Description
This report covers the market landscape and supply-chain for Precursors used in semiconductor device fabrication. It includes information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments.
Featured Press Release on CVD/Dielectric Precursor Market Updates and Report Highlights:
Table of Contents:
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1 Executive Summary 11 1.1 PRECURSORS BUSINESS – MARKET OVERVIEW 12 1.2 PRECURSORS MARKET TRENDS IMPACTING 2024 OUTLOOK 13 1.3 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT: DIELECTRIC PRECURSORS 14 1.4 PRECURSOR TRENDS 15 1.5 PRECURSOR TECHNOLOGY TRENDS 16 1.6 COMPETITIVE LANDSCAPE DIELECTRIC PRECURSORS 17 1.7 ANALYST ASSESSMENT OF DIELECTRIC PRECURSORS 18 2 Scope, Purpose, and Methodology 19 2.1 SCOPE 20 2.2 METHODOLOGY 21 2.3 OVERVIEW OF OTHER TECHCET CMR™ OFFERINGS 22 3 Semiconductor Industry Market Status & Outlook 23 3.1 WORLDWIDE ECONOMY AND OUTLOOK 24 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY 26 3.1.2 SEMICONDUCTOR SALES GROWTH 27 3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS 28 3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT 29 3.2.1 ELECTRONICS OUTLOOK 30 3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK 31 3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS 32 3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS 33 3.2.3 SMARTPHONE OUTLOOK 34 3.2.4 PC OUTLOOK 35 3.2.5 SERVERS / IT MARKET 36 3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION 37 3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS 38 3.3.2 NEW FABS IN THE US 39 3.3.3 WW FAB EXPANSION DRIVING GROWTH 40 3.3.4 EQUIPMENT SPENDING TRENDS 41 3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS 42 3.3.5.1 DRAM TECHNOLOGY ROADMAPS 43 3.3.5.2 3D NAND TECHNOLOGY ROADMAPS 44 3.3.6 FAB INVESTMENT ASSESSMENT 45 3.4 POLICY & TRADE TRENDS AND IMPACT 46 3.5 SEMICONDUCTOR MATERIALS OVERVIEW 47 3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028 48 3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028 49 4 Material Market Trends 50 4.1 CVD, ALD METAL & HIGH-K AND ADVANCED DIELECTRIC PRECURSORS MARKET TRENDS 51 4.1.1 2023 PRECURSOR MARKET LEADING INTO 2024 52 4.1.2 PRECURSOR MARKET OUTLOOK 53 4.1.3 DIELECTRIC PRECURSORS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT 54 4.1.4 DIELECTRIC PRODUCTION OF TOP SUPPLIERS 55 4.1.5 DIELECTRIC PRODUCTION BY REGION 56 4.1.6 ALD/CVD MATERIAL PRODUCTION CAPACITY EXPANSIONS 57 4.1.7 INVESTMENT ANNOUNCEMENTS OVERVIEW 59 4.2 PRICING TRENDS 60 4.3 TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE 61 4.3.1 PRECURSOR GENERAL TECHNOLOGY OVERVIEW & TECHNOLOGY TRENDS 62 4.3.2 CUSTOMER DRIVEN TECHNOLOGIES 63 4.3.3 NAND ROADMAPS AND CHALLENGES - 3D NAND LEVELS W/ STACKS/TIERS 64 4.3.4 3D NAND PROCESS ADVANCES REQUIRED 65 4.3.5 MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL-LAYER 32GBIT NON-VOLATILE FERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE 66 4.3.6 ADVANCED LOGIC ROADMAPS AND CHALLENGES – LOGIC TRANSISTOR EST. ROADMAP 67 4.3.7 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE 68 4.3.7.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. INTEL'S RIBBONFET 69 4.3.8 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES 70 4.3.9 ADVANCING TECHNOLOGIES IMPLICATION TOPHOTOLITHOGRAPHY 72 4.3.9.1 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY – DSA 73 4.3.9.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: CENTURA SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING 75 4.3.9.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION 76 4.3.10 CFET ARCHITECTURE: CFET SCALING ADVANTAGE 77 4.3.10.1 CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS) 78 4.3.10.2 CFET ARCHITECTURE: CFET FUTURE PROSPECTS 81 4.3.11 INORGANIC EUV RESIST – SPIN ON DEPOSITION 83 4.3.11.1 INORGANIC EUV RESIST – ALD DEPOSITED 84 4.3.12 SELF ALIGNED MULTI PATTERNING – SADP 85 4.3.12.1 SELF ALIGNED MULTI PATTERNING – SAQP 86 4.3.12.2 SELF ALIGNED MULTI PATTERNING – PEALD EQUIPMENT 87 4.3.12.3 SELF ALIGNED MULTI PATTERNING - CAN SAQP BYPASS EUV BEYOND 7 NM? 88 4.3.13 EUV, MULTI PATTERNING AND GEOPOLITICS 89 4.3.14 AREA SELECTIVE DEPOSITION (ASD) 90 4.3.14.1 AREA SELECTIVE DEPOSITION (ASD) – TU EINDHOVEN SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT 91 4.3.15 SPECIALTY/EMERGING DIELECTRIC AND APPLICATIONS 92 4.3.16 REGIONAL CONSIDERATIONS – DIELECTRICS 93 4.3.17 REGIONAL ASPECTS AND DRIVERS 94 4.4 EHS AND TRADE/LOGISTIC ISSUES – METALS, HIGH-K AND DIELECTRICS 96 4.5 ANALYST ASSESSMENT OF DIELECTRIC MARKET TRENDS 97 5 Supply-Side Market Landscape 98 5.1 PRECURSOR MATERIAL MARKET SHARE 99 5.1.1 CURRENT QUARTER ACTIVITY – MERCK 100 5.1.1.1 MERCK 101 5.1.2 CURRENT QUARTER ACTIVITY – AIR LIQUIDE 103 5.1.2.1 AIR LIQUIDE 104 5.1.3 CURRENT QUARTER ACTIVITY –ENTEGRIS 105 5.1.3.1 ENTEGRIS 106 5.1.4 ADEKA 107 5.1.4.1 ADEKA 108 5.2 M&A ACTIVITY AND PARTNERSHIPS 109 5.3 PLANT CLOSURES 111 5.4 NEW ENTRANTS 112 5.4.1 MSP LAUNCHES TURBO II™ VAPORIZERS: NEXT-GEN EFFICIENCY FOR SEMICONDUCTOR FABRICATION 113 5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS 114 5.6 TECHCET ANALYST ASSESSMENT OF PRECURSOR SUPPLIERS 115 6 Sub Tier Supply Chain, Precursors 116 6.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW 117 6.1.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – TIER 2 EXAMPLES NOURYON AND GELEST 118 6.1.2 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – CHEMICAL & GAS MANAGEMENT SYSTEMS 119 6.1.3 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – CHEMICAL DELIVERY CABINETS 120 6.1.4 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – VALVE MANIFOLD BOXES (VMB) 121 6.1.5 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – BULK SPEC GAS SYSTEMS 122 6.1.6 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – GAS CABINETS 123 6.1.7 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – FORMING GAS & DOPANT GAS BLENDERS 124 6.1.8 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW CHEMICAL - MONITORING AND ANALYTICAL SYSTEMS 125 6.2 SUB-TIER MATERIAL CVD & ALD PRECURSOR TRENDS 126 6.3 SUB-TIER MATERIAL INDUSTRIAL VS. SEMICONDUCTOR-GRADE 127 6.4 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK MERCK 128 6.5 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK AIR LIQUIDE 129 6.6 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER NEWS 130 6.7 SUB-TIER SUPPLY-CHAIN DISRUPTORS 132 6.8 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT 133 7 Supplier profiles 134 ADEKA CORPORATION AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER) AZMAX CO., LTD CITY CHEMICAL LLC DNF CO., LTD ...and 20+ more LIST OF FIGURES FIGURE 1.1: DIELECTRIC PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT 14 FIGURE 1.2: WW MARKET SHARE - DIELECTRIC PRECURSORS 2023 (U$ 686 M) 17 FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023) 26 FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES 27 FIGURE 3.3: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI) 28 FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS 29 FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS) 31 FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION 32 FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION 33 FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES 34 FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST 35 FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND 37 FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028 38 FIGURE 3.12: FAB EXPANSIONS WITHIN THE US 39 FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD 40 FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE 41 FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW 42 FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW 43 FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW 44 FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024 45 FIGURE 3.19: TECHCET WAFER START FORECAST BY NODE SEGMENTS 48 FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD) 49 FIGURE 4.1: DIELECTRIC PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT 54 FIGURE 4.2: WW MARKET SHARE - DIELECTRIC PRECURSORS 2023 (U$ 686 M) 55 FIGURE 4.3: DIELECTRIC PRECURSOR MARKET REGIONAL ASSESSMENT 2023 56 FIGURE 4.4: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES 63 FIGURE 4.5: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME 64 FIGURE 4.6: 3D NAND PROGRESSION 65 FIGURE 4.7: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS 66 FIGURE 4.8: GATE STRUCTURE ROADMAP 67 FIGURE 4.9: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP 68 FIGURE 4.10: RIBBON FET 69 FIGURE 4.11: MONO LAYER NANO SHEETS CHANNELS 71 FIGURE 4.12: NANO IMPRINT LITHOGRAPHY PROCESS FLOW 72 FIGURE 4.13: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY 72 FIGURE 4.14: DIRECTED SELF-ASSEMBLY 73 FIGURE 4.15: DSA PATENT FILING BY COMPANY 74 FIGURE 4.16: DSA PATEN FILING SINCE 2023 74 FIGURE 4.17: WHAT IS PATTERN SHAPING? 75 FIGURE 4.18: REFINING EUV PATTERNING BY APPLIED MATERIALS 76 FIGURE 4.19: COMPLEMENTARY FET (CFET) 77 FIGURE 4.20: CFET IMPROVES PERFORMANCE IN TRACK SCALING 77 FIGURE 4.21: MONOLITHIC CFET PROCESS FLOW EXAMPLE 78 FIGURE 4.22: MCFET NEW FEATURE: MIDDLE DIELECTRIC ISOLATION 78 FIGURE 4.23: LOW TEMPERATURE GATE STACK OPTION EXAMPLES 79 FIGURE 4.24: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES 79 FIGURE 4.25: BSPDN ADVANTAGE: IR DROP REDUCTION 80 FIGURE 4.26: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION GAA-FET AND CFET 81 FIGURE 4.27: IMEC SUB-1NM TRANSISTOR ROADMAP, 3D-STACKED CMOS 2.0 PLANS 82 FIGURE 4.28: INPRIA EUV MOR 83 FIGURE 4.29: INPRIA SPIN ON INORGANIC RESIST IS MUCH THINNER THAN STANDARD STACKS OF PHOTO RESIST 83 FIGURE 4.30: PATENT FILING FOR MLD DEPOSITED EUV RESIST. SEARCH PERFORMED IN PATBASE 84 FIGURE 4.31: SADP PROCESS FLOW USING ALD SPACER 85 FIGURE 4.32: ONE OF MANY FLAVORS OF SAQP PROCESS FLOW 86 FIGURE 4.33: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT 91 FIGURE 4.34: SPECIALTY/EMERGING DIELECTRIC APPLICATIONS FOR HETEROGENOUS INTEGRATIONS (APPLIED MATERIALS) 92 FIGURE 4.35: 2023 DIELECTRIC REVENUE SHARE BY REGION 93 FIGURE 5.1: 2023 PRECURSOR MATERIAL SUPPLIER MARKET SHARE BY REVENUE 99 FIGURE 5.2: MERCK ELECTRONICS REVENUE 2022-2023 (M EUR), LEFT. SEMICONDUCTOR SOLUTIONS ANNUAL REVENUE FORECAST (M EUR), RIGHT. 102 FIGURE 5.3: AIR LIQUIDE ELECTRONICS REVENUE FORECAST (M EUR) 104 FIGURE 5.4: THE MS (MATERIAL SOLUTIONS) DIVISION OF ENTEGRIS REVENUE FORECAST 106 FIGURE 5.5: ADEKA REVENUE ELECTRONICS REVENUE FORECAST (100M JPY) 107 FIGURE 6.1: FORMING GAS BLENDER CONFIGURATION 124 FIGURE 6.2: TOP COUNTRIES/REGIONS THAT SUPPLY VERSUM MATERIALS US LLC (PANJIVA APRIL 2024) 128 FIGURE 6.3: TOP COUNTRIES/REGIONS THAT SUPPLY AIR LIQUIDE AMERICA CORP. (PANJEIVA APRIL 2024) 129 FIGURE 6.4: TOP COUNTRIES/REGIONS THAT SUPPLY H.C. STARCK INC. (USA) 130 LIST OF TABLES TABLE 1.1: DIELECTRIC PRECURSOR REVENUES AND GROWTH RATES 14 TABLE 1.2: ESTIMATED DIELECTRIC PRECURSOR MARKET SHARE BY SUPPLIER 2023 17 TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES 24 TABLE 3.2: WORLD BANK ECONOMIC OUTLOOK (JANUARY 2024) 25 TABLE 3.3: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS 32 TABLE 3.4: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023 36 TABLE 4.1: PRECURSORS REVENUE AND GROWTH RATES 51 TABLE 4.2: DIELECTRIC PRECURSOR REVENUES AND GROWTH RATES 54 TABLE 4.3: ESTIMATED DIELECTRIC PRECURSOR MARKET SHARE BY SUPPLIER 2023 55 TABLE 4.4: DIELECTRIC PRECURSOR MARKET REGIONAL ASSESSMENT 2023 56 TABLE 4.5: OVERVIEW OF ANNOUNCED 2023/2024 MATERIAL SUPPLIER INVESTMENTS 59 TABLE 4.6: LEADING EDGE LOGIC DESCRIPTIONS BY NODE (TSMC, INTEL) 69 TABLE 4.7: MULTIPATTERNING AT 7NM BY TSMC 88 TABLE 4.8: SELECTIVE DEPOSITION - SELECTIVELY DEPOSITED MATERIALS 90 TABLE 4.9: REGIONAL PRECURSOR MATERIAL MARKETS 94 TABLE 4.10: REGIONAL PRECURSOR MATERIAL MARKETS, CONTINUED 95 TABLE 5.1: MERCK QUARTER FINANCIALS 100 TABLE 5.2: AIR LIQUIDE CURRENT QUARTER FINANCIALS 103 TABLE 5.3: ENTEGRIS SUPPLIER CURRENT QUARTER FINANCIALS 105 TABLE 6.1: CVD AND ALD PRECURSOR 127