ALD/ High K Metal Precursors Market Report CMR 2024-2025 (Single User License)

$8,900.00

• Provides market and technical trend information on organic and inorganic precursors, addressing CVD, ALD applications including high κ metal-oxides, barrier layers, metal interconnects, and capping layers, among others.
• Provides focused information for supply-chain managers, process integration and R&D directors, as well as business development and financial analysts
• Covers information about key suppliers, issues/trends in the electronics material supply chain, estimates on supplier market share, and forecast for the electronics material segments
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Description

This report covers the market landscape and supply-chain for Precursors used in semiconductor device fabrication. It includes information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments.

 

Featured Press Release on ALD/High-K Market Updates and Report Highlights:

Table of Contents:

Click here for a PDF download of the full table of contents

1  Executive Summary  12
1.1 PRECURSORS BUSINESS – MARKET OVERVIEW 					13
1.2 PRECURSORS MARKET TRENDS IMPACTING 2024 OUTLOOK 				14
1.3 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT: METAL AND HIGH-K PRECURSORS 	15
1.4 PRECURSOR TRENDS 								16
1.5  PRECURSOR TECHNOLOGY TRENDS						17
1.6 COMPETITIVE LANDSCAPE METAL & HIGH-K PRECURSORS				18
1.7  PRECURSOR EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS 			19
1.8 ANALYST ASSESSMENT OF METAL AND HIGH-K PRECURSORS 				20

2  Scope, Purpose, and Methodology  21
2.1 SCOPE 									22
2.2 METHODOLOGY 								23
2.3 OVERVIEW OF OTHER TECHCET CMR™ OFFERINGS 					24

3  Semiconductor Industry Market Status & Outlook  25
3.1 WORLDWIDE ECONOMY AND OUTLOOK 						26
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY			28
3.1.2 SEMICONDUCTOR SALES GROWTH						29
3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS			30
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT 					31
3.2.1 ELECTRONICS OUTLOOK							32
3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK						33
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS					34
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS				35
3.2.3 SMARTPHONE OUTLOOK							36
3.2.4 PC OUTLOOK								37
3.2.5 SERVERS / IT MARKET							38
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION 				39
3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS			40
3.3.2 NEW FABS IN THE US							41
3.3.3 WW FAB EXPANSION DRIVING GROWTH 						42
3.3.4 EQUIPMENT SPENDING TRENDS							43
3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS					44
3.3.5.1 DRAM TECHNOLOGY ROADMAPS						45
3.3.5.2 3D NAND TECHNOLOGY ROADMAPS						46
3.3.6 FAB INVESTMENT ASSESSMENT							47
3.4 POLICY & TRADE TRENDS AND IMPACT 						48
3.5 SEMICONDUCTOR MATERIALS OVERVIEW 						49
3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028				50
3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028				51

4  Material Market Trends  52
4.1 CVD, ALD METAL & HIGH-K AND ADVANCED DIELECTRIC PRECURSORS MARKET TRENDS 	53
4.1.1 2023 PRECURSOR MARKET LEADING INTO 2024					54
4.1.2 PRECURSOR MARKET OUTLOOK							55
4.1.3 METAL AND HIGH-K PRECURSORS 5-YEAR UNIT SHIPMENTFORECAST BY SEGMENT	56
4.2 PRECURSORS SUPPLY CAPACITY AND DEMAND, INVESTMENTS 				57
4.2.1 METAL & HIGH-K PRECURSOR PRODUCTION CAPACITY OF TOP SUPPLIERS		58
4.2.2 METAL & HIGH-K PRODUCTION BY REGION 					59
4.2.3 ALD/CVD MATERIAL PRODUCTION CAPACITY EXPANSIONS				60
4.2.4 INVESTMENT ANNOUNCEMENTS OVERVIEW						62
4.2.5 PRECURSORS SUPPLY VS. DEMAND BALANCE – OVERVIEW				63
4.3 PRICING TRENDS 								64
4.4 TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE 				65
4.4.1 PRECURSOR GENERAL TECHNOLOGY OVERVIEW & TECHNOLOGY TRENDS		66
4.4.2 CUSTOMER DRIVEN TECHNOLOGIES						67
4.4.3 NAND ROADMAPS AND CHALLENGES - 3D NAND LEVELS W/ STACKS/TIERS		68
4.4.4 3D NAND PROCESS ADVANCES REQUIRED						69
4.4.5 NEW MATERIALS AND ETCH CHEMISTRIES ENABLE 3D NAND SCALING – PF3(G) 
AND MOO2CL2(S)									70
4.4.6 MOLYBDENUM: THE NEW FRONTIER IN SEMICONDUCTOR METALLIZATION ACCORDING 
TO LAM RESEARCH									71
4.4.7 DRAM PROCESS ADVANCES REQUIRED						72
4.4.8 DRAM FUTURE TECHNOLOGY CHALLENGES						73
4.4.9 MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL-LAYER 	32GBIT NON-VOLATILE
FERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE					74
4.4.10 ADVANCED LOGIC ROADMAPS AND CHALLENGES –LOGIC TRANSISTOR EST. ROADMAP	75
4.4.11 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE				76
4.4.12 ADV LOGIC PROCESS ADVANCES REQUIRED					77
4.4.12.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. 
INTEL'S RIBBONFET								78
4.4.13 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES					79
4.4.14 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY			81
4.4.14.1 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY – DSA		82
4.4.14.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: CENTURA 
SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING	84
4.4.14.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: 
LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION					85
4.4.15 CFET ARCHITECTURE: CFET SCALING ADVANTAGE				86
4.4.15.1 CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS)				87
4.4.15.2 CFET ARCHITECTURE: CFET FUTURE PROSPECTS				90
4.4.16 INORGANIC EUV RESIST – ALD DEPOSITED					92
4.4.17 MOLECULAR LAYER DEPOSITION (MLD)						93
4.4.17.1 TREND IS MLD COMBINED WITH ALD						94
4.4.17.2 DIFFERENT TYPES OF MLD PRECURSORS AND MATERIALS			95
4.4.17.3 MLD APPLICATIONS							96
4.4.18 AREA SELECTIVE DEPOSITION (ASD)						97
4.4.18.1 AREA SELECTIVE DEPOSITION (ASD) – ADEKA PRESENT ASD HF-PRECURSOR	98
4.4.18.2 AREA SELECTIVE DEPOSITION (ASD) – TU EINDHOVEN SELECTIVE ALD 
ENABLED BY PLASMA PRETREATMENT							99
4.4.20 SPECIALTY/EMERGING METAL AND APPLICATIONS				100
4.4.21 SPECIALTY/EMERGING HIGH-K AND APPLICATIONS				101
4.5 REGIONAL CONSIDERATIONS – METAL AND HIGH-K 					102
4.5.1 REGIONAL ASPECTS AND DRIVERS						103
4.6 EHS AND TRADE/LOGISTIC ISSUES – METALS, HIGH-K AND DIELECTRICS   		105
4.6.1 ESH METALS								106
4.6.2 ESH HIGH-K								107
4.6.3 ESH RECYCLING								108
4.7 TRADE/LOGISTICS ISSUES – METAL MATERIALS 					109
4.7.1 TRADE/LOGISTICS ISSUES – HIGH-K MATERIALS					110
4.8 ANALYST ASSESSMENT OF HIGH-K MARKET TRENDS 					111
4.8.1 ANALYST ASSESSMENT OF METAL MARKET TRENDS					112

5  Supply-Side Market Landscape  113
5.1 PRECURSOR MATERIAL MARKET SHARE 						114
5.1.1 CURRENT QUARTER ACTIVITY – MERCK						115
5.1.1.1 MERCK									116
5.1.2 CURRENT QUARTER ACTIVITY – AIR LIQUIDE					118
5.1.2.1 AIR LIQUIDE								119
5.1.3 CURRENT QUARTER ACTIVITY –ENTEGRIS					120
5.1.3.1 ENTEGRIS								121
5.1.4 ADEKA									122
5.1.4.1 ADEKA									123
5.2 M&A ACTIVITY AND PARTNERSHIPS 						124
5.3 PLANT CLOSURES 								126
5.4 NEW ENTRANTS 								127
5.4.1 MSP LAUNCHES TURBO II™ VAPORIZERS: NEXT-GEN EFFICIENCY FOR 
SEMICONDUCTOR FABRICATION							128
5.4.2 A NEW ZR PRECURSOR WAFER-SCALE ZIRCONIUM DIOXIDE FILMS			129
5.4.3 ADVANCES IN MOLYBDENUM THIN FILMS: NEW LIQUID PRECURSORS BOOST VAPOR 
PHASE DEPOSITION								130
5.4.4 HANWHA TO SUPPLY ALD EQUIPMENT FOR MOLYBDENUM DEPOSITION FOR 
MEMORY APPLICATIONS								131
5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS 	132
5.6 TECHCET ANALYST ASSESSMENT OF PRECURSOR SUPPLIERS 				133

6  Sub Tier Supply Chain, Precursors  134 
6.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW 				135
6.1.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – TIER 2 EXAMPLES 
NOURYON AND GELEST								136
6.1.2 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – CHEMICAL & GAS 
MANAGEMENT SYSTEMS								137
6.1.3 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – CHEMICAL 
DELIVERY CABINETS								138
6.1.4 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW VALVE 
MANIFOLD BOXES (VMB)								139
6.1.5 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – BULK SPEC GAS SYSTEMS	140
6.1.6 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – GAS CABINETS		141
6.1.7 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW – FORMING GAS & 
DOPANT GAS BLENDERS								142
6.1.8 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW CHEMICAL - MONITORING 
AND ANALYTICAL SYSTEMS								143
6.2 SUB-TIER MATERIAL CVD & ALD PRECURSOR TRENDS 				144
6.3 SUB-TIER MATERIAL INDUSTRIAL VS. SEMICONDUCTOR-GRADE 			145
6.4 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK MERCK 	146
6.5 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER GLOBAL NETWORK AIR LIQUIDE 	147
6.6 SEMICONDUCTOR-GRADE SUB-TIER MATERIAL SUPPLIER NEWS 			148
6.7 SUB-TIER SUPPLY-CHAIN: DISRUPTIONS 						150
6.8 SUB-TIER SUPPLY-CHAIN PLANT UPDATES 					151
6.9 SUB-TIER SUPPLY-CHAIN PLANT UPDATES – HAFNIA AND REOFROM THE DUBBO PROJECT  152
6.10 MINERAL USED IN THE SEMICONDUCTOR INDUSTRY DEPENDENCIES 			153
6.11 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - COBALT 				154
6.12 SUB-TIER SUPPLY-CHAIN PRICING TRENDS: ZIRCONIUM AND HAFNIUM		156
6.13 SUB-TIER SUPPLY-CHAIN PRICING TRENDS – HAFNIUM				157
6.14 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - GALLIUM 				158
6.15 ALUMINUM 									160
6.16 TITANIUM 									161
6.17 TUNGSTEN 									162
6.18 MOLYBDENUM									163
6.19 NIOBIUM AND TANTALUM 							164
6.20 RARE EARTHS								165
6.21 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - PGM 				166
6.22 SUB-TIER SUPPLY-CHAIN PRICING TRENDS - GERMANIUM 				168
6.23 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT 				170

7  Supplier Profiles  171
ADEKA CORPORATION ​
AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER) ​
AZMAX CO., LTD ​
CITY CHEMICAL LLC ​
DNF CO., LTD ​
...and 20+ more

  LIST OF FIGURES	
FIGURE 1.1: METAL & HIGH-K PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT	15
FIGURE 1.2: WW MARKET SHARE - METAL & HIGH-K PRECURSORS 2023 (U$ 811 M)	18
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN  (2023)		28
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES 					29
FIGURE 3.3: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSI)		30
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS				31
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)		33
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION 				34
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION					35
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES 				36
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST					37
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND	39
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028				40
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US					41
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD		42
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE		43
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW			44
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW					45
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW				46
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024 				47
FIGURE 3.19: TECHCET WAFER START FORECAST BY 	NODE SEGMENTS			50
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)			51
FIGURE 4.1: METAL & HIGH-K PRECURSOR REVENUE (M USD) FORECAST BY SEGMENT	56
FIGURE 4.2: MEMORY SUPPLY/DEMAND SITUATION 2024					57
FIGURE 4.3: WW MARKET SHARE - METAL & HIGH-K PRECURSORS 2023 (U$ 811 M)	58
FIGURE 4.4: REGIONAL MARKET SHARES						59
FIGURE 4.5: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES 			67
FIGURE 4.6: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME	68
FIGURE 4.7: 3D NAND PROGRESSION   						69
FIGURE 4.8: ETCH DEPTH PERFORMANCE						70
FIGURE 4.9: TOKYO ELECTRON’S NEW CRYOGENIC ETCH TOOL				70
FIGURE 4.10: DRAM MESH BY MICRON 						72
FIGURE 4.11: IMEC CAPACITORLESS IGZO CELL FOR 3D STACKED DRAM			72
FIGURE 4.12: TRANSITION FROM 2D TO 3D DRAM 					73
FIGURE 4.13: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS 				74
FIGURE 4.14: GATE STRUCTURE ROADMAP						75
FIGURE 4.15: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP				76
FIGURE 4.16: LOGIC TRANSISTOR PROGRESSION 					77
FIGURE 4.17: RIBBON FET 							78
FIGURE 4.18: MONO LAYER NANO SHEETS CHANNELS 					80
FIGURE 4.19: NANO IMPRINT LITHOGRAPHY PROCESS FLOW 				81
FIGURE 4.20: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY 			81
FIGURE 4.21: DIRECTED SELF-ASSEMBLY 						82
FIGURE 4.22: DSA PATENT FILING BY COMPANY					83
FIGURE 4.23: DSA PATEN FILING SINCE 2023					83
FIGURE 4.24: WHAT IS PATTERN SHAPING?						84
FIGURE 4.25: REFINING EUV PATTERNING BY APPLIED MATERIALS 			85
FIGURE 4.26: COMPLEMENTARY FET (CFET)						86
FIGURE 4.27: CFET IMPROVES PERFORMANCE IN TRACK SCALING				86
FIGURE 4.28: MONOLITHIC CFET PROCESS FLOW EXAMPLE				87
FIGURE 4.29: MCFET NEW FEATURE: MIDDLE DIELECTRIC ISOLATION			87
FIGURE 4.30: LOW TEMPERATURE GATE STACK OPTION EXAMPLES				88
FIGURE 4.31: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES				88
FIGURE 4.32: BSPDN ADVANTAGE: IR DROP REDUCTION					89
FIGURE 4.33: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION 
GAA-FET AND CFET   								90
FIGURE 4.34: IMEC SUB-1NM TRANSISTOR ROADMAP, 3D-STACKED CMOS 2.0 PLANS		91
FIGURE 4.35: PATENT FILING FOR MLD DEPOSITED EUV RESIST. SEARCH PERFORMED 
IN PATBASE									92
FIGURE 4.36: MOLECULAR LAYER DEPOSITION VS ATOMIC LAYER DEPOSITION 		93
FIGURE 4.37: INCREASING TREND OF ALD/MLD PUBLICATIONS				94
FIGURE 4.38: ADEKA ASD-HF PRECURSORS						98
FIGURE 4.39: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT			99
FIGURE 4.40: SPECIALTY/EMERGING METAL APPLICATIONS				100
FIGURE 4.41: SPECIALTY/EMERGING HIGH-K APPLICATIONS – 
NVM DRAM (MICRON IEDM2023)							101
FIGURE 4.42: 2023 METAL & HIGH-K REVENUE SHARE BY REGION			102
FIGURE 4.43: EHS ISSUES – HIGH-K: MINING IN CHINA				107
FIGURE 4.44: SK HYNIX’S RECYCLED AND RENEWABLE MATERIALS TARGETS 		108
FIGURE 5.1: 2023 PRECURSOR MATERIAL SUPPLIER MARKET SHARE BY REVENUE		114
FIGURE 5.2: MERCK ELECTRONICS REVENUE 2022-2023 (M EUR), LEFT. SEMICONDUCTOR 
SOLUTIONS ANNUAL REVENUE FORECAST (M EUR), RIGHT. 				117
FIGURE 5.3: AIR LIQUIDE ELECTRONICS REVENUE FORECAST (M EUR)			119
FIGURE 5.4: THE MS (MATERIAL SOLUTIONS) DIVISION OF ENTEGRIS REVENUE FORECAST	121
FIGURE 5.5: ADEKA REVENUE ELECTRONICS REVENUE FORECAST (100M JPY)		122
FIGURE 5.6: NEW ZIRCONIUM PRECURSOR CLASS 					129
FIGURE 5.7: ADVANCES IN MOLYBDENUM THIN FILMS: NEW LIQUID PRECURSORS 
BOOST VAPOR PHASE DEPOSITION							130
FIGURE 6.1: FORMING GAS BLENDER CONFIGURATION					142
FIGURE 6.2: TOP COUNTRIES/REGIONS THAT SUPPLY VERSUM MATERIALS US LLC 
(PANJIVA APRIL 2024)								146
FIGURE 6.3: TOP COUNTRIES/REGIONS THAT SUPPLY AIR LIQUIDE AMERICA CORP. 
(PANJEIVA APRIL 2024)								147
FIGURE 6.4: TOP COUNTRIES/REGIONS THAT SUPPLY H.C. STARCK INC. (USA)		148
FIGURE 6.5: PRICE TREND IN COBALT						155
FIGURE 6.6: HAFNIUM 5-YEAR PRICING						157
FIGURE 6.7: GALLIUM PRICE, 5 YEAR HISTORICAL					159
FIGURE 6.8: RUTHENIUM AND PLATINUM, 5-YEAR HISTORICAL PRICING			167
FIGURE 6.9: GERMANIUM PRICE, 5-YEAR HISTORICAL					169

 LIST OF TABLES	
TABLE 1.1: METAL AND HI-K PRECURSORS REVENUES AND GROWTH RATES			15
TABLE 1.2: ESTIMATED METAL AND HIGH-K PRECURSOR MARKETSHARE BY SUPPLIER 2023	18
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES				26
TABLE 3.2: WORLD BANK ECONOMIC OUTLOOK (JANUARY 2024) 				27
TABLE 3.3: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS			34
TABLE 3.4: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2023	38
TABLE 4.1: PRECURSORS REVENUE AND GROWTH RATES					53
TABLE 4.2: METAL AND HI-K PRECURSORS REVENUES AND GROWTH RATES			56
TABLE 4.3: ESTIMATED METAL AND HIGH-K PRECURSOR MARKET SHARE BY SUPPLIER 2023	58
TABLE 4.4: METAL & HIGH-K PRECURSOR MARKET REGIONAL ASSESSMENT 2023		59
TABLE 4.5: OVERVIEW OF ANNOUNCED 2023/2024 MATERIAL SUPPLIER INVESTMENTS	62
TABLE 4.6: LEADING EDGE LOGIC DESCRIPTIONS BY NODE (TSMC, INTEL)		78
TABLE 4.7: SELECTIVE DEPOSITION - SELECTIVELY DEPOSITED MATERIALS		97
TABLE 4.8: REGIONAL PRECURSOR MATERIAL MARKETS					103
TABLE 4.9: REGIONAL PRECURSOR MATERIAL MARKETS, CONTINUED			104
TABLE 5.1: MERCK QUARTER FINANCIALS						115
TABLE 5.2: AIR LIQUIDE CURRENT QUARTER FINANCIALS				118
TABLE 5.3: ENTEGRIS SUPPLIER CURRENT QUARTER FINANCIALS 			120
TABLE 6.1: CVD AND ALD PRECURSOR						145
TABLE 6.2: ORIGIN OF MINERALS USED TO MAKE PRECURSORS 				153
TABLE 6.3: COBALT MINING AND PRODUCTION BY LOCATION				154
TABLE 6.4: ZIRCONIUM AND HAFNIUM MINERAL PRODUCTION BY LOCATION		156
TABLE 6.5: GALLIUM MINERAL PRODUCTION DESCRIPTION AND DEPENDENCIES 		158
TABLE 6.6: ALUMINUM MINERAL REFINING AND PRODUCTION BY LOCATION 		160
TABLE 6.7: TITANIUM ORE (ILMENITE AND RUTILE) PRODUCTION LOCATIONS 		161
TABLE 6.8: TUNGSTEN ORE PRODUCTION BY LOCATION 					162
TABLE 6.9: MOLYBDENUM PRODUCTION AND IMPORT AND EXPORTS				163
TABLE 6.10: MOLYBDENUM PRODUCTION DESCRIPTIONS 					163
TABLE 6.11: NIOBIUM AND TANTALUM PRODUCTION BY LOCATION 			164
TABLE 6.12: RARE EARTHS PRODUCTION BY LOCATION , I.E. LANTHANUM		165
TABLE 6.13: PGM PRODUCTION BY LOCATION  					166
TABLE 6.14: GERMANIUM APPLICATIONS BY PERCENTAGE VOLUME				168

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