CMP Slurry & Pads Market Report CMR 2023-2024 (Single User License)

$8,900.00

• Contains information on the semiconductor related CMP Pads & Slurry market dynamics
• Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
• Includes supply-chain, market, and technical trends information relating to CMP pads, slurry, and disks as used for semiconductor device manufacturing.
• Covers information about key CMP Pads & Slurry suppliers, issues/trends in the electronics material supply chain, estimates on supplier market share, and forecast for the electronics material segments
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Description

This report covers the CMP Consumables market (specifically CMP slurry and pads) and supply-chain for those consumables used in semiconductor device fabrication. The report contains data and analysis from TECHCET’s data base and Sr. Analyst experience, as well as that developed from primary and secondary market research. CMP slurries and pads are a critical in semiconductor manufacturing as process integration requires the fabrication of thin and uniformly flat layers to build up device structures across the semiconductor wafers. The number of CMP process steps continue to increase with each generation of new device technology.​ New device technology is characterized by more layers, new materials, tighter process control requirements, and new techniques for advanced packaging. These manufacturing challenges require new developments in CMP slurries and pads. This report looks at the market drivers, slurry and pad forecasts by application, market shares, abrasive suppliers, and includes a special focus on advanced packaging.​

 

Featured Press Release on CMP Consumables Market Updates and Report Highlights:

 

Table of Contents:

Click here for a PDF download of the full table of contents

1 EXECUTIVE SUMMARY 9 
1.1 CMP CONSUMABLES MARKET OVERVIEW				10
1.2 CMP CONSUMABLES REVENUE TRENDS 				11
1.3 MARKET TRENDS IMPACTING CMP CONSUMABLES OUTLOOK		12 
1.4 YEAR 2022 IN REVIEW 					13
1.5 CMP CONSUMABLES FORECASTS BY MATERIAL SEGMENT 		14
1.5.1 CMP SLURRIES 5-YEAR REVENUE FORECAST 			15
1.5.2 CMP PADS 5-YEAR REVENUE FORECAST 				16
1.6 TECHNOLOGY TRENDS 						17
1.6.1  BACKSIDE TECHNOLOGY TRENDS				18
1.7  SLURRY SUPPLIER COMPETITIVE LANDSCAPE 			19
1.8  PAD SUPPLIER COMPETITIVE LANDSCAPE 			20
1.9  ANALYST ASSESSMENT 					21
1.9.1  ANALYST ASSESSMENT, CONTINUED				22

2 SCOPE, PURPOSE AND METHODOLOGY  23 
2.1 SCOPE 							24
2.2 PURPOSE 							25
2.3 METHODOLOGY 						26
2.4 OVERVIEW OF OTHER TECHCET CMR™ REPORTS 			27

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK 28  
3.1 WORLDWIDE ECONOMY 						29
3.1.1  SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY	31 
3.1.2 SEMICONDUCTOR SALES GROWTH				32
3.1.3 TAIWAN MONTHLY SALES TRENDS				33
3.1.4 UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023 – SLOWER TO 
NEGATIVE SEMICONDUCTOR  REVENUE GROWTH EXPECTED			34
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT 			35
3.2.1 SMARTPHONES						36
3.2.2 PC UNIT SHIPMENTS 					37
3.2.3  SERVERS / IT MARKET					40
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION 		41
3.3.1 FAB EXPANSION ANNOUNCEMENT SUMMARY			42
3.3.2 WW FAB EXPANSION DRIVING GROWTH 				44
3.3.3 EQUIPMENT SPENDING TRENDS					45
3.3.4 TECHNOLOGY ROADMAPS					46
3.3.5 FAB INVESTMENT ASSESSMENT					47
3.4 POLICY & TRADE TRENDS AND IMPACT 				48
3.5 SEMICONDUCTOR MATERIALS OVERVIEW 				49
3.5.1 COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?	50
3.5.2 LOGISTICS ISSUES EASED DOWN 				51
3.5.3 TECHCET WAFER STARTS FORECAST THROUGH 2027		52
3.5.4 TECHCET’S MATERIAL FORECAST				53

4 CMP CONSUMABLES MARKET TRENDS   54
4.1 CMP CONSUMABLES MARKET TRENDS 				55
4.2 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS 	56
4.2.1 3D NAND ROADMAP						58
4.2.2 3D NAND STACKING						59
4.2.3 TECHNICAL TRENDS IN ADVANCED PACKAGING			60
4.2.4  CMP FOR TSV						62
4.3 TECHNICAL TRENDS IN COMPOUND SEMICONDUCTOR 			63
4.3.1 CMP OF SILICON CARBIDE 					64
4.3.2 SILICON CARBIDE DEFECTS					65
4.3.3 CMP CHALLENGES IN SILICON CARBIDE				66
4.4 REGIONAL TRENDS 						67
4.4.1 REGIONAL TRENDS AND DRIVERS				68
4.4.2 REGIONAL TRENDS AND DRIVERS, CONTINUED			69
4.5 EHS AND LOGISTIC ISSUES 					70
4.5.1 EHS ISSUES FOR NEW MATERIALS				71
4.5.2 LOGISTIC ISSUES 						72
4.5.3 EHS ISSUES FOR SLURRY DISPOSAL, RECYCLING AND RECLAIM	73

5 CMP SLURRY SUPPLIER MARKET SHARES	74
5.1 CMP SLURRIES 5-YEAR REVENUE FORECAST 			75
5.2 CMP SLURRIES 5-YEAR FORECAST BY UNITS 			76
5.3 CMP SLURRY MARKET LEADERS 					77
5.3.1 TOTAL SLURRY MARKET SHARE					78
5.3.2 OXIDE (CERIA) SLURRY MARKET				79
5.3.3 HKMG SLURRY MARKET					81
5.3.4 POLYSILICON SLURRY MARKET					83
5.3.5 OXIDE (SILICA) SLURRY MARKET				85
5.3.6 TUNGSTEN SLURRY MARKET					86
5.3.7 CU BULK SLURRY MARKET					87
5.3.8 COPPER BARRIER SLURRY MARKET				88
5.3.9 NEW METALS SLURRY MARKET					90
5.3.10 CU BURIED POWER RAIL (BPR) SLURRY MARKET			91
5.4 CMP SLURRY M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS	92 
5.5 CMP SLURRY PLANT CLOSURES 					93
5.6 NEW ENTRANTS 						94
5.7 SUPPLIERS OR PARTS/PRODUCT LINE THAT ARE AT RISK 
OF DISCONTINUATIONS 						95
5.8 CMP SLURRY PRICING TRENDS 					96
5.9 TECHCET ANALYST ASSESSMENT OF CMP SLURRY MARKET 		97

6 CMP PAD MARKET STATISTICS & FORECASTS 		98
6.1 CMP PADS 5-YEAR REVENUE FORECAST 				99
6.1.1 CMP PADS 5-YEAR REVENUE FORECAST				100
6.2 CMP PADS 5-YEAR FORECAST BY UNITS 				101
6.3 CMP PAD PLANT CLOSURES 					102
6.4 NEW ENTRANTS 						103
6.5 SUPPLIERS OR PARTS/PRODUCT LINE THAT ARE AT RISK 
OF DISCONTINUATIONS 						104
6.6 CMP PAD M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS 	105
6.7 CMP PAD PRICING TRENDS 					106
6.8 TECHCET ANALYST ASSESSMENT 					107
6.8 TECHCET ANALYST ASSESSMENT, CONTINUED 			108

7 MATERIAL SUB-TIER SUPPLY 	109
7.1 ABRASIVE SUPPLIERS 						110
7.2 VERTICALLY INTEGRATED SUPPLIERS 				111
7.3  RAW SUPPLY CHAIN DISRUPTORS 				112
7.4 RAW MATERIALS M&A ACTIVITY 					113
7.5 ABRASIVE SUPPLY-CHAIN EHS AND LOGISTICS ISSUES 		114
7.6 ABRASIVE SUPPLY CHAIN “NEW” ENTRANTS 			115
7.7 ABRASIVE SUPPLY-CHAIN PLANTS UPDATES-NEW 			116
7.8 ABRASIVE SUPPLY-CHAIN PLANT CLOSURES 			117
7.9 ABRASIVE SUPPLY-CHAIN PRICING TRENDS 			118
7.10 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT 		119

8 SUPPLIER PROFILES	120
NANOPHASE TECHNOLOGIES CORPORATION 
3M COMPANY 
ABRASIVE TECHNOLOGY
ACE NANOCHEM 
ANJI MICRO SHANGHAI 
ASAHI GLASS
...and 20+ more

9 APPENDIX	329
APPENDIX A:  CMP CONSUMABLES OVERVIEW 				330
APPENDIX B:  TECHNICAL TRENDS IN SIC  				332
APPENDIX C:  PAD MANUFACTURING COST DRIVERS 			338

TABLE OF FIGURES 
FIGURE1: FORECASTED 2023 MARKET SIZE				10
FIGURE 2: CMP CONSUMABLES FORECAST				11
FIGURE 3: CMP STEPS FOR ADVANCED DEVICES			12
FIGURE 4: 2022 CMP CONSUMABLES REVENUE				13
FIGURE 5: CMP CONSUMABLES REVENUE BY APPLICATION		14
FIGURE 6: CMP SLURRY REVENUE BY APPLICATION			15
FIGURE 7: CMP PAD REVENUE BY APPLICATION			16
FIGURE 8: CMOS TECHNOLOGY ROADMAP				17
FIGURE 9: LIMITATIONS OF FS-PDN					18
FIGURE 10: 2D DEVICE ARCHITECTURE EVOLUTION			18
FIGURE 11: 2022 SLURRY SUPPLIER MARKET SHARES			19
FIGURE 12: 2022 PAD SUPPLIER MARKET SHARES			20
FIGURE 13: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY 
CHAIN (2022)							31
FIGURE 14: WORLDWIDE SEMICONDUCTOR SALES 			32
FIGURE 15: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY 
INDEX (TTSI)*							33
FIGURE 16: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS	34
FIGURE 17: 2022 SEMICONDUCTOR CHIP APPLICATIONS			35
FIGURE 18: MOBILE PHONE SHIPMENTS WW ESTIMATES 			36
FIGURE 19: WORLDWIDE PC AND TABLET FORECAST			37
FIGURE 20: ELECTRIFICATION TREND BY WORLD REGION 		38
FIGURE 21: SEMICONDUCTOR AUTOMOTIVE PRODUCTION			39
FIGURE 22: TSMC PHOENIX INVESTMENT ESTIMATED WILL BE US $40 B	41
FIGURE 23: CHIP EXPANSIONS 2022-2027 US$366 B			42
FIGURE 24: SEMICONDUCTOR CHIP MANUFACTURING REGIONS 
OF THE WORLD							44
FIGURE 25: GLOBAL TOTAL EQUIPMENT SPENDING BY SEGMENT (US$ B)	45
FIGURE 26: OVERVIEW OF ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP 46
FIGURE 27: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST 
RENDERING (ON BOTTOM)						47
FIGURE 28: EUROPE CHIP EXPANSION UPSIDE				50
FIGURE 29: PORT OF LA						51
FIGURE 30: TECHCET WAFER START FORECAST BY NODE SEGMENTS**	52
FIGURE 31: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK		53
FIGURE 32: CMP CONSUMABLES REVENUE FOR 2022			55
FIGURE 33: NUMBER OF CMP STEPS FOR ADVANCED TECHNOLOGY NODES	56
FIGURE 34: COMPARISON OF METALS RESISTIVITIES BY DIMENSION	57
FIGURE 35: 14NM VS. 7NM METALLIZATION TECHNIQUES		57
FIGURE 36: 3D NAND ROADMAP BY NODE				58
FIGURE 37: STACKING FOR 3D NAND					59
FIGURE 38: CMP OPPORTUNITIES IN ADVANCED PACKAGING		60
FIGURE 39: KEY TRENDS IN ADVANCED PACKAGING 			61
FIGURE 40: CMP OPPORTUNITIES IN ADVANCED PACKAGING		62
FIGURE 41: SILICON CARBIDE-BASED POWER DEVICE 			64
FIGURE 42: DEFECTS IN SILICON CARBIDE SUBSTRATES 
AND EPI WAFERS 							65
FIGURE 43: SILICON CARBIDE DEFECTS 				65
FIGURE 44: BATCH POLISH VS. CMP					66
FIGURE 45: SLURRY AND PAD REVENUE BY HQ REGION			67
FIGURE 46: CMP SLURRY REVENUE BY APPLICATION			75
FIGURE 47: FORECASTED SLURRY VOLUME DEMAND			76
FIGURE 48: SLURRY SUPPLIER MARKET SHARES IN 2022		78
FIGURE 49: OXIDE (CERIA) SLURRY MARKET SHARES			79
FIGURE 50: STI CMP PROCESS					80
FIGURE 51: HKMG/FRONT-END SLURRY MARKET SHARES			81
FIGURE 52: POLYSILICON SLURRY MARKET SHARES			83
FIGURE 53: MEMS CMP CROSS SECTION				84
FIGURE 54: OXIDE (SILICA) SLURRY MARKET SHARES			85
FIGURE 55: TUNGSTEN SLURRY MARKET SHARES			86
FIGURE 56: CU-BULK SLURRY MARKET SHARES				87
FIGURE 57: CU-BARRIER CMP SLURRY MARKET SHARE			88
FIGURE 58: NEW METALS SLURRY MARKET SHARES			90
FIGURE 59: CU BPR SLURRY MARKET SHARES				91
FIGURE 60: CMP PAD REVENUE BY APPLICATION			99
FIGURE 61: CMP PAD REVENUE BY WAFER SIZE			100
FIGURE 62: FORECASTED PAD USAGE					101
FIGURE 63: CMP FOR IC MANUFACTURING PROCESS			331
FIGURE 64: IC1000 LIKE PAD CROSS-SECTION			340
FIGURE 65: IC1000 SEM CROSS-SECTION				341

TABLES 
TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES*			29
TABLE 2: IMF ECONOMIC OUTLOOK* 					30
TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES 
MARKET SPENDING 2022						40
TABLE 4 & 5:  SILICON CARBIDE WAFER MANUFACTURERS AND 
CONSUMABLES SUPPLIERS						63
TABLE 6: REGIONAL WAFER MARKETS					68
TABLE 7: REGIONAL WAFER MARKETS BY SUPPLIER HEADQUARTER REGION	69
TABLE 8: 2022 SLURRY MARKET LEADERS AND TAM BY APPLICATION	77
TABLE 9: PAD SUPPLIERS						108
TABLE 10: ABRASIVE SUPPLIERS					110
TABLE 11: VERTICALLY INTEGRATED SUPPLIERS			111
TABLE 12: PHYSICAL AND ELECTRICAL PROPERTY COMPARISON OF 
SI AND SIC							333

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