm focused on process materials supply-chains, electronic materials business, and materials market analysis for the semiconductor, display, solar/PV, and LED industries. Since 2000, the company has been responsible for producing the Critical Material Reports™, covering silicon wafers, semiconductor gases, wet chemicals, CMP consumables, Photoresists, and ALD/CVD Precursors. The Critical Materials Council (CMC) of semiconductor fabricators is a business service offered by TECHCET, and includes materials supplier Associate Members. For additional information about reports, market briefings, CMC membership, or custom consulting please contact [email protected], +1-480-332-8336, or go to www.techcet.com or www.cmcfabs.org.