Description
This report covers the CMP Consumables market (specifically CMP slurry and pads) and supply-chain for those consumables used in semiconductor device fabrication. The report contains data and analysis from TECHCET’s data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. CMP slurries and pads are a critical in semiconductor manufacturing as process integration requires the fabrication of thin and uniformly flat layers to build up device structures across the semiconductor wafers. The number of CMP process steps continue to increase with each generation of new device technology. New device technology is characterized by more layers, new materials, tighter process control requirements, and new techniques for advanced packaging. These manufacturing challenges require new developments in CMP slurries and pads. This report looks at the market drivers, slurry and pad forecasts by application, market shares, abrasive suppliers, and includes a special focus on advanced packaging. To download full table of contents: click here.
• Contains information on the semiconductor related CMP Pads & Slurry market dynamics
• Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
• Includes supply-chain, market, and technical trends information relating to CMP pads, slurry, and disks as used for semiconductor device manufacturing.
• Covers information about key CMP Pads & Slurry suppliers, issues/trends in the electronics material supply chain, estimates on supplier market share, and forecast for the electronics material segments
• Includes 3 Quarterly Updates, with updates on market trends and forecasts from the analyst
• Includes Single User License – provides 1 portal access login to techcet.com for one person, using 2FA (two-factor authentication). For Multi-User License information, click here.
TECHCET Reports can be Included with CMC or DSS Membership, which includes 1:1 meeting time with the analyst – Click Here for Membership Info!
For custom reports and consulting, email us here.
Table of Contents
1 EXECUTIVE SUMMARY
1.1 CMP PAD AND SLURRY MARKET OVERVIEW
1.2 CMP SLURRY AND PAD 5-YEAR REVENUE FORECAST BY CONSUMABLE SEGMENT
1.3 CMP SLURRY AND PAD 5-YEAR REVENUE FORECAST BY APPLICATION
1.4 CMP SLURRY VOLUME AND PAD UNIT USAGE FORECAST BY REGION
1.5 5-YEAR CMP SLURRY REVENUE FORECAST BY APPLICATION
1.6 5-YEAR CMP PAD REVENUE FORECAST BY APPLICATION
1.7 TOTAL CMP SLURRY MARKET SHARE BY SUPPLIER
1.8 TOTAL CMP PAD MARKET SHARE BY SUPPLIER
1.9 ADVANCED LOGIC TRANSISTOR TECHNOLOGY ROADMAP
1.10 EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS
1.11 ANALYST ASSESSMENT OF CMP SLURRY AND PADS
2 SCOPE, PURPOSE AND METHODOLOGY
2.1 SCOPE
2.2 PURPOSE
2.3 METHODOLOGY
2.4 OVERVIEW OF OTHER TECHCET CMR™ OFFERINGS
3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK
3.1 WORLDWIDE ECONOMY AND OUTLOOK
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
3.1.2 SEMICONDUCTOR SALES GROWTH
3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT
3.2.1 FACTORS IMPACTING ELECTRONIC SYSTEMS OUTLOOK
3.2.2 PC OUTLOOK
3.2.3 SMARTPHONE OUTLOOK
3.2.4 AUTOMOTIVE INDUSTRY OUTLOOK
3.2.5 SERVERS / IT MARKET
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
3.3.2 PUBLIC FUNDS STIMULATING PRIVATE INVESTMENTS IN EXPANSION ACROSS THE GLOBE
3.3.3 SEMICONDUCTOR SUPPLY CHAIN ANNOUNCED EXPANSIONS IN THE US
3.3.4 EQUIPMENT SPENDING TRENDS
3.3.5 TECHNOLOGY ROADMAPS
3.4 POLICY & TRADE TRENDS AND IMPACT
3.5 SEMICONDUCTOR MATERIALS OVERVIEW
3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2029
3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028
4 CMP SLURRY & PAD CONSUMABLES MARKET TRENDS
4.1 OVERALL CMP PAD AND SLURRY MARKET
4.1.1 CMP SLURRY AND PAD 5-YEAR REVENUE FORECAST BY CONSUMABLE SEGMENT
4.1.2 CMP SLURRY AND PAD 5-YEAR REVENUE FORECAST BY APPLICATION
4.1.3 2024 REGIONAL CMP SLURRIES AND PADS MARKET
4.1.4 REGIONAL CMP SLURRY AND PAD MARKET OUTLOOK
4.2 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS – ADVANCED LOGIC AND MEMORY
4.2.1 ADVANCED LOGIC TRANSISTOR TECHNOLOGY ROADMAP
4.2.2 NEW ADVANCED LOGIC TECHNOLOGY TRENDS –GAA + BACKSIDE POWER DELIVERY (BPD)
4.2.3 NEW ADVANCED LOGIC TECHNOLOGY TRENDS – BACKSIDE POWER DELIVERY (BPD)
4.2.4 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS
4.2.5 TECHNICAL DRIVERS / 3D NAND STACKING
4.2.6 TECHNICAL DRIVERS / 3D NAND STACKING
4.3 TECHNICAL TRENDS IN ADVANCED PACKAGING
4.3.1 TECHNICAL TRENDS IN ADVANCED PACKAGING – HYBRID OR DIRECT CU BONDING (DCB)
4.3.2 TECHNICAL TRENDS IN ADVANCED PACKAGING – HYBRID OR DIRECT CU BONDING (DCB)
4.3.3 TECHNICAL TRENDS IN ADVANCED PACKAGING – HYBRID OR DIRECT CU BONDING (DCB)
4.3.4 MARKET GROWTH TRENDS IN ADVANCED PACKAGING
4.4 TECHNICAL TRENDS IN COMPOUND SEMICONDUCTOR
4.5 EHS ISSUES FOR NEW MATERIALS
4.5.1 EHS ISSUES FOR SLURRY DISPOSAL, RECYCLING AND RECLAIM
4.6 TRADE/LOGISTICS ISSUES
4.7 ANALYST ASSESSMENT OF CMP SLURRY AND PAD MARKET TRENDS
5 CMP SLURRY SUPPLY-SIDE MARKET LANDSCAPE
5.1 5-YEAR CMP SLURRY VOLUME USAGE FORECAST BY APPLICATION
5.2 CMP SLURRY VOLUME USAGE FORECAST BY REGION
5.3 5-YEAR CMP SLURRY REVENUE FORECAST BY APPLICATION
5.4 REGIONAL CMP SLURRY MARKET SHARE
5.5 TOTAL CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.1 LEADING CMP SLURRY MARKET SHARE SUPPLIERS BY REVENUE
5.5.2 OXIDE (CERIA) CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.3 HKMG (METAL AND OXIDE) CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.4 POLYSILICON CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.5 OXIDE (SILICA) CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.6 TUNGSTEN CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.7 CU BULK CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.8 CU BARRIER CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.9 NEW METALS (CO, MO, RU, ETC.) CMP SLURRY MARKET SHARE BY SUPPLIER
5.5.10 CU BACKSIDE POWER (BPD) CMP SLURRY MARKET SHARE BY SUPPLIER
5.6 CURRENT QUARTER - SUPPLIERS’ ACTIVITIES & REPORTED REVENUES
5.7 M&A ACTIVITY AND PARTNERSHIPS
5.8 PLANT CLOSURES – NONE IDENTIFIED
5.9 NEW ENTRANTS – NONE IDENTIFIED
5.10 SUPPLIERS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS
5.11 CMP SLURRY PRICING TRENDS
5.12 TECHCET ANALYST ASSESSMENT OF CMP SLURRY SUPPLIERS
6 CMP PAD SUPPLY-SIDE MARKET LANDSCAPE
6.1 5-YEAR CMP PAD UNIT USAGE FORECAST BY APPLICATION
6.2 CMP PAD UNIT USAGE FORECAST BY REGION
6.3 5-YEAR CMP PAD REVENUE FORECAST BY APPLICATION
6.4 5-YEAR CMP PAD REVENUE FORECAST BY WAFER SIZE
6.5 TOTAL CMP PAD MARKET SHARE BY SUPPLIER
6.6 NEW ENTRANTS
6.7 CMP PAD LOGISTICS ISSUES, M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS
6.8 CMP PAD PRICING TRENDS
6.9 PAD SUPPLIER TECHCET ANALYST ASSESSMENT
7 MATERIAL SUB-TIER SUPPLY - ABRASIVES
7.1 CMP PAD PRICING TRENDS
7.2 VERTICALLY INTEGRATED SLURRY SUPPLIERS
7.3 RAW SUPPLY-CHAIN DISRUPTORS
7.4 RAW MATERIALS M&A ACTIVITY
7.5 ABRASIVE SUPPLY-CHAIN EHS AND LOGISTICS ISSUES
7.6 ABRASIVE SUPPLY-CHAIN “NEW” ENTRANTS OR PLANT CLOSURES
7.7 ABRASIVE SUPPLY-CHAIN PRICING TRENDS
7.8 SUB-TIER SUPPLY CHAIN: SLURRY ABRASIVE SUPPLY NOTABLES
7.9 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT
8 SUPPLIER PROFILES
ACE NANOCHEM
ANJI MICRO SHANGHAI
ASAHI GLASS
BASF
DONGJIN SEMICHEM
AND MORE...
FIGURES
FIGURE 1.1: FORECASTED 2025 MARKET SIZE
FIGURE 1.2: CMP SLURRY AND PAD REVENUE FORECAST BY SEGMENT
FIGURE 1.3: CMP SLURRY AND PAD REVENUE FORECAST BY SEGMENT
FIGURE 1.4: 2025 SLURRY VOLUME AND PAD UNIT USAGE FORECAST BY REGION
FIGURE 1.5: 2023 – 2029 SLURRY REVENUE FORECAST BY APPLICATION
FIGURE 1.6: 2023 – 2029 PAD REVENUE FORECAST BY APPLICATION
FIGURE 1.7: 2024 TOTAL CMP SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 1.8: 2024 TOTAL CMP PAD SUPPLIER MARKET SHARE BY REVENUE
FIGURE3.1: HISTORICAL AND FORECASTED GDP GROWTH
FIGURE 3.2: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2024)
FIGURE 3.3: WORLDWIDE SEMICONDUCTOR SALES ($B)
FIGURE 3.4: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI) MOMENTUM TRACKER
FIGURE 3.5: 2024 SEMICONDUCTOR CHIP APPLICATIONS
FIGURE 3.6: SMARTPHONE SHIPMENTS, WW ESTIMATES
FIGURE 3.7: GLOBAL LIGHT VEHICLE PRODUCTION FORECAST
FIGURE 3.8: US EV RETAIL SHARE FORECAST
FIGURE 3.9: AUTOMOTIVE SEMICONDUCTOR CONTENT BY DEVICE TYPE
FIGURE 3.10: AI INFRASTRUCTURE VALUE FORECAST
FIGURE 3.11: SCALE OF TODAY’S AI-CENTRIC DATA CENTERS
FIGURE 3.12: TSMC PHOENIX FAB INVESTMENT TO EXCEED US $65B
FIGURE 3.13: ESTIMATED GLOBAL FAB INVESTMENT 2024-2029
FIGURE 3.14: ANNOUNCED PUBLIC STIMULUS AND RESPECTIVE SEMICONDUCTOR CHIP MANUFACTURING REGIONS
FIGURE 3.15: SEMICONDUCTOR SUPPLY CHAIN EXPANSIONS WITHIN THE US ANNOUNCED MAY 2020 – AUGUST 2024
FIGURE 3.16: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M)
FIGURE 3.17: TECHCET WAFER START FORECAST BY NODE SEGMENTS MILLIONS OF 200MM EQUIVALENTS PER YEAR
FIGURE 3.18: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)
FIGURE 4.1: FORECASTED 2025 MARKET SIZE
FIGURE 4.2: CMP SLURRY AND PAD REVENUE FORECAST BY SEGMENT
FIGURE 4.3: CMP SLURRY AND PAD REVENUE FORECAST BY APPLICATION
FIGURE 4.4: SLURRY AND PAD REVENUE BY HQ REGION
FIGURE 4.5 CMP STEPS FOR ADVANCED NODES
FIGURE 4.6: BENEFITS OF GAA + BACKSIDE POWER DELIVERY
FIGURE 4.7: EXAMPLES OF VARYING BACKSIDE POWER IMPLEMENTATION SCHEMES
FIGURE 4.8: BACKSIDE POWER IMPLEMENTATION
FIGURE 4.9: COMPARISON OF METALS RESISTIVITIES BY DIMENSION
FIGURE 4.10: 3D NAND CROSS-SECTION
FIGURE 4.11: NUMBER OF CMP STEPS FOR MEMORY TECHNOLOGY NODES
FIGURE 4.12: KEY TRENDS IN ADVANCED PACKAGING
FIGURE 4.13: KEY TRENDS IN ADVANCED PACKAGING
FIGURE 4.14: ADVANCED PACKAGING WAFER BONDING HISTORY
FIGURE 4.15: HYBRID BONDING FLOW PROGRESSION
FIGURE 4.16: CMP OPPORTUNITIES DIE WAFER (D2W) AND WAFER TO WAFER (W2W) HYBRID BONDING
FIGURE 4.17: GROWTH IN ADVANCED PACKAGING
FIGURE 4.18: SILICON CARBIDE WAFER USAGE BY SIZE AND YEAR
FIGURE 5.1: 2023 – 2029 SLURRY VOLUME FORECAST BY APPLICATION
FIGURE 5.2: 2025 SLURRY VOLUME USAGE FORECAST BY REGION
FIGURE 5.3: 2023 – 2029 SLURRY REVENUE FORECAST BY APPLICATION
FIGURE 5.4: 2024 SUPPLIER MARKET SHARE BY HQ REGION
FIGURE 5.5: 2024 TOTAL CMP SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.6: 2024 OXIDE (CERIA) SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.7: 2024 HKMG SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.8: 2024 POLYSILICON SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.9: 2024 OXIDE (SILICA) SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.10: 2024 TUNGSTEN SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.11: 2024 CU BULK SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.12: 2024 CU BARRIER SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.13: 2024 NEW METALS SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 5.14: 2024 CU BACKSIDE POWER SLURRY SUPPLIER MARKET SHARE BY REVENUE
FIGURE 6.1: 2023 – 2029 PAD USAGE FORECAST BY APPLICATION
FIGURE 6.2: 2025 PAD UNIT USAGE FORECAST BY REGION
FIGURE 6.3: 2023 – 2029 PAD REVENUE FORECAST BY APPLICATION
FIGURE 6.4: 2023 – 2029 PAD REVENUE FORECAST BY WAFER SIZE
FIGURE 6.5: 2024 TOTAL CMP PAD SUPPLIER MARKET SHARE BY REVENUE
FIGURE 7.2: SLURRY POTENTIAL HAZARDS (SDS)
TABLES
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
TABLE 3.2: INITIALLY ANNOUNCED US RECIPROCAL TARIFF SCHEDULE, BY COUNTRY
TABLE 3.3: WORLDWIDE PC FORECAST BY SEGMENT
TABLE 3.4: IT MARKET SPENDING FORECAST, 2025
TABLE 4.1: REGIONAL CMP SLURRY AND PAD MARKETS
TABLE 4.1 REGIONAL CMP SLURRY AND PAD MARKETS, CONT’D
TABLE 4.2: SILICON CARBIDE WAFER MANUFACTURERS AND CONSUMABLES SUPPLIERS
TABLE 5.1: 2024 SLURRY MARKET LEADERS AND TAM BY APPLICATION
TABLE 5.2: MOST RECENT QUARTERLY SUPPLIER SALES OF TOP CMP SLURRY AND/OR PAD SUPPLIERS (IN LOCAL REPORTING CURRENCY)
TABLE 7.1: ABRASIVE SUPPLIERS
TABLE 7.2: VERTICALLY INTEGRATED SLURRY SUPPLIERS
TABLE 7.3: GENERAL 2024 ABRASIVE SUPPLIER RANKING
