Semiconductor CMP Pad & Slurry Forecast

CMP consumables for metals to see large growth over next 5 years

San Diego, CA, May 2, 2024:  TECHCET — the advisory firm providing materials market information for semiconductor supply chain resilience — is forecasting upwards growth of 6% in 2024 for Semiconductor CMP Consumables. CMP consumables for metals (Co, Mo, Ru) show the largest growth rate by far, increasing 94% over the next 5 years. Healthy growth is also expected for polysilicon and oxide CMP consumables, as highlighted in TECHCET’s Critical Materials Report™ on CMP Consumables.

For the slurry segment, Fujifilm Electronic Materials (FFEM) currently holds the highest share of the market at 31% due to their strong position in Cu slurry (holding the majority share in the segment). Entegris is ranked second in market share, largely due to their acquisitions of Sinmat, Chemetall Precision Microchemicals (was BASF) and CMC. For the pad segment, DuPont continues to be the dominant supplier, representing over 50% of the market.

Geopolitical events could potentially cause delays and price increases as suppliers qualify alternate sources to China and Russia for raw materials. For example, alumina, ceria, and silica raw material supply could be impacted.

To hear more on upcoming CMP technology trends, come see Dr. Karey Holland, Chief Strategist at TECHCET, speak on “Advanced Semiconductor Technology Roadmaps and Implications to CMP Materials” at the NCCAVS CMPUG 2024 Spring Symposium

For the full table of contents and to purchase the CMP Consumables Critical Materials Report™, visit

ABOUT TECHCET: TECHCET CA LLC is an advisory services firm expert in market and supply-chain analysis of electronic materials for the semiconductor, display, solar/PV, and LED industries. TECHCET offers consulting, subscription service, and reports, including the Critical Materials Council (CMC) of semiconductor fabricators and Data Subscription Service (DSS). For additional information, please email us here, call +1-480-332-8336, or go to