Slurry and Pad Sub-Markets both ~6% CAGR San Diego, CA, January 18, 2018: TECHCET—the advisory services firm providing electronic materials information— announced that increased use of 3D structures in commercial ICs leads to the need for more Chemical-Mechanical Planarization (CMP) process steps in commercial IC fabrication to keep the different layers properly aligned. The growing… Continue reading CMP Materials Market to Reach $2.4B by 2022