Techcet

Chapter from the SEMI Global Semiconductor Packaging Materials Outlook Report

•Provides detailed market analysis including market size, forecasts, and market share of the global bonding wire market.
• Covered information includes revenues & units, and a regional market analysis
• Forecasts for bonding wire units and revenues out to 2028
• Information for supply-chain managers, procurement teams, marketing managers, and financial analysts
• Includes supply-chain, market, and technical trends information impacting the bonding wire industry.
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Description
Table of Contents

Description

Chapter from the SEMI Global Semiconductor Packaging Materials Outlook Report

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EXECUTIVE SUMMARY     
                                  
1 INTRODUCTION
1.1 Methodology
1.2 Assumptions
1.3 Report Organization                                                  

5 BONDING WIRE 
5.1 Bonding Wire Market Trends
5.2 Bonding Wire Markets
5.3 Bonding Wire Market Forecast
5.4 Bonding Wire Supply