Electroplating Materials – Any Slowdown in Sight?

Advanced logic device expected to drive metal plating market forward

San Diego, CA, September 13, 2022:  TECHCET—the electronic materials advisory firm providing business and technology information— forecasts the total 2022 IC electroplating (Metal Chemicals) revenues to grow 8.1% to reach US$1,019 million. “A key growth driver for the electroplating market includes increases in interconnect layers in next generation advanced logic device nodes,” states Karey Holland, Ph.D., TECHCET’s Chief Strategist and Sr. Analyst. This is soon to be followed with buried power rails and backside copper wiring, increased use of advanced packaging for redistribution layers and copper pillar structures, and general overall strong demand for all semiconductor devices requiring copper interconnects.

The recently published Critical Materials Market Report on Metal Chemicals CMR™ highlights advanced Logic devices at < 14 nm as key drivers of growth, and expected show a CAGR of 7.4% through 2026. While chemical vapor deposition (CVD) or atomic layer deposition (ALD) are used to deposit metal interconnects at the lower device levels, the upper layers will continue to be electroplated copper as the bulk interconnect wiring. Thus, overall growth in advanced logic and number of layers continues to push up copper plating revenues for logic devices.

Copper metal electroplating is the largest segment of the IC electroplating segment and will top US$710 million in 2022. The forecasted 2021 to 2026 Compound Annual Growth Rate (CAGR) for this segment is 8.6%.

While smaller of the two copper plating chemical segments, advanced packaging applications are soaring in terms of use. The 2021 to 2026 CAGR for advanced packaging wafer starts is approaching 10%. The fastest growing segment is Fan-Out WLP which boosts application of RDL plating. Plating chemical volume consumption is increasing; however, TECHCET expects downward price pressure on CuSO4 as emerging suppliers in Asia are hungry to get a piece of the action.

For more details on the Metal Chemicals IC Electroplating Chemicals market and growth trajectory go to: https://techcet.com/product/metal-chemicals-for-fe-advanced-packaging/

ABOUT TECHCET: TECHCET CA LLC is an advisory services firm expert in market analysis and business development of electronic markets and supply-chains for the semiconductor, display, solar/PV, and LED industries. TECHCET offers consulting, reports, and subscription services, including the Critical Materials Council (CMC) of semiconductor fabricators and CM Data subscription services. For additional information, please contact info@cmcfabs.org, +1-480-332-8336, or go to www.techcet.com.