Table of Contents

1 EXECUTIVE SUMMARY   								11
1.1 QUARTZ FABRICATED PARTS BUSINESS – MARKET OVERVIEW 				12
1.1.1 QUARTZ FABRICATED PARTS BUSINESS – MARKET STRUCTURALOVERVIEW		13
1.2 MARKET TRENDS IMPACTING 2024 OUTLOOK 					15
1.3 QUARTZ FABRICATED PARTS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT 		16
1.4 QUARTZ FABRICATED PARTS SEGMENT TRENDS 					17
1.5  TECHNOLOGY TRENDS - QUARTZ FABRICATED PARTS 				18
1.6  COMPETITIVE LANDSCAPE  - QUARTZ FABRICATED PARTS				19 
1.7 FIRST QUARTER 2024 FINANCIALS OF TOP-4 SUPPLIERS				20
1.8  EHS, TRADE, AND/OR LOGISTICS ISSUES/CONCERNS – QUARTZ FABRICATED PARTS 	21
1.9  ANALYST ASSESSMENT OF QUARTZ FABRICATED PARTS 				22

2 SCOPE, PURPOSE AND METHODOLOGY   						23
2.1 SCOPE 									24
2.2 PURPOSE & METHODOLOGY 							25
2.3 OVERVIEW OF OTHER TECHCET CMR™ OFFERINGS 					26

3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK   				23
3.1 WORLDWIDE ECONOMY AND OVERALL INDUSTRY OUTLOOK 				28
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY			30
3.1.2 SEMICONDUCTOR SALES GROWTH						31
3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS			32
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT 					33
3.2.1 ELECTRONICS OUTLOOK							34
3.2.2 AUTOMOTIVE INDUSTRY OUTLOOK						35
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS					36
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS				37
3.2.3 SMARTPHONE OUTLOOK							38
3.2.4 PC OUTLOOK								39
3.2.5 SERVERS / IT MARKET							40
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION 				41
3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS			42
3.3.2 NEW FABS IN THE US							43
3.3.3 WW FAB EXPANSION DRIVING GROWTH 						44
3.3.4 EQUIPMENT SPENDING TRENDS							45
3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS					46
3.3.5.1 DRAM TECHNOLOGY ROADMAPS						47
3.3.5.2 3D NAND TECHNOLOGY ROADMAPS						48
3.3.6 FAB INVESTMENT ASSESSMENT							49
3.4 POLICY & TRADE TRENDS AND IMPACT 						50
3.5 SEMICONDUCTOR MATERIALS OVERVIEW 						51
3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028				52
3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028				53

4 QUARTZ PARTS MARKET TRENDS 							54
4.1 QUARTZ FABRICATED PARTS BUSINESS – MARKET OVERVIEW 				55
4.1.1 2023 QUARTZ FABRICATED PARTS MARKET LEADING INTO 2024			56
4.1.2 QUARTZ FABRICATED PARTS MARKET OUTLOOK					57
4.1.3 QUARTZ FABRICATED PARTS 5-YEAR REVENUE FORECASTBY SEGMENT		58
4.1.4 QUARTZ FABRICATED PARTS PRODUCTION CAPACITY OF TOP SUPPLIERS		59
4.1.5 QUARTZ FABRICATED PARTS PRODUCTION BY REGION 				60
4.1.6 QUARTZ FABRICATED PARTS PRODUCTION CAPACITY EXPANSIONS			61
4.1.7 INVESTMENT ANNOUNCEMENTS OVERVIEW						62
4.1.8 QUARTZ FABRICATED PARTS SUPPLY VS. DEMAND BALANCE – OVERVIEW		63
4.1.8.1  SUPPLY VS. DEMAND BALANCE – QUARTZ FABRICATED PARTS 			64
4.2 PRICING TRENDS 								65
4.3 QUARTZ FABRICATED PARTS GENERAL TECHNOLOGY OVERVIEW 			66
4.3.1 QUARTZ FABRICATED PARTS GENERAL TECHNOLOGY OVERVIEW			67
4.3.2 QUARTZ FABRICATED PARTS APPLICATIONS					68
4.3.3 QUARTZ FABRICATED PARTS GENERAL DESCRIPTION				69
4.3.4 QUARTZ FABRICATED PARTS – WAFER SIZE AND EFFECT ON QUARTZ REQUIREMENTS	71
4.3.5 QUARTZ FABRICATED PARTS TECHNOLOGY TRENDS					72
4.4 REGIONAL CONSIDERATIONS – QUARTZ FABRICATED PARTS				73
4.4.1 REGIONAL ASPECTS AND DRIVERS						74
4.5 EHS AND TRADE/LOGISTIC ISSUES  						76
4.5.1 RUSSIA INVASION OF UKRAINE						77
4.5.2 YEMEN’S HOUTHI ATTACKS IN THE RED SEA AND GULF OF ADEN DISRUPT 
GLOBAL SHIPPING									78
4.5.3 NEW MIDDLE EAST CONFLICT COULD DISRUPT GLOBAL TECH SUPPLY CHAIN AND 
INTEL'S EXPANSION PLANS								79
4.5.4 PANAMA CANAL HISTORIC DROUGHT						80
4.5.5 EHS ISSUES – ENVIRONMENTAL IMPACT						81
4.5.6 TRADE/LOGISTICS ISSUES							82
4.6  ANALYST ASSESSMENT OF QUARTZ FABRICATED PARTS MARKET TRENDS 		83

5 SUPPLY-SIDE MARKET LANDSCAPE 							84
5.1 QUARTZ FABRICATED PARTS MARKET SHARE – FABRICATION MARKET			85
5.1.1 QUARTZ FABRICATED PARTS MARKET SHARE – COLD FABRICATION (MACHINING)	86
5.1.2 QUARTZ FABRICATED PARTS MARKET SHARE – HOT FABRICATION (FUSED)		87
5.1.3  CURRENT QUARTER - SUPPLIERS’ ACTIVITIES & REPORTED REVENUES – QUARTZ	88
5.1.4 FIRST QUARTER 2024 FINANCIALS OF TOP-4 SUPPLIERS				89
5.1.5 CURRENT QUARTER ACTIVITY – SHIN-ETSU					90
5.1.6 CURRENT QUARTER ACTIVITY – TOSOH QUARTZ					91
5.1.7 CURRENT QUARTER ACTIVITY – FERROTEC					92
5.1.8 CURRENT QUARTER ACTIVITY – WONIK						93
5.1.9 CURRENT ACTIVITY – HERAEUS						94
5.2 M&A ACTIVITY AND PARTNERSHIPS 						95
5.3 PLANT CLOSURES – NONE 							96
5.4 NEW ENTRANTS 								97
5.5 SUPPLIERS OR PARTS/PRODUCT LINES THAT ARE AT RISK OF DISCONTINUATIONS 	98
5.6 TECHCET ANALYST ASSESSMENT OF QUARTZ  SUPPLIERS				99

6 SUB-TIER SUPPLY-CHAIN, QUARTZ							100
6.1 SUB-TIER SUPPLY CHAIN: SOURCES & MARKETS OVERVIEW 				101
6.1.1 QUARTZ SUB-TIER SUPPLY-CHAIN MARKET BACKGROUND				102
6.1.2 QUARTZ SUB-TIER SUPPLY-CHAIN MARKET TRENDS				103
6.1.3  QUARTZ BASE MATERIALS 5-YEAR REVENUE FORECAST BY SEGMENT		105
6.1.4 SUB-TIER SUPPLY CHAIN: FUSED QUARTZ BASE MATERIALS MARKET SHARE		106
6.1.5 SUB-TIER SUPPLY CHAIN: FUSED QUARTZ BASE MATERIALS – TUBES AND 
RODS MARKET SHARE								107
6.1.6 SUB-TIER SUPPLY CHAIN: FUSED QUARTZ BASE MATERIALS – INGOTS AND 
BOULES MARKET SHARE								108
6.1.7 SUB-TIER SUPPLY CHAIN: QUARTZ BASE MATERIALS – SAND/POWDER MARKET SHARE	109
6.1.8 SEMICONDUCTOR-GRADE QUARTZ SUB-TIER SUPPLIER NEWS				110
6.2 SUB-TIER SUPPLY-CHAIN – DISRUPTIONS 					111
6.3 SUB-TIER SUPPLY-CHAIN M&A OR PARTNERSHIP ACTIVITY 				112
6.4 SUB-TIER SUPPLY-CHAIN EHS AND LOGISTICS ISSUES – SEE SECTION 4.5 		113
6.5 SUB-TIER SUPPLY-CHAIN “NEW” ENTRANTS – NONE 				114
6.6 SUB-TIER SUPPLY-CHAIN PLANT UPDATES 					115
6.7 SUB-TIER SUPPLY-CHAIN PLANT CLOSURES – NONE REPORTED 			116
6.8 SUB-TIER SUPPLY-CHAIN PRICING TRENDS 					117
6.9 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT 				118

7 SUPPLIER PROFILES (FABRICATORS)						119
APPLIED CERAMICS, INC.
BEIJING KAIDE QUARTZ CO., LTD
DONGHAI HONGWEI QUARTZ PRODUCTS CO., LTD. 
DS TECHNO CO., LTD.
FERROTEC HOLDINGS CORPORATION
…AND 20+ MORE

8 APPENDIX									209
8.1 TECHNOLOGY TRENDS/TECHNICAL DRIVERS – OUTLINE 				210
8.1.1 QUARTZ GENERAL TECHNOLOGY OVERVIEW & TECHNOLOGY TRENDS			211
8.1.2 CUSTOMER DRIVEN TECHNOLOGIES						212
8.1.3 NAND ROADMAPS AND CHALLENGES – 3D NAND LEVELS W/ STACKS/TIERS		213
8.1.4 3D NAND PROCESS ADVANCES REQUIRED						214
8.1.5 MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL-LAYER 32GBIT NON-VOLATILE 
FERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE				215
8.1.6 ADVANCED LOGIC ROADMAPS AND CHALLENGES – LOGIC TRANSISTOR EST. ROADMAP	216
8.1.7 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE				217
8.1.7.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. 
INTEL'S RIBBONFET								218
8.1.8 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES					219
8.1.9 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY			221
8.1.9.1 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY – DSA		222
8.1.9.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: CENTURA SCULPTA 
BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING		224
8.1.9.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: 
LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION					225
8.1.10 CFET ARCHITECTURE: CFET SCALING ADVANTAGE 				226
8.1.10.1 CFET ARCHITECTURE: COMPLEMENTARY FETS (CFETS)				227
8.1.10.2 CFET ARCHITECTURE: CFET FUTURE PROSPECTS				230
8.1.11 INORGANIC EUV RESIST – SPIN ON DEPOSITION				232
8.1.11.1 INORGANIC EUV RESIST – ALD DEPOSITED					233
8.1.12 SELF ALIGNED MULTI PATTERNING – SADP					234
8.1.12.1 SELF ALIGNED MULTI PATTERNING – SAQP					235
8.1.12.2 SELF ALIGNED MULTI PATTERNING – PEALD EQUIPMENT			236
8.1.12.3 SELF ALIGNED MULTI PATTERNING – CAN SAQP BYPASS EUV BEYOND 7 NM?	237
8.1.13  EUV, MULTI PATTERNING AND GEOPOLITICS					238
8.1.14 AREA SELECTIVE DEPOSITION (ASD)						239
8.1.14.1 AREA SELECTIVE DEPOSITION (ASD) – TU EINDHOVEN SELECTIVE ALD 
ENABLED BY PLASMA PRETREATMENT							240
8.1.15  SPECIALTY/EMERGING DIELECTRIC AND APPLICATIONS				241

FIGURES
FIGURE 1.1: QUARTZ FABRICATED PARTS REVENUE FORECAST BY SEGMENT		16
FIGURE 1.2: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE			19
FIGURE 1.3: TOP-4 QUARTZ MAKERS’ QUARTERLY COMBINED SALES (US$M)		20
FIGURE 3.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN  (2023)		30
FIGURE 3.2: WORLDWIDE SEMICONDUCTOR SALES 					31
FIGURE 3.3: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY 
INDEX (TTSII) IN 000’S OF NTD							32
FIGURE 3.4: 2023 SEMICONDUCTOR CHIP APPLICATIONS				33
FIGURE 3.5: GLOBAL LIGHT VEHICLE UNIT SALES (IN MILLIONS OF UNITS)		35
FIGURE 3.6: ELECTRIFICATION TREND BY WORLD REGION 				36
FIGURE 3.7: AUTOMOTIVE SEMICONDUCTOR PRODUCTION					37
FIGURE 3.8: MOBILE PHONE SHIPMENTS, WW ESTIMATES 				38
FIGURE 3.9: WORLDWIDE PC AND TABLET FORECAST					39
FIGURE 3.10: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND	41
FIGURE 3.11: ESTIMATED GLOBAL FAB SPENDING 2023-2028				42
FIGURE 3.12: FAB EXPANSIONS WITHIN THE US					43
FIGURE 3.13: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD		44
FIGURE 3.14: GLOBAL TOTAL EQUIPMENT SPENDING (US$ M) AND Y-O-Y CHANGE		45
FIGURE 3.15: ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP OVERVIEW			46
FIGURE 3.16: DRAM TECHNOLOGY ROADMAP OVERVIEW					47
FIGURE 3.17: 3D NAND TECHNOLOGY ROADMAP OVERVIEW				48
FIGURE 3.18: INTEL OHIO PLANT SITE AS OF FEB. 2024 				49
FIGURE 3.19: TECHCET WAFER START FORECAST BYNODE SEGMENTS			52
FIGURE 3.20: TECHCET WORLDWIDE MATERIALS FORECAST ($M USD)			53
FIGURE 4.1: QUARTZ FABRICATED PARTS REVENUE FORECAST BY SEGMENT		58
FIGURE 4.2: FABRICATED QUARTZ COMPONENTS MARKET SHARE % BY SUPPLIER		59
FIGURE 4.3: 2023 FABRICATED QUARTZ COMPONENTS BY REGION				60
FIGURE 4.4: QUARTZ FABRICATED PARTS CAPACITY/DEMAND FORECAST			64
FIGURE 4.5: QUARTZ PRODUCTS FOR SEMICONDUCTOR APPLICATIONS			68
FIGURE 4.6: QUARTZ PRODUCTS FOR SEMICONDUCTOR APPLICATIONS			69
FIGURE 4.7: QUARTZ PRODUCTS FOR DRY ETCH APPLICATIONS				70	
FIGURE 4.8: QUARTZ PRODUCTS FOR EPI APPLICATIONS				70
FIGURE 4.9: 2023 QUARTZ FABRICATED PARTS  REVENUE SHARE BY REGION		73
FIGURE 4.10: ASSESSED CONTROL OF TERRAIN AROUND DONETSK				77
FIGURE 4.11: YEMEN’S HOUTHI ATTACKS DISRUPTING GLOBAL SHIPPING			78
FIGURE 4.12: MIDDLE EAST CONFLICT						79
FIGURE 4.13: PANAMA CANAL SHIPPING 						80
FIGURE 4.14: GREENHOUSE GAS PROTOCOL, DETAILED CATEGORIES			81
FIGURE 4.15:  SCOPE 3 EMISSIONS FOR SEMICONDUCTOR COMPANIES			81
FIGURE 5.1: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE (HOT & COLD)		85
FIGURE 5.2: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE			86
FIGURE 5.3: 2023 QUARTZ SUPPLIER MARKET SHARE BY REVENUE			87
FIGURE 5.4: TOP-4 QUARTZ MAKERS’ QUARTERLY COMBINED SALES (US$M)		89
FIGURE 5.5: TOSS CORP 2024 FINANCIALS 						91
FIGURE 5.6: WONIK CURRENT QUARTER FINANCIALS 					93
FIGURE 5.7: #2 HERAEUS CONSOLIDATED 2023 FINANCIALS 				94
FIGURE 6.1: QUARTZ PRODUCTS FOR SEMICONDUCTOR APPLICATIONS			101
FIGURE 6.2: QUARTZ BASE MATERIALS REVENUE FORECAST BY SEGMENT			105
FIGURE 6.3: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- 
BASE MATERIAL									106
FIGURE 6.4: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- 
TUBES AND RODS									107
FIGURE 6.5: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- 
INGOT/BOULE									108
FIGURE 6.6: ESTIMATED 2023 FUSED QUARTZ BASE MATERIALS SUPPLIER RANKING- 
2023 QUARTZ POWDER								109
FIGURE 8.1: END USE APPLICATIONS DRIVING NEW DEVICE PROCESSES			212 
FIGURE 8.2: 3D NAND STACKING DRIVES DIELECTRICS AND METALS PRECURSOR VOLUME	213
FIGURE 8.3: 3D NAND PROGRESSION   						214
FIGURE 8.4: 32 GB NVDRAM WITH 1T 1C MEMORY LAYERS				215 
FIGURE 8.5: GATE STRUCTURE ROADMAP						216
FIGURE 8.6: ADVANCED LOGIC (FOUNDRY) NODE ROAD MAP				217
FIGURE 8.7: RIBBON FET 								218
FIGURE 8.8: MONO LAYER NANO SHEETS CHANNELS					220 
FIGURE 8.9: NANO IMPRINT LITHOGRAPHY PROCESS FLOW 				221
FIGURE 8.10: ALD/ALE ENHANCEMENT OF NANO IMPRINT LITHOGRAPHY 			221
FIGURE 8.11: DIRECTED SELF-ASSEMBLY 						222
FIGURE 8.12: DSA PATENT FILING BY COMPANY					223
FIGURE 8.13: DSA PATEN FILING SINCE 2023					223
FIGURE 8.14: WHAT IS PATTERN SHAPING?						224
FIGURE 8.15: REFINING EUV PATTERNING BY APPLIED MATERIALS 			225
FIGURE 8.16: COMPLEMENTARY FET (CFET)						226
FIGURE 8.17: CFET IMPROVES PERFORMANCE IN TRACK SCALING				226
FIGURE 8.18: MONOLITHIC CFET PROCESS FLOW EXAMPLE				227
FIGURE 8.19: MCFET NEW FEATURE- MIDDLE DIELECTRIC ISOLATION			227
FIGURE 8.20: LOW TEMPERATURE GATE STACK OPTION EXAMPLES				228
FIGURE 8.21: LOW TEMPERATURE SD/CONTACT OPTION EXAMPLES				228
FIGURE 8.22: BSPDN ADVANTAGE- IR DROP REDUCTION					229
FIGURE 8.23: INCREASING NUMBER OF ALD STEPS REQUIRED BY NEXT GENERATION 
GAA-FET AND CFET   								230
FIGURE 8.24: IMEC SUB-1NM TRANSISTOR ROADMAP, 3D-STACKED CMOS 2.0 PLANS	231
FIGURE 8.25: INPRIA EUV MOR 							232
FIGURE 8.26: INPRIA SPIN ON INORGANIC RESIST IS MUCH THINNER THAN STANDARD 
STACKS OF PHOTO RESIST								232
FIGURE 8.27: PATENT FILING FOR MLD DEPOSITED EUV RESISTSEARCH PERFORMED 
IN PATBASE									233
FIGURE 8.28: SADP PROCESS FLOW USING ALD SPACER					234 
FIGURE 8.29: ONE OF MANY FLAVORS OF SAQP PROCESS FLOW				235
FIGURE 8.30: SELECTIVE ALD ENABLED BY PLASMA PRETREATMENT			240
FIGURE 8.31: SPECIALTY/EMERGING DIELECTRIC APPLICATIONS FOR HETEROGENOUS 
INTEGRATIONS (APPLIED MATERIALS)						241

TABLES
TABLE 1.1: BREAKOUT OF FABRICATED QUARTZ MARKET BY HOT AND COLD FABRICATION	12
TABLE 3.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES				28
TABLE 3.2: BATTERY ELECTRIC VEHICLE (BEV) REGIONAL TRENDS			36
TABLE 3.3: DATA CENTER SYSTEMS AND COMMUNICATIONSERVICES MARKET SPENDING 2023	40
TABLE 4.1: BREAKOUT OF FABRICATED QUARTZ MARKET BY HOT AND COLD FABRICATION	55
TABLE 4.2: ESTIMATED FABRICATED QUARTZ COMPONENTS SHARE BY SUPPLIER		59
TABLE 4.3: QUARTZ FABRICATED PARTS SUPPLIER MANUFACTURING LOCATIONS 		60
TABLE 4.4:  OVERVIEW OF ANNOUNCED 2023/2024 QUARTZ FABRICATED PARTS 
SUPPLIER INVESTMENTS								62
TABLE 4.5: COMPARISON OF TUBES AND BOATS ATTRIBUTES FOR 
200MM AND 300MM PROCESSES							71
TABLE 4.6: REGIONAL QUARTZ MARKET ATTRIBUTES AND EXPANSION ACTIVITY, (1 OF 2)	74
TABLE 4.7: REGIONAL QUARTZ MARKET ATTRIBUTES AND EXPANSIONACTIVITY, (2 OF 2)	75
TABLE 5.1: MOST RECENT QUARTERLY QUARTZ SUPPLIER SALES (IN US$M)		88
TABLE 5.2: SHIN-ETSU CURRENT QUARTER FINANCIALS (ANNUAL RESULTS) 		90
TABLE 5.3: FERROTEC YOY FINANCIALS 						92
TABLE 5.4: FERROTEC ANNUAL (ENDING 3/2024) FINANCIALS 				92
TABLE 8.1: LEADING EDGE LOGIC DESCRIPTIONS BY NODE (TSMC, INTEL) 		218
TABLE 8.2: MULTIPATTERNING AT 7NM BY TSMC					237
TABLE 8.3: SELECTIVE DEPOSITION - SELECTIVELY DEPOSITED MATERIALS		239