New Global Semiconductor Packaging Materials Outlook – US$26 Billion market to approach US$30 Billion by 2027
San Diego, CA, March 30, 2023: TECHCET and TechSearch International, Inc. recently announced that the market for Semiconductor Packaging Materials totaled US$26.1 billion in revenues for 2022, and is forecasted to approach US$30 billion in 2027. For 2023, packaging materials are expected to decline about -0.6% given the forecasted slowdown in the overall semiconductor industry. Recovery is expected in the second half of 2023, pointing to growth in 2024…