Description
This report covers the CMP Consumables market (specifically CMP slurry and pads) and supply-chain for those consumables used in semiconductor device fabrication. The report contains data and analysis from TECHCET’s data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. CMP slurries and pads are a critical in semiconductor manufacturing as process integration requires the fabrication of thin and uniformly flat layers to build up device structures across the semiconductor wafers. The number of CMP process steps continue to increase with each generation of new device technology. New device technology is characterized by more layers, new materials, tighter process control requirements, and new techniques for advanced packaging. These manufacturing challenges require new developments in CMP slurries and pads. This report looks at the market drivers, slurry and pad forecasts by application, market shares, abrasive suppliers, and includes a special focus on advanced packaging.
• Contains information on the semiconductor related CMP Pads & Slurry market dynamics
• Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
• Includes supply-chain, market, and technical trends information relating to CMP pads, slurry, and disks as used for semiconductor device manufacturing.
• Covers information about key CMP Pads & Slurry suppliers, issues/trends in the electronics material supply chain, estimates on supplier market share, and forecast for the electronics material segments
• Includes 3 Quarterly Updates, with updates on market trends and forecasts from the analyst
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