2023 CMC Conference

2023 CMC Conference

2023 CMC Conference
Are Critical Materials for Chip Expansions Ready for Launch?
April 18-20, 2023 | Round Rock, Texas

Keynote Speaker:
Jon Taylor, Corporate VP, Fab Engineering at Samsung Austin Semiconductor

The Critical Materials Council (CMC) Conference is a 2-day event providing actionable information on materials and supply-chains for current and future semiconductor manufacturing. Unlike other conferences, the CMC Conference provides practical information addressing “How-to” not just “What.” Solutions to process challenges and materials-related issues are a key focus for the CMC conference presenters. Equally important focal points include business and supply-chain trends and materials needed for emerging technologies.

Featuring 5 Impactful Sessions and a New Special Session Panel:
1. Global Issues & Trends Impacting Materials
2. Heterogenous Integration& Advanced Packaging Materials
3. Immediate Challenges of Materials and Manufacturing
4. Challenges of Equipment & Consumable Component Materials
5. Emerging Materials in R&D and Pilot Fabrication
* Special Session Panel: Universal Industry Challenges to Industry Expansions and Growth: “Data-Fication”

  • icon Round Rock, Texas

CMC Seminar Agenda (all presentations in English)

8:15 Keynote Speech: Jon Taylor, Corporate VP, Fab Engineering and Public Affairs at Samsung Austin Semiconductor –
“Addressing Quality & SCM Challenges for Advanced Chip Manufacturing in the US”
Day 1: Session I: Supply-Chain Challenges including Logistics
Location: Sakura and Osmanthus Room at Fullon Hotel Lihpao Resort
Time Speaker Topic
9:00 Session Keynote: Corinna Singer, Senior Dir. of Procurement at Infineon Globalization vs. Regionalization – How to Create Resilience in the Supply Chain
 9:30 Taylor St. Germain, Forecasting Analyst, at TechInsights The Road to $1 Trillion Through Peaks and Valleys
10:00 Lita Shon-Roy, MS/MBA, President and CEO at TECHCET Material Supply-Chains Upsides and Downsides
10:45 Jeff Perkins, EVP & GM at Yole Semiconductor Devices for Automotive Applications: What are the Market and Technologies Evolutions Expected?
11:15 Jim Reed, VP, Key Account Development at Okmetic Latest Advances in Silicon Wafers Targeted for RF Devices
Session II: Heterogenous Integration & Advanced Packaging Materials
1:00 Session Keynote: Dilan Seneviratne, PhD, Dir. of Substrate Packaging Materials at Intel Substrate Opportunities and Challenges in the Heterogenous Integration
1:25 Dan Tracy, PhD, Sr. Director at TECHCET Advanced Packaging Materials Changing Market & Drivers
1:50 Rose Guino, PhD, Principal Applications Engineer at Henkel Programs – Micron Advanced Semiconductor Underfills
14:15 Shelby Nelson, Chief Technology Officer at Mosaic Microsystems Thin Glass for Advanced Packaging Applications
14:40 Jaim Nulman, PhD, Chief Product Officer and President at Atlant 3D Direct Atomic Layer Processing for Backend
Session III: Immediate Challenges of Materials and Manufacturing
15:25 Joyce Witowski, Sr. Director, Sustainable Manufacturing at NXP Challenges and Key Priorities for the Automotive Semiconductor Value Chain
15:50 Mousumi Bhat, PhD, VP, Sustainability Programs at SEMI Sustainable Semiconductor Manufacturing – Processes and Materials
16:15 Tim Yeakley, EHS Policy Manager at Texas Instruments, and Laurie Beu, Principal Consultant at Beu Consulting Semiconductor PFAS Consortium Results and Opportunities
16:40 Jeffrey Yoder, PhD, Sr. Dir. HVM Product Management at Air Liquide Unmasking the Challenges of Diborane Manufacturing and Supply
17:05 Robert W. Ivester, PhD, Sr. Advisor for Semiconductor Engagement at NIST Overview of CHIPS Production and Research Opportunities
DAY 2: Session IV: Challenges of Equipment & Component Materials
8:15 Session Keynote: Regina Freed, VP, Alx Solutions at AMAT Accelerating Materials Engineering
8:45 Julie Bannister, Sr. Manager, Strategic Marketing at TEL Ecosystem Readiness for Scaling and Lithography at 3nm and Below
9:10 Bryan Hendrix, PhD, Fellow at Entegris Hydrogen Recovery
9:35 Lassi Leppilahti, Application Manager at Beneq ALD Protective Coatings for Critical Process Equipment Components
10:15 Zach Dunbar, PhD, Technology Manager at Edwards Vacuum ALD Protective Coatings for Critical Process Equipment Components
10:40 Madison Smith, Principal at Cozen US-China Policy: Chip Restrictions and Future Outlooks
11:05 Chris Han-Adebekun, PhD, VP of Business Development at Athinia Integrated Data Collaboration for Value Chain Ecosystem
8:15 Special Session: PANEL ON UNIVERSAL CHALLENGES TO GROWTH – DATA-FICATION, Hosted by David Thompson, Sr. Managing Director, Applied Materials, and Mike McSwiney, PhD, Chemist Director, Applied Materials. Contributing speakers: Benjamin Jurcik, CTO Electronics Business Line at Air Liquide, Chris Han-Adebekun, PhD, VP of Business Development at Athinia, Regina Freed, VP, Alx Solutions at AMAT, and more coming soon.
Session V: Emerging Materials in R&D and Pilot Fabrication
13:35 Session Keynote: Carolyn Duran, PhD, VP and Engineering Manager, Components Research at Intel Materials at the Heart of Semiconductor Innovation
14:00 Benjamin Eynon, Sr. Dir., Advanced Technology Division at LAM Research Dry Resist Materials, Equipment, and Process for Improving EUVL Capability and Extending Its Use Well Below the 1nm Node
14:25 Joyce Lowes, Dir. of Emerging Materials Technology at Brewer Science New Developments in Underlayers and Their Role in Advancing EUV Lithography
14:50 Glen Scheid, Sr. Manager, Operations, Mask Technology Center at Micron Photomask Materials – Challenges and Future Requirements
15:30 Satyavolu Papa Rao. PhD, VP, Research at NY CREATES Materials for Quantum
15:55 Steven Eulig, Head of Business Dev, Ops Digital Solutions at EMD Electronics
Model-based optimization of the application performance
in late-stage material development
16:20 Karey Holland, PhD, Chief Strategist at TECHCET Materials & Technology Roadmap – Where have we been? And where are we going?