How to Manage Material Supply Chains in the Midst of
Expansions and “Winter”
CMC Private Fab Member Meeting & Joint Session
November 14-16, Munich Germany (3 Days)
RSVP to DScott@techcet.com
View Sponsorship Opportunities
View Hotel Suggestion and Transportation Details
CMC Day 1 & 2: November 14-15
November 14, Monday at Infineon
CMC Fabs F2F – Chip Fab Members ONLY
Hosted by Infineon
Am Campeon 1-15 85579 Neubiberg Munich, Germany
9:00 Welcome Members
9:05 Introductions
9:15 Opening Lita Shon-Roy, TECHCET
9:30 Analyst Presentation – on Rare Gases
10:30 Coffee Break
10:45 Focus Topics Discussions and Survey
- Metrics for Procurement effectiveness
- Tail Spend Suppliers Management
- Logistics management for future expansion
Noon Hosted Lunch Break
13:15 Hot Topics Groundwork
13:30 Invited suppliers to be confirmed(tbc)
- Matheson Gas – He supply (tbc)
- Air Liquide- gas supply (tbc)
16:00 Hot Topics and Group Discussion
18:00 Networking Dinner
November 15, Tuesday @Semicon Europa – Morning
All INVITED
CMC Fabs F2F & Joint Session
Located at Messe Munich, Executive Forum, Hall B1
Opening Ceremony Keynote Presentations
10:00 to 13:20
Featuring Executive speakers:
- Luc Van den hove, President and CEO, imec
- Kate Wilson, President, Semiconductor Division, Edwards Vacuum
- Axel Fischer, VP, Foundry Business EMEA SAMSUNG, Samsung Semiconductor Europe
- Lee Choon Heung, Chief Technology Officer, JCET Group
- Laura Matz, Chief Science and Technology Officer, Merck and CEO, Athinia
- Grzegorz Ombach, Head of Disruptive R&T, Senior Vice President, Airbus
- Barbara Frenkel, Member of the Executive Board, Procurement, Dr. Ing. h.c. F. Porsche AG
For the full Agenda click here
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CMC Fabs ONLY Lunch – Room ICM Ostersee
Lunch:13:30 to 14:00
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November 15, Tuesday @Semicon Europa – Afternoon
For Chip Fabs and Supplier Members
CMC Fabs F2F & Joint Session – Located at Messe Munich, Room ICM Ostersee
Presentations and Round Table Discussions
14:00 to 17:00
- Impacts of the Russia war on Materials Supply-Chains – by Lita Shon-Roy, President/CEO, TECHCET
- Long-Term impacts and Mitigation Strategies – by Corrina Singer, Infineon
- Round Table Discussions
- Networking Reception
CMC Day 3: Seminar Materials Innovation Session
November 16, Wednesday @Semicon Europa
Materials Innovation Session
Executive Forum, Hall B1
- Semiconductor Market Expansion Driving Materials Innovation – Materials Market Outlook and Challenge, Lita Shon-Roy, TECHCET
- Current Trends in Digital Chemistry to Drive Semiconductor Innovation by Simon Elliott, Director – Atomic level process simulation, Schrödinger
- EUV Lithography Patterning: Status and Challenges Towards High NA by Danilo De Simone, Staff Member, Imec
- Nanoscale Metals are Comprised of Grain Boundaries that are Significantly Different from those found in Bulk Materials by John Boland, Professor of Chemistry, Trinity College Dublin
- How Did and Will Atomic Scale Processing Change the Logic and Memory Industries? by Michael Givens, Senior Director & Executive Technologist, ASM International
- The European 2D-Experimental Pilot Line as a Platform for Novel Sensor Concepts by Gordon Rinke, Vice Head of Graphene Electronics Group, AMO GmbH
- Panel Discussion: Chip Expansion Driving Materials Market Challenges and Opportunities