Wafer Level Packaging Polymers


Wafer Level Packaging (WLP) is one of the fastest, if not the fastest, growing segments of the semiconductor industry. This is driven by the mobile electronics industry with the ever-increasing need for more performance in a smaller package. Techcet’s Wafer Level Packaging Report provides an in-depth look at the dielectric materials that are the backbone of this new packaging technology.

TECHCET Reports are Included with CMC Membership – Click Here for Info!

Get Info & Order Now!


1.Executive Summary 4
2. Wafer Starts 5
3. Market Statistics 6
4. The Technology Gap 13
5. The WLP Process 16
6. The WLP Polymers and characteristics 21
7. Pricing and Forecast 25
8. Technology Drivers Now and Future 29
9. Supplier Chain 35
10. Supplier Profiles 37


There are no reviews yet.

Be the first to review “Wafer Level Packaging Polymers”