CMC F2F in Munich – November 14-16

How to Manage Material Supply Chains in the Midst of
and “Winter”

CMC Private Fab Member Meeting & Joint Session
November 14-16, Munich Germany (3 Days)

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CMC Day 1 & 2: November 14-15

November 14, Monday at Infineon
CMC Fabs F2F – Chip Fab Members ONLY
Hosted by Infineon
Am Campeon 1-15 85579 Neubiberg Munich, Germany

9:00     Welcome Members
9:05     Introductions
9:15     Opening Lita Shon-Roy, TECHCET
9:30     Analyst Presentation – on Rare Gases
10:30   Coffee Break
10:45   Focus Topics Discussions and Survey

  • Metrics for Procurement effectiveness
  • Tail Spend Suppliers Management
  • Logistics management for future expansion

Noon   Hosted Lunch Break
13:15  Hot Topics Groundwork
13:30  Invited suppliers to be confirmed(tbc)

  • Matheson Gas – He supply (tbc)
  • Air Liquide- gas supply (tbc)

16:00  Hot Topics and Group Discussion
18:00  Networking Dinner

November 15, Tuesday @Semicon Europa – Morning
CMC Fabs F2F & Joint Session
Located at Messe Munich,
Executive Forum, Hall B1
Opening Ceremony Keynote Presentations
10:00 to 13:20

Featuring Executive speakers:

  • Luc Van den hove, President and CEO, imec
  • Kate Wilson, President, Semiconductor Division, Edwards Vacuum
  • Axel Fischer, VP, Foundry Business EMEA SAMSUNG, Samsung Semiconductor Europe
  • Lee Choon Heung, Chief Technology Officer, JCET Group
  • Laura Matz, Chief Science and Technology Officer, Merck and CEO, Athinia
  • Grzegorz Ombach, Head of Disruptive R&T, Senior Vice President, Airbus
  • Barbara Frenkel, Member of the Executive Board, Procurement, Dr. Ing. h.c. F. Porsche AG

For the full Agenda click here


CMC Fabs ONLY Lunch –  Room ICM Ostersee
Lunch:13:30 to 14:00


November 15, Tuesday @Semicon Europa – Afternoon
For Chip Fabs and Supplier Members
CMC Fabs F2F & Joint Session – Located at Messe Munich, Room ICM Ostersee

Presentations and Round Table Discussions
14:00 to 17:00

  • Impacts of the Russia war on Materials Supply-Chains – by Lita Shon-Roy, President/CEO, TECHCET
  • Long-Term impacts and Mitigation Strategies – by Corrina Singer, Infineon
  • Round Table Discussions
  • Networking Reception

CMC Day 3: Seminar Materials Innovation Session
November 16, Wednesday @Semicon Europa
Materials Innovation Session
Executive Forum, Hall B1

  • Semiconductor Market Expansion Driving Materials Innovation – Materials Market Outlook and Challenge, Lita Shon-Roy, TECHCET
  • Current Trends in Digital Chemistry to Drive Semiconductor Innovation by Simon Elliott, Director – Atomic level process simulation, Schrödinger
  • EUV Lithography Patterning: Status and Challenges Towards High NA by Danilo De Simone, Staff Member, Imec
  • Nanoscale Metals are Comprised of Grain Boundaries that are Significantly Different from those found in Bulk Materials by John Boland, Professor of Chemistry, Trinity College Dublin
  • How Did and Will Atomic Scale Processing Change the Logic and Memory Industries? by Michael Givens, Senior Director & Executive Technologist, ASM International
  • The European 2D-Experimental Pilot Line as a Platform for Novel Sensor Concepts by Gordon Rinke, Vice Head of Graphene Electronics Group, AMO GmbH
  • Panel Discussion: Chip Expansion Driving Materials Market Challenges and Opportunities

For the full agenda click here


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