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Packaging Materials Individual Chapters (Single User License)

$2,900.00

Chapters of this report can be purchased directly from TECHCET by contacting us here. If you would like to purchase the entire report, please do so at the SEMI website.

• Provides detailed market analysis including market size, forecasts, and market share for packaging materials markets including substrates, leadframes, bonding wire, encapsulation materials, underfill materials, die attach, solder balls, wafer level package dielectrics, and wafer-level plating chemicals.
• Includes a regional market analysis.
• Forecasts for units and revenues out to 2027
• Information for supply-chain managers, procurement teams, marketing managers, and financial analysts
• Includes supply-chain, market, and technical trends information impacting the packaging materials industry.
• Single User License – provides 1 portal access login to techcet.com for one person, using 2FA (two-factor authentication). The 1 user has freedom to use any of the data in the purchased report for internal or external presentations, with proper copyright attribution.*

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Description

Featured Press Release on Packaging Market Updates and Report Highlights:

New Global Semiconductor Packaging Materials Outlook – US$26 Billion market to approach US$30 Billion by 2027

 

Chapters of this report can be purchased directly from TECHCET by contacting us here. If you would like to purchase the entire report, please do so at the SEMI website.

TABLE OF CONTENTS

EXECUTIVE SUMMARY   1 INTRODUCTION Methodology Assumptions Report Organization   2 SEMICONDUCTOR PACKAGING Industry Market Trends Regional and Market Issues Materials Needs – Customer Input End-market Applications   3 SUBSTRATES Laminate Substrates Build-up Substrates Organic Substrates Markets and Forecasts Supply   4 LEADFRAMES Technology Trends Markets and Forecasts Supply   5 BONDING WIRE Technology Trends Markets and Forecasts Supply   6 ENCAPSULATION MATERIALS Technology Trends Markets and Forecasts Supply   7 UNDERFILL MATERIALS Technology Trends Markets and Forecasts Supply   8 DIE ATTACH MATERIALS Technology Trends Markets and Forecasts Supply   9 WAFER LEVEL PACKAGE DIELECTRICS Technology Trends Markets and Forecasts Supply   10 WAFER LEVEL PLATING CHEMICALS Requirements Markets and Forecasts Supply   11 SUMMARY AND CONCLUSIONS   APPENDICES

 

Copyright © 2023 TECHCET AND TECHSEARCH INTERNATIONAL Please RESPECT COPYRIGHT LAWS and do not distribute this document unless additional user licenses have been purchased. Produced by TECHCET, TechSearch International, Inc. and SEMI

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