Description
Chapter from the SEMI Global Semiconductor Packaging Materials Outlook Report
• Provides detailed market analysis including market size, forecasts, and market share of the global die attach materials market.
• Covered information includes revenues & units, and a regional market analysis
• Forecasts for die attach materials and revenues out to 2028
• Information for supply-chain managers, procurement teams, marketing managers, and financial analysts
• Includes supply-chain, market, and technical trends information impacting the die attach materials industry.
• Includes Single User License – provides 1 portal access login to techcet.com for one person, using 2FA (two-factor authentication). For Multi-User License information, click here.
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