Wet Copper Deposition Materials for ICs and Packages

Steady growth in demand forecasted through 2024 San Diego, CA, November 16, 2020: TECHCET announces that the global market for wet metal deposition materials including electro-chemical deposition (ECD) and plating (ECP) chemistry blends in 2020 is forecast to be US$63 million. From semiconductor fabrication at wafer-scale in the Front-End Of Line (FEOL) to wafer-level and die-level advanced packaging, specialized copper (Cu) chemistry blends are seeing compound annual growth rates…

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