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Bonding Wire Market Size and Outlook 2023-2024 (Single User License)

$2,900.00

Chapter from the SEMI Global Semiconductor Packaging Materials Outlook Report

• Provides detailed market analysis including market size, forecasts, and market share of the global bonding wire market.
• Covered information includes revenues & units for gold, silver, copper, palladium-coated copper, and aluminum wire
• Includes a regional market analysis.
• Forecasts for bonding wire units and revenues out to 2027
• Information for supply-chain managers, procurement teams, marketing managers, and financial analysts
• Includes supply-chain, market, and technical trends information impacting the bonding wire industry.
• Single User License – provides 1 portal access login to techcet.com for one person, using 2FA (two-factor authentication). The 1 user has freedom to use any of the data in the purchased report for internal or external presentations, with proper copyright attribution.*

For Multi-User License information, click here.

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Description

 

Featured Press Release on Packaging Market Updates and Report Highlights:

New Global Semiconductor Packaging Materials Outlook – US$26 Billion market to approach US$30 Billion by 2027

 

TABLE OF CONTENTS

EXECUTIVE SUMMARY

1 INTRODUCTION
1.1 Methodology
1.2 Assumptions
1.3 Report Organization

2 BONDING WIRE
2.1 Bonding Wire Market Trends
2.2 Bonding Wire Markets
2.3 Bonding Wire Market Forecast
2.4 Bonding Wire Supply

 

Copyright © 2023 TECHCET AND TECHCEARCH INTERNATIONAL Please RESPECT COPYRIGHT LAWS and do not distribute this document unless additional user licenses have been purchased. Produced by TECHCET, TechSearch International, Inc. and SEMI

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