Table of Contents

1 EXECUTIVE SUMMARY   12
1.1 PRECURSORS BUSINESS – MARKET OVERVIEW   13
1.2 PRECURSORS MARKET TRENDS IMPACTING 2024 OUTLOOK   14
1.3 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT: METAL
AND HIGH-K PRECURSORS   15
1.4 PRECURSOR TRENDS   16
1.5  PRECURSOR TECHNOLOGY TRENDS  17
1.6 COMPETITIVE LANDSCAPE METAL & HIGH-K PRECURSORS  18
1.7  PRECURSOR EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS   19
1.8 ANALYST ASSESSMENT OF METAL AND HIGH-K PRECURSORS   20

2 SCOPE, PURPOSE AND METHODOLOGY   21
2.1 SCOPE   22
2.2 METHODOLOGY   23
2.3 OVERVIEW OF OTHER TECHCET CMR™ OFFERINGS   24

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK   25
3.1 WORLDWIDE ECONOMY AND OUTLOOK   26
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY  28
3.1.2 SEMICONDUCTOR SALES GROWTH  29
3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS  30
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT   31
3.2.1 ELECTRONICS OUTLOOK  32
3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK  33
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS  34
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS  35
3.2.3 SMARTPHONE OUTLOOK  36
3.2.4 PC OUTLOOK  37
3.2.5 SERVERS / IT MARKET  38
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION   39
3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS  40
3.3.2 NEW FABS IN THE US  41
3.3.3 WW FAB EXPANSION DRIVING GROWTH   42
3.3.4 EQUIPMENT SPENDING TRENDS  43
3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS  44
3.3.5.1 DRAM TECHNOLOGY ROADMAPS  45
3.3.5.2 3D NAND TECHNOLOGY ROADMAPS  46
3.3.6 FAB INVESTMENT ASSESSMENT  47
3.4 POLICY & TRADE TRENDS AND IMPACT   48
3.5 SEMICONDUCTOR MATERIALS OVERVIEW   49
3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028  50
3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028  51

4 MATERIAL MARKET TRENDS   52
4.1 CVD, ALD METAL & HIGH-K AND ADVANCED DIELECTRIC
PRECURSORS MARKET TRENDS   53
4.1.1 2023 PRECURSOR MARKET LEADING INTO 2024  54
4.1.2 PRECURSOR MARKET OUTLOOK  55
4.1.3 METAL AND HIGH-K PRECURSORS 5-YEAR UNIT SHIPMENT  FORECAST BY SEGMENT  56
4.2 PRECURSORS SUPPLY CAPACITY AND DEMAND, INVESTMENTS   57
4.2.1 METAL & HIGH-K PRECURSOR PRODUCTION CAPACITY OF TOP SUPPLIERS  58
4.2.2 METAL & HIGH-K PRODUCTION BY REGION   59
4.2.3 ALD/CVD MATERIAL PRODUCTION CAPACITY EXPANSIONS  60
4.2.4 INVESTMENT ANNOUNCEMENTS OVERVIEW  62
4.2.5 PRECURSORS SUPPLY VS. DEMAND BALANCE – OVERVIEW  63
4.3 PRICING TRENDS   64
4.4 TECHNOLOGY TRENDS/TECHNICAL DRIVERS – OUTLINE   65
4.4.1 PRECURSOR GENERAL TECHNOLOGY OVERVIEW &
TECHNOLOGY TRENDS  66
4.4.2 CUSTOMER DRIVEN TECHNOLOGIES  67
4.4.3 NAND ROADMAPS AND CHALLENGES – 3D NAND LEVELS
W/ STACKS/TIERS  68
4.4.4 3D NAND PROCESS ADVANCES REQUIRED  69
4.4.5 NEW MATERIALS AND ETCH CHEMISTRIES ENABLE 3D NAND SCALING – PF3(G) AND MOO2CL2(S)  70
4.4.6 MOLYBDENUM: THE NEW FRONTIER IN SEMICONDUCTOR
METALLIZATION ACCORDING TO LAM RESEARCH  71
4.4.7 DRAM PROCESS ADVANCES REQUIRED  72
4.4.8 DRAM FUTURE TECHNOLOGY CHALLENGES  73
4.4.9 MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL-LAYER  32GBIT NON-VOLATILE FERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE  74
4.4.10 ADVANCED LOGIC ROADMAPS AND CHALLENGES –
LOGIC TRANSISTOR EST. ROADMAP  75
4.4.11 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE  76
4.4.12 ADV LOGIC PROCESS ADVANCES REQUIRED  77
4.4.12.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND
TSMC’S GAA FETS VS. INTEL’S RIBBONFET  78
4.4.13 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES  79
4.4.14 ADVANCING TECHNOLOGIES IMPLICATION TO
PHOTOLITHOGRAPHY  81
4.4.14.1 ADVANCING TECHNOLOGIES IMPLICATION TO
PHOTOLITHOGRAPHY – DSA  82
4.4.14.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: CENTURA SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING  84
4.4.14.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION  85
4.4.15 CFET ARCHITECTURE: CFET SCALING ADVANTAGE  86
4.4.15.1 CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS)  87
4.4.15.2 CFET ARCHITECTURE: CFET FUTURE PROSPECTS  90
4.4.16 INORGANIC EUV RESIST – ALD DEPOSITED  92
4.4.17 MOLECULAR LAYER DEPOSITION (MLD)  93
4.4.17.1 TREND IS MLD COMBINED WITH ALD  94
4.4.17.2 DIFFERENT TYPES OF MLD PRECURSORS AND MATERIALS  95
4.4.17.3 MLD APPLICATIONS  96
4.4.18 AREA SELECTIVE DEPOSITION (ASD)  97
4.4.18.1 AREA SELECTIVE DEPOSITION (ASD) – ADEKA PRESENT
ASD HF-PRECURSOR  98
4.4.18.2 AREA SELECTIVE DEPOSITION (ASD) – TU EINDHOVEN
SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT  99
4.4.20 SPECIALTY/EMERGING METAL AND APPLICATIONS  100
4.4.21 SPECIALTY/EMERGING HIGH-K AND APPLICATIONS  101
4.5 REGIONAL CONSIDERATIONS – METAL AND HIGH-K   102
4.5.1 REGIONAL ASPECTS AND DRIVERS  103
4.6 EHS AND TRADE/LOGISTIC ISSUES – METALS, HIGH-K AND DIELECTRICS     105
4.6.1 ESH METALS  106
4.6.2 ESH HIGH-K  107
4.6.3 ESH RECYCLING  108
4.7 TRADE/LOGISTICS ISSUES – METAL MATERIALS   109
4.7.1 TRADE/LOGISTICS ISSUES – HIGH-K MATERIALS  110
4.8 ANALYST ASSESSMENT OF HIGH-K MARKET TRENDS   111
4.8.1 ANALYST ASSESSMENT OF METAL MARKET TRENDS  112

5 SUPPLY-SIDE MARKET LANDSCAPE   113
5.1 PRECURSOR MATERIAL MARKET SHARE   114
5.1.1 CURRENT QUARTER ACTIVITY – MERCK  115
5.1.1.1 MERCK  116
5.1.2 CURRENT QUARTER ACTIVITY – AIR LIQUIDE  118
5.1.2.1 AIR LIQUIDE  119
5.1.3 CURRENT QUARTER ACTIVITY –ENTEGRIS  120
5.1.3.1 ENTEGRIS  121
5.1.4 ADEKA  122
5.1.4.1 ADEKA  123
5.2 M&A ACTIVITY AND PARTNERSHIPS   124
5.3 PLANT CLOSURES   126
5.4 NEW ENTRANTS   127
5.4.1 MSP LAUNCHES TURBO II™ VAPORIZERS: NEXT-GEN EFFICIENCY FOR SEMICONDUCTOR FABRICATION  128
5.4.2 A NEW ZR PRECURSOR WAFER-SCALE ZIRCONIUM DIOXIDE FILMS  129
5.4.3 ADVANCES IN MOLYBDENUM THIN FILMS: NEW LIQUID
PRECURSORS BOOST VAPOR PHASE DEPOSITION  130
5.4.4 HANWHA TO SUPPLY ALD EQUIPMENT FOR MOLYBDENUM DEPOSITION FOR MEMORY APPLICATIONS  131
5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS   132
5.6 TECHCET ANALYST ASSESSMENT OF PRECURSOR SUPPLIERS   133

6 SUB-TIER SUPPLY-CHAIN, PRECURSORS  134
6.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW   135
6.1.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – TIER 2 EXAMPLES NOURYON AND GELEST  136
6.1.2 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – CHEMICAL & GAS MANAGEMENT SYSTEMS  137
6.1.3 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – CHEMICAL DELIVERY CABINETS  138
6.1.4 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW VALVE MANIFOLD BOXES (VMB)  139
6.1.5 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – BULK SPEC GAS SYSTEMS  140
6.1.6 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – GAS CABINETS  141
6.1.7 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – FORMING GAS & DOPANT GAS BLENDERS  142
6.1.8 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW CHEMICAL – MONITORING AND ANALYTICAL SYSTEMS  143
6.2 SUB-TIER MATERIAL CVD & ALD PRECURSOR TRENDS   144
6.3 SUB-TIER MATERIAL INDUSTRIAL VS. SEMICONDUCTOR-GRADE   145
6.4 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER
GLOBAL NETWORK MERCK   146
6.5 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK AIR LIQUIDE   147
6.6 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER NEWS   148
6.7 SUB-TIER SUPPLY-CHAIN: DISRUPTIONS   150
6.8 SUB-TIER SUPPLY-CHAIN PLANT UPDATES   151
6.9 SUB-TIER SUPPLY-CHAIN PLANT UPDATES – HAFNIA AND REO FROM THE DUBBO PROJECT   152
6.10 MINERAL USED IN THE SEMICONDUCTOR INDUSTRY
DEPENDENCIES   153
6.11 SUB-TIER SUPPLY-CHAIN PRICING TRENDS – COBALT   154
6.12 SUB-TIER SUPPLY-CHAIN PRICING TRENDS: ZIRCONIUM
AND HAFNIUM  156
6.13 SUB-TIER SUPPLY-CHAIN PRICING TRENDS – HAFNIUM  157
6.14 SUB-TIER SUPPLY-CHAIN PRICING TRENDS – GALLIUM   158
6.15 ALUMINUM   160
6.16 TITANIUM   161
6.17 TUNGSTEN   162
6.18 MOLYBDENUM  163
6.19 NIOBIUM AND TANTALUM   164
6.20 RARE EARTHS  165
6.21 SUB-TIER SUPPLY-CHAIN PRICING TRENDS – PGM   166
6.22 SUB-TIER SUPPLY-CHAIN PRICING TRENDS – GERMANIUM   168
6.23 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT   170

7 SUPPLIER PROFILES  171
ADEKA CORPORATION ​
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER) ​
AZMAX CO., LTD ​
CITY CHEMICAL LLC ​
DNF CO., LTD ​
…AND 20+ MORE

FIGURES
FIGURE 1.1: METAL & HIGH-K PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT  15
FIGURE 1.2: WW MARKET SHARE – METAL & HIGH-K PRECURSORS 2023 (U$ 811 M)  18
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN  (2023)  28
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES   29
FIGURE 3.3: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI)  30
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS  31
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)  33
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION   34
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION  35
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES   36
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST  37
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND  39
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028  40
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US  41
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD  42
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING US$ M)
AND Y-O-Y CHANGE  43
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY
ROADMAP OVERVIEW  44
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW  45
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW  46
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024   47
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS  50
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)  51
FIGURE 4.1: METAL & HIGH-K PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT  56
FIGURE 4.2: MEMORY SUPPLY/DEMAND SITUATION 2024  57
FIGURE 4.3: WW MARKET SHARE – METAL & HIGH-K PRECURSORS 2023 (U$ 811 M)  58
FIGURE 4.4: REGIONAL MARKET SHARES  59
FIGURE 4.5: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES   67
FIGURE 4.6: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME  68
FIGURE 4.7: 3D NAND PROGRESSION     69
FIGURE 4.8: ETCH DEPTH PERFORMANCE  70
FIGURE 4.9: TOKYO ELECTRON’S NEW CRYOGENIC ETCH TOOL  70
FIGURE 4.10: DRAM MESH BY MICRON   72
FIGURE 4.11: IMEC CAPACITORLESS IGZO CELL FOR 3D STACKED DRAM  72
FIGURE 4.12: TRANSITION FROM 2D TO 3D DRAM   73
FIGURE 4.13: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS   74
FIGURE 4.14: GATE STRUCTURE ROADMAP  75
FIGURE 4.15: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP  76
FIGURE 4.16: LOGIC TRANSISTOR PROGRESSION   77
FIGURE 4.17: RIBBON FET   78
FIGURE 4.18: MONO LAYER NANO SHEETS CHANNELS   80
FIGURE 4.19: NANO IMPRINT LITHOGRAPHY PROCESS FLOW   81
FIGURE 4.20: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY   81
FIGURE 4.21: DIRECTED SELF-ASSEMBLY   82
FIGURE 4.22: DSA PATENT FILING BY COMPANY  83
FIGURE 4.23: DSA PATEN FILING SINCE 2023  83
FIGURE 4.24: WHAT IS PATTERN SHAPING?  84
FIGURE 4.25: REFINING EUV PATTERNING BY APPLIED MATERIALS   85
FIGURE 4.26: COMPLEMENTARY FET (CFET)  86
FIGURE 4.27: CFET IMPROVES PERFORMANCE IN TRACK SCALING  86
FIGURE 4.28: MONOLITHIC CFET PROCESS FLOW EXAMPLE  87
FIGURE 4.29: MCFET NEW FEATURE: MIDDLE DIELECTRIC ISOLATION  87
FIGURE 4.30: LOW TEMPERATURE GATE STACK OPTION EXAMPLES  88
FIGURE 4.31: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES  88
FIGURE 4.32: BSPDN ADVANTAGE: IR DROP REDUCTION  89
FIGURE 4.33: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION GAA-FET AND CFET     90
FIGURE 4.34: IMEC SUB-1NM TRANSISTOR ROADMAP, 3D-STACKED
CMOS 2.0 PLANS  91
FIGURE 4.35: PATENT FILING FOR MLD DEPOSITED EUV RESIST. SEARCH PERFORMED IN PATBASE  92
FIGURE 4.36: MOLECULAR LAYER DEPOSITION VS ATOMIC
LAYER DEPOSITION   93
FIGURE 4.37: INCREASING TREND OF ALD/MLD PUBLICATIONS  94
FIGURE 4.38: ADEKA ASD-HF PRECURSORS  98
FIGURE 4.39: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT  99
FIGURE 4.40: SPECIALTY/EMERGING METAL APPLICATIONS  100
FIGURE 4.41: SPECIALTY/EMERGING HIGH-K APPLICATIONS – NVM DRAM (MICRON IEDM2023)  101
FIGURE 4.42: 2023 METAL & HIGH-K REVENUE SHARE BY REGION  102
FIGURE 4.43: EHS ISSUES – HIGH-K: MINING IN CHINA  107
FIGURE 4.44: SK HYNIX’S RECYCLED AND RENEWABLE
MATERIALS TARGETS   108
FIGURE 5.1: 2023 PRECURSOR MATERIAL SUPPLIER MARKET
SHARE BY REVENUE  114
FIGURE 5.2: MERCK ELECTRONICS REVENUE 2022-2023
(M EUR), LEFT. SEMICONDUCTOR SOLUTIONS ANNUAL REVENUE FORECAST (M EUR), RIGHT.   117
FIGURE 5.3: AIR LIQUIDE ELECTRONICS REVENUE FORECAST (M EUR)  119
FIGURE 5.4: THE MS (MATERIAL SOLUTIONS) DIVISION OF
ENTEGRIS  REVENUE FORECAST  121
FIGURE 5.5: ADEKA REVENUE ELECTRONICS REVENUE FORECAST (100M JPY)  122
FIGURE 5.6: NEW ZIRCONIUM PRECURSOR CLASS   129
FIGURE 5.7: ADVANCES IN MOLYBDENUM THIN FILMS: NEW LIQUID PRECURSORS BOOST VAPOR PHASE DEPOSITION  130
FIGURE 6.1: FORMING GAS BLENDER CONFIGURATION  142
FIGURE 6.2: TOP COUNTRIES/REGIONS THAT SUPPLY VERSUM MATERIALS US LLC (PANJIVA APRIL 2024)  146
FIGURE 6.3: TOP COUNTRIES/REGIONS THAT SUPPLY AIR LIQUIDE AMERICA CORP. (PANJEIVA APRIL 2024)  147
FIGURE 6.4: TOP COUNTRIES/REGIONS THAT SUPPLY H.C. STARCK INC. (USA)  148
FIGURE 6.5: PRICE TREND IN COBALT  155
FIGURE 6.6: HAFNIUM 5-YEAR PRICING  157
FIGURE 6.7: GALLIUM PRICE, 5 YEAR HISTORICAL  159
FIGURE 6.8: RUTHENIUM AND PLATINUM, 5-YEAR HISTORICAL PRICING  167
FIGURE 6.9: GERMANIUM PRICE, 5-YEAR HISTORICAL  169

TABLES
TABLE 1.1: METAL AND HI-K PRECURSORS REVENUES AND GROWTH RATES  15
TABLE 1.2: ESTIMATED METAL AND HIGH-K PRECURSOR MARKET SHARE BY SUPPLIER 2023  18
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES  26
TABLE 3.2: WORLD BANK ECONOMIC OUTLOOK (JANUARY 2024)   27
TABLE 3.3: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS  34
TABLE 3.4: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023  38
TABLE 4.1: PRECURSORS REVENUE AND GROWTH RATES  53
TABLE 4.2: METAL AND HI-K PRECURSORS REVENUES AND GROWTH RATES  56
TABLE 4.3: ESTIMATED METAL AND HIGH-K PRECURSOR MARKET SHARE BY SUPPLIER 2023  58
TABLE 4.4: METAL & HIGH-K PRECURSOR MARKET REGIONAL ASSESSMENT 2023  59
TABLE 4.5: OVERVIEW OF ANNOUNCED 2023/2024 MATERIALSUPPLIER INVESTMENTS
62
TABLE 4.6: LEADING EDGE LOGIC DESCRIPTIONS BY NODE (TSMC, INTEL)  78
TABLE 4.7: SELECTIVE DEPOSITION – SELECTIVELY DEPOSITED MATERIALS  97
TABLE 4.8: REGIONAL PRECURSOR MATERIAL MARKETS  103
TABLE 4.9: REGIONAL PRECURSOR MATERIAL MARKETS, CONTINUED  104
TABLE 5.1: MERCK QUARTER FINANCIALS  115
TABLE 5.2: AIR LIQUIDE CURRENT QUARTER FINANCIALS  118
TABLE 5.3: ENTEGRIS SUPPLIER CURRENT QUARTER FINANCIALS   120
TABLE 6.1: CVD AND ALD PRECURSOR  145
TABLE 6.2: ORIGIN OF MINERALS USED TO MAKE PRECURSORS   153
TABLE 6.3: COBALT MINING AND PRODUCTION BY LOCATION  154
TABLE 6.4: ZIRCONIUM AND HAFNIUM MINERAL PRODUCTION BY LOCATION  156
TABLE 6.5: GALLIUM MINERAL PRODUCTION DESCRIPTION AND DEPENDENCIES   158
TABLE 6.6: ALUMINUM MINERAL REFINING AND PRODUCTION BY LOCATION   160
TABLE 6.7: TITANIUM ORE (ILMENITE AND RUTILE) PRODUCTION LOCATIONS   161
TABLE 6.8: TUNGSTEN ORE PRODUCTION BY LOCATION   162
TABLE 6.9: MOLYBDENUM PRODUCTION AND IMPORT AND EXPORTS  163
TABLE 6.10: MOLYBDENUM PRODUCTION DESCRIPTIONS   163
TABLE 6.11: NIOBIUM AND TANTALUM PRODUCTION BY LOCATION   164
TABLE 6.12: RARE EARTHS PRODUCTION BY LOCATION , I.E. LANTHANUM  165
TABLE 6.13: PGM PRODUCTION BY LOCATION    166
TABLE 6.14: GERMANIUM APPLICATIONS BY PERCENTAGE VOLUME  168