Metal Chemicals for FE & Advanced Packaging Market Report CMR 2024-2025 (Single User License)

•Provides strategic market and supply-chain analysis on metal plating chemicals used for semiconductor manufacturing including advanced packaging (wafer level) and semiconductor device manufacturing (damascene process) applications.
•Covers information about forecasts for copper plating and additives, market shares, technical trends, and supplier profiles.
• Includes 3 Quarterly Updates, with updates on market trends and forecasts from the analyst
• Includes Single User License – provides 1 portal access login to techcet.com for one person, using 2FA (two-factor authentication). For Multi-User License information, click here.

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Description

This report covers the Metal Chemicals market trends and supply-chain as it applied to Advanced Packaging (wafer level) and Semiconductor Device Manufacturing (damascene process). Included are forecasts for copper plating and additives, market shares, technical trends, and supplier profiles. Also included in the appendix is a supplier product comparison table of publicly available information on plating products used for advanced packaging.

•Provides strategic market and supply-chain analysis on metal plating chemicals used for semiconductor manufacturing including advanced packaging (wafer level) and semiconductor device manufacturing (damascene process) applications.
•Covers information about forecasts for copper plating and additives, market shares, technical trends, and supplier profiles.
• Includes 3 Quarterly Updates, with updates on market trends and forecasts from the analyst
• Includes Single User License – provides 1 portal access login to techcet.com for one person, using 2FA (two-factor authentication). For Multi-User License information, click here.

TECHCET Reports can be Included with CMC or DSS Membership, which includes 1:1 meeting time with the analyst – Click Here for Membership Info!

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Table of Contents

1 EXECUTIVE SUMMARY 	                                               9			                  
1.1 EXECUTIVE SUMMARY                                                  10
1.2 ADVANCED PACKAGING PER WAFER STARTS                                11
1.3 DEVICE DEMAND DRIVERS - LOGIC                                      12
1.4 CU PLATING FORECAST FOR CU INTERCONNECTS AND ADVANCED PACKAGING    13
1.5 MARKET SHARES                                                      14
1.6 SUPPLIER ACTIVITIES – VARIOUS ANNOUNCEMENTS                        15 
1.7  RISK FACTORS                                                      16
1.8  ANALYST ASSESSMENT                                                17

2 SCOPE, PURPOSE AND METHODOLOGY	                               18
2.1 SCOPE                                                              19
2.2 PURPOSE & METHODOLOGY                                              20
2.3 OVERVIEW OF OTHER TECHCET CMR REPORTS                              21

3 SEMICONDUCTOR INDUSTRY MARKET OUTLOOK	                               22
3.1 WORLDWIDE ECONOMY AND OVERALL INDUSTRY OUTLOOK                     23
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY              25
3.1.2 SEMICONDUCTOR SALES GROWTH                                       26
3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS               27
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT                            28
3.2.1 ELECTRONICS OUTLOOK                                              29
3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK                                      30
3.2.3 SMARTPHONE OUTLOOK                                               33
3.2.4 PC OUTLOOK                                                       34
3.2.5 SERVERS / IT MARKET                                              35
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION                       36
3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS               37
3.3.2 NEW FABS IN THE US                                               38
3.3.3 WW FAB EXPANSION DRIVING GROWTH                                  39
3.3.4 EQUIPMENT SPENDING TRENDS                                        40
3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS                               41
3.3.6 FAB INVESTMENT ASSESSMENT                                        44
3.4 POLICY & TRADE TRENDS AND IMPACT                                   45
3.5 SEMICONDUCTOR MATERIALS OVERVIEW                                   46
3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028                       47
3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028                   48

4 METAL CHEMICALS MARKET BY SEGMENT	                               49
4.1 DEFINITIONS                                                        50
4.2 METAL PLATING CHEMICALS MARKET OVERVIEW                            52
4.2.1 OVERVIEW – CU ADVANCED PACKAGING AND CHIP 
INTERCONNECTS METALLIZATION                                            53
4.2.2 OVERVIEW - PLATING MARKET TRANSITIONAL TRENDS                    54
4.3  ADVANCED PACKAGING METALLIZATION – MARKET DRIVERS                 55
4.3.1 ADVANCED PACKAGING - ADDITIVES FOR CU PLATING REVENUE            56
4.3.2 ADVANCED PACKAGING – COPPER CHEMICALS REVENUE                    57
4.3.3  ADVANCED PACKAGING ADDITIVE VOLUMES                             58
4.3.4  OTHER PLATING MATERIALS FOR ADVANCED PACKAGING                  59
4.3.5 SN / SNAG PLATING                                                60
4.4 CHIP INTERCONNECTS GROWTH TRENDS                                   62
4.4.1 CHIP INTERCONNECTS GROWTH DRIVERS                                63
4.4.2 CHIP INTERCONNECTS CU PLATING REVENUES                           64
4.4.3 CHIP INTERCONNECTS ADDITIVE VOLUMES                              65
4.5 MINE LOCATIONS FOR METALS IN PLATING CHEMICALS                     66
4.6 POSSIBLE CHOKE POINTS FOR METALS USED IN IC PLATING                67
4.7 FUTURE POSSIBLE DEMAND PRICE PRESSURES                             68

5 TECHNICAL TRENDS	                                               69
5.1 CHEMISTRIES USE FOR SEMICONDUCTOR METAL PLATING                    70
5.2 PACKAGING TECH TRENDS                                              71
5.2.1 PACKAGING TECHNICAL CHALLENGES                                   72
5.3 TECH TRENDS                                                        73
5.3.1 MARKET DRIVES TECHNOLOGY TRENDS                                  74
5.3.2 ADV LOGIC INTERCONNECT WIRING TECHNOLOGY EVOLUTION               75
5.3.3 CU INTERCONNECTS QUALIFICATION REQUIREMENTS                      77
5.3.4 LOGIC METALLIZATION ROADMAP                                      78
5.3.5 ADV LOGIC BURIED POWER RAIL                                      80
5.3.6  TECHNOLOGY ROADMAP: DRAM WITH MO OR RU                          81
5.3.7 PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO OR RU             83
5.3.8 EXAMPLE OF LOGIC PRO  CESS FLOW 20 NM TO 32 NM 
LOGIC PVD        85
5.3.9 TECHNICAL REQUIREMENTS SUMMARY 1/2                               86

6 COMPETITIVE LANDSCAPE	    	   	                               88
6.1 TOTAL ADVANCED PACKAGING AND INTERCONNECTS MARKET SHARES           89
6.2 OEM MARKET SHARE – PLATING EQUIPMENT                               90
6.3 MARKET SHARE BY APPLICATION – CU PLATING FOR ADVANCED PACKAGING    91
6.4 REGIONAL PLAYERS AND OTHERS                                        92
6.5 M&A ACTIVITY                                                       93

7 ANALYST ASSESSMENT  		                                       94
7.1  ADVANCED METAL PLATING APPLICATIONS MARKET ASSESSMENT ​            95

8 SUPPLIER PROFILES		                                       96
BASF 
DUPONT 
CHANG CHUN GROUP
INCHEON CHEMICAL COMPANY 
ISHIHARA CHEMICAL/UNICON ​
...AND 9 MORE

9 APPENDIX A: PACKAGING TECH TRENDS                                    160
9.1 TECHNOLOGY CHALLENGE                                               161
9.1.1 METAL CLEANINGS CHALLENGE                                        162
9.1.2 MARKET DYNAMIC                                                   163
9.1.3 WAFER LEVEL PLATING-FIRST LEVEL INTERCONNECT                     164
9.1.4 MARKET DRIVERS OF ADVANCED PACKAGING APPLICATIONS                165
9.1.5 WAFER LEVEL PACKAGING ARCHITECTURES                              166
9.1.6 TECH TRENDS- RDL                                                 167
9.1.7 MARKET DRIVERS OF CHIPLET ARCHITECTURE                           169
9.1.8 TSV FILLING 2.5-3D                                               172
9.1.9 PACKAGING ELECTROPLATING REQUIREMENTS                            173


List of Figures
FIGURE 1.1: PLATING MATERIALS FOR ADVANCED PACKAGING
AND 
INTERCONNECT REVENUES ($M’S)                                           10
FIGURE 1.2.  WAFERS/YR & % OF PACKAGING THAT IS 

ADVANCED PACKAGING (AP)                                                11
FIGURE 1.3: ADV LOGIC DEVICE GROWTH FORECAST                           12
FIGURE 1.4: COPPER PLATING CHEMICALS REVENUES ($M’S)   

FOR ADVANCED PACKAGING & FE CU INTERCONNECTS                           13
FIGURE 1.5: 2023 SUPPLIER MARKET SHARES CU PLATING 

FOR INTERCONNECT ADDITIVES                                             14
FIGURE 1.6: 2023 SUPPLIER MARKET SHARES CU PLATING 

FOR ADV. PACKAGING                                                     14
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS 

SUPPLY CHAIN  (2023)                                                   25
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES                              26
FIGURE 3.3: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY 

INDEX (TTSII) IN 000’S OF NTD                                          27
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS                       28
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES                            30
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION                      31
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION                        37
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES                       32
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST                           33
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST                           34
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE 

IN THE BACKGROUND                                                      36
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028                   37
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US                              38
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING 
REGIONS OF THE WORLD                                                   39 
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) 

AND Y-O-Y CHANGE                                                       30
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY 

ROADMAP OVERVIEW                                                       41
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW                          42
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW                       43
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024                     44
FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS             47
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)             48 
FIGURE 4.1: PACKAGING METALLIZATION APPLICATIONS                       50
FIGURE 4.2: USE OF SILICON INTERPOSER IN 2.5D PACKAGING                51
FIGURE 4.3: VERSIONS OF TSV & PROCESS FLOW EXAMPLE                     51
FIGURE 4.4: PLATING MATERIALS FOR ADVANCED PACKAGING 

AND DEVICE INTERCONNECT REVENUES (M’S)                                 52
FIGURE 4.5: CU PLATING CHEMICALS 5-YEAR FORECAST                       53
FIGURE 4.6: WAFERS/YR & % OF PACKAGING THAT IS ADVANCED PACKAGING      55
FIGURE 4.7: REVENUE FORECAST CU PLATING ADVANCED PACKAGING             56 
FIGURE 4.8: CU PILLAR & CU RDL SEGMENTED FORECAST                      57
FIGURE 4.9: ADV. PACKAGING CU CUSO4 AMOUNT DEMAND FORECAST             58
FIGURE 4.10: ADV. PACKAGING CU/VMS VOLUME DEMAND 
FORECAST 
ADV.PACKAGING CU PLATING ADDITIVES                                     58
FIGURE 4.11: BUMPING MATERIALS FOR FIRST LEVEL INTERCONNECT            59
FIGURE 4.12: HYBRID BONDING PROCESS                                    59
FIGURE 4.13: SN AND SNAG PLATING REVENUE                               60
FIGURE 4.14: NICKEL PLATING REVENUE                                    61
FIGURE 4.15: ADV LOGIC DEVICE GROWTH FORECAST                          62
FIGURE 4.16: METAL PLATING WAFER PASSES                                63
FIGURE 4.17: WW DAMASCENE REVENUE FORECAST ESTIMATES                   64
FIGURE 4.18: DAMASCENE CUSO4 VOLUME DEMAND FORECAST                    65
FIGURE 4.19: DAMASCENE CU PLATING CHEMICAL AMOUNT DEMAND FORECAST      65
FIGURE 5.1: KEY TRENDS IN ADVANCED PACKAGING                           71
FIGURE 5.2: CHALLENGES OF ELECTROPLATING VIA FILL                      72
FIGURE 5.3: METAL INTERCONNECTS BY LOGIC NODE                          74
FIGURE 5.4: INTERCONNECT METAL COMPARISON BY RESISTIVITY               75
FIGURE 5.5: CU CHIP INTERCONNECTS QUALIFICATION                        77
FIGURE 5.6: LEADING EDGE LOGIC POWER RAIL SCHEMES                      80
FIGURE 5.7: DRAM STRUCTURE                                             81
FIGURE 5.8: 3D NAND STRUCTURE                                          83
FIGURE 6.1: TOTAL PLATING FOR ADV. PACKAGING AND CU 
INTERCONNECT ADDITIVES 2023                                            89
FIGURE 6.2: PLATING EQUIPMENT OEM MARKET SHARES % 2023                 90
FIGURE 6.3: PLATING CHEMICAL SUPPLIER FOR INTERCONNECTS 

AND ADVANCED PACKAGING APPLICATIONS                                    91
FIGURE 9.1: CLEANING COMPLEXITY                                        160
FIGURE 9.2: OSATS PACKAGING BUSINESS CANNIBALIZATION TREND             162
FIGURE 9.3: WAFER LEVEL PLATING                                        163
FIGURE 9.4: ADVANCED PACKAGING MARKET DRIVERS 

AND APPLICATIONS                                                       164
FIGURE 9.4: ADVANCED PACKAGING MARKET DRIVERS 

AND APPLICATIONS                                                       165
FIGURE 9.5: FAN-IN (WLCSP) & FAN-OUT (WLFO) COMPARISON                 166
FIGURE 9.6: RDL CIRCUITRY EXAMPLE                                      167
FIGURE 9.7: COMPARISON WITH DAMASCENE- TYPE RDL                        168
FIGURE 9.8: COST/PERFORMANCE IMPROVEMENTS   
THROUGH CHIPLETS INTEGRATION                                           169
FIGURE 9.9: 2.5 AND 3D PACKAGING EXAMPLES                              170
FIGURE 9.10: USE OF SILICON INTERPOSER                                 171
FIGURE 9.11: TSV PROCESS FLOW EXAMPLE                                  172
FIGURE 9.12: PROCESS COMPARISON OF TRADITIONAL VS. WLP FLOWS           173

List of Tables
TABLE 3.2: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS              36
TABLE 3.3: DATA CENTER SYSTEMS AND COMMUNICATION 
SERVICES MARKET SPENDING 2023                                          40 
TABLE 5.1: IRDS 2023 MORE MOORE INTERCONNECT ROADMAP                   76
TABLE 5.2: BARRIER METAL ROADMAP                                       78
TABLE 5.3: METALS REQUIRED FOR DEVICE FEATURES                         79
TABLE 5.4: DRAM USE OF MO OR RU PRESENT & FUTURE                       81
TABLE 5.5: GENERAL PROCESS FLOW ADVANCED DRAM                          82
TABLE 5.5: 3D NAND MATERIAL CHANGES PRESENT & FUTURE                   83
TABLE 5.6: NUMBER OF STACKS (S) & LAYERS (L) PER GENERATION OF 

3DNAND – SOME ARE ESTIMATES FOR THE FUTURE                             84
TABLE 5.7: EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM 
LOGIC PVD     85
TABLE 5.8: TECHNICAL REQUIREMENTS SUMMARY                              86
TABLE 5.9: TECHNICAL REQUIREMENTS SUMMARY, CONTINUED                   87
TABLE 6.1: REGIONAL PLAYERS – MARKET LEADER AND “OTHERS”               92
TABLE 9.1: CU PACKAGING APPLICATIONS AND REQUIREMENTS                  174

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