Description

This report covers the Metal Chemicals market trends and supply-chain as it applied to Advanced Packaging (wafer level) and Semiconductor Device Manufacturing (damascene process). Included are forecasts for copper plating and additives, market shares, technical trends, and supplier profiles. Also included in the appendix is a supplier product comparison table of publicly available information on plating products used for advanced packaging.

•Provides strategic market and supply-chain analysis on metal plating chemicals used for semiconductor manufacturing including advanced packaging (wafer level) and semiconductor device manufacturing (damascene process) applications.
•Covers information about forecasts for copper plating and additives, market shares, technical trends, and supplier profiles.
• Includes 3 Quarterly Updates, with updates on market trends and forecasts from the analyst
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