Description
Market Research & Supply-Chain Analysis Report on CMP Slurry & Pads used for Semiconductor Device Manufacturing
1 EXECUTIVE SUMMARY 11
1.1 CMP CONSUMABLES MARKET OVERVIEW 12
1.2 CMP CONSUMABLES REVENUE TRENDS 13
1.3 MARKET TRENDS IMPACTING CMP CONSUMABLES OUTLOOK 14
1.4 YEAR 2021 IN REVIEW 15
1.5 CMP CONSUMABLES FORECASTS BY MATERIAL SEGMENT 16
1.5.1 CMP SLURRIES 5-YEAR REVENUE FORECAST 17
1.5.2 CMP PADS 5-YEAR REVENUE FORECAST 18
1.6 TECHNOLOGY TRENDS 19
1.7 SLURRY SUPPLIER COMPETITIVE LANDSCAPE 20
1.8 PAD SUPPLIER COMPETITIVE LANDSCAPE 21
1.9 ANALYST ASSESSMENT 22
2 SCOPE, PURPOSE AND METHODOLOGY 24
2.1 SCOPE 25
2.2 PURPOSE 26
2.3 METHODOLOGY 27
2.4 OVERVIEW OF OTHER TECHCET CMR™ REPORTS 28
3 SEMICONDUCTOR INDUSTRY MARKET STATUS & OUTLOOK 29
3.1 WORLDWIDE ECONOMY 30
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY 32
3.1.2 SEMICONDUCTOR SALES GROWTH 33
3.1.3 TAIWAN MONTHLY SALES TRENDS 34
3.2 ELECTRONIC GOODS MARKET 35
3.2.1 SMARTPHONES 36
3.2.2 PC UNIT SHIPMENTS 37
3.2.1.1 ELECTRIC VEHICLE (EV) MARKET TRENDS 38
3.2.1.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS 39
3.2.3 SERVERS / IT MARKET 40
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION 41
3.3.1 FAB EXPANSION ANNOUNCEMENT SUMMARY 42
3.3.2 WW FAB EXPANSION DRIVING GROWTH 43
3.3.3 EQUIPMENT SPENDING TRENDS 44
3.3.4 TECHNOLOGY ROADMAPS 45
3.3.5 FAB INVESTMENT ASSESSMENT 46
3.4 POLICY & TRADE TRENDS AND IMPACT 47
3.4.1 POLICY AND TRADE ISSUES 48
3.5 SEMICONDUCTOR MATERIALS OUTLOOK 49
3.5.1 COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION
SCHEDULES? 50
3.5.2 CONTINUED LOGISTICS ISSUES PLAGUE THE WESTERN WORLD 51
3.5.3 TECHCET WAFER STARTS FORECAST THROUGH 2026 52
3.5.4 TECHCET WAFER START FORECAST 53
3.5.5 TECHCET’S MATERIALS FORECAST 54
4 CMP CONSUMABLES MARKET TRENDS 55
4.1 CMP CONSUMABLES MARKET TRENDS 56
4.2 TECHNICAL DRIVERS / MATERIAL CHANGES AND TRANSITIONS 57
4.2.1 3D NAND ROADMAP 59
4.2.2 3D NAND XTACKING 60
4.2.3 TECHNICAL TRENDS IN ADVANCED PACKAGING 61
4.2.4 TECHNICAL TRENDS IN ADVANCED PACKAGING CONTINUE 62
4.2.5 CMP FOR TSV 63
4.2.6 CHALLENGES FACING REDISTRIBUTION LAYER (RDL) PROCESSES 64
4.3 TECHNICAL TRENDS IN COMPOUND SEMICONDUCTOR 65
4.3.1 SILICON CARBIDE POWER DEVICE REVENUE 66
4.3.2 SILICON CARBIDE WAFER SUPPLY AND DEMAND 67
4.3.3 CMP OF SILICON CARBIDE 68
4.3.4 SILICON CARBIDE DEFECTS 69
4.3.5 CMP CHALLENGES IN SILICON CARBIDE 70
4.4 REGIONAL TRENDS 71
4.4.1 REGIONAL TRENDS AND DRIVERS 72
4.5 EHS AND LOGISTIC ISSUES 74
4.5.1 EHS ISSUES FOR NEW MATERIALS 75
4.5.2 LOGISTIC ISSUES 76
4.5.3 EHS ISSUES FOR SLURRY DISPOSAL, RECYCLING AND RECLAIM 77
5 CMP SLURRY MARKET SHARES 78
5.1 CMP SLURRIES 5-YEAR REVENUE FORECAST 79
5.2 CMP SLURRIES 5-YEAR FORECAST BY UNITS 80
5.3 CMP SLURRY MARKET LEADERS 81
5.3.1 TOTAL SLURRY MARKET SHARE 82
5.3.2 OXIDE (CERIA) SLURRY MARKET 83
5.3.2.1 OXIDE (CERIA) SLURRY MARKET, CONTINUED 84
5.3.3 HKMG SLURRY MARKET 85
5.3.3.1 HKMG SLURRY MARKET, CONTINUED 86
5.3.4 POLYSILICON SLURRY MARKET 87
5.3.4.1 POLYSILICON SLURRY FOR MEMS 88
5.3.5 OXIDE (SILICA) SLURRY MARKET 89
5.3.6 TUNGSTEN SLURRY MARKET 90
5.3.7 CU BULK SLURRY MARKET 91
5.3.8 COPPER BARRIER SLURRY MARKET 92
5.3.8.1 COPPER BARRIER SLURRIES, CONTINUED 93
5.3.9 NEW METALS SLURRY MARKET 94
5.4 CMP SLURRY M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS 95
5.5 CMP SLURRY PLANT CLOSURES 97
5.6 NEW ENTRANTS 98
5.7 SUPPLIERS OR PARTS/PRODUCT LINE THAT ARE AT RISK OF
DISCONTINUATIONS 99
5.8 CMP SLURRY PRICING TRENDS 100
5.9 TECHCET ANALYST ASSESSMENT OF CMP SLURRY MARKET 101
6 CMP PAD MARKET STATISTICS & FORECASTS 103
6.1 CMP PADS 5-YEAR REVENUE FORECAST 104
6.1.1 CMP PADS 5-YEAR REVENUE FORECAST 105
6.2 CMP PADS 5-YEAR FORECAST BY UNITS 106
6.3 CMP PAD PLANT CLOSURES 107
6.4 NEW ENTRANTS 108
6.5 SUPPLIERS OR PARTS/PRODUCT LINE THAT ARE AT RISK OF
DISCONTINUATIONS 109
6.6 CMP PAD M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS 110
6.7 CMP PAD PRICING TRENDS 111
6.8 TECHCET ANALYST ASSESSMENT 112
7 MATERIAL SUB-TIER SUPPLY 114
7.1 ABRASIVE SUPPLIERS 115
7.2 VERTICALLY INTEGRATED SUPPLIERS 116
7.3 RAW SUPPLY CHAIN DISRUPTORS 117
7.4 RAW MATERIALS M&A ACTIVITY 118
7.5 ABRASIVE SUPPLY-CHAIN EHS AND LOGISTICS ISSUES 119
7.6 ABRASIVE SUPPLY CHAIN “NEW” ENTRANTS 120
7.7 ABRASIVE SUPPLY-CHAIN PLANTS UPDATES-NEW 121
7.8 ABRASIVE SUPPLY-CHAIN PLANT CLOSURES 122
7.9 ABRASIVE SUPPLY-CHAIN PRICING TRENDS 123
7.10 SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT 124
8 SUPPLIER PROFILES 125
ACE NANOCHEM
ANJI MICRO SHANGHAI
ASASHI GLASS
BASF
CABOT MICROELECTRONICS
DUPONT
EMINESS TECHNOLOGIES, INC.(PUREON)
FERRO
FUJIFILM PLANAR SOLUTIONS
FUJIMI CORP.
...and many more
9 APPENDIX 331
APPENDIX A: CMP CONSUMABLES OVERVIEW 332
APPENDIX B: TECHNICAL TRENDS IN SIC 129
APPENDIX C: PAD MANUFACTURING COST DRIVERS 340
TABLE OF FIGURES
FIGURE 1: FORECASTED 2022 MARKET SIZE 12
FIGURE 2: CMP CONSUMABLES FORECAST 13
FIGURE 3: CMP STEPS FOR ADVANCED DEVICES 14
FIGURE 4: 2021 CMP CONSUMABLES REVENUE 15
FIGURE 5: CMP CONSUMABLES REVENUE BY APPLICATION 16
FIGURE 6: CMP SLURRY REVENUE BY APPLICATION 17
FIGURE 7: CMP PAD REVENUE BY APPLICATION 18
FIGURE 8: 2D DEVICE ARCHITECTURE EVOLUTION 19
FIGURE 9: 2021 SLURRY SUPPLIER MARKET SHARES 20
FIGURE 10: 2021 PAD SUPPLIER MARKET SHARES 21
FIGURE 11: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN
(2021) 32
FIGURE 12: WORLDWIDE SEMICONDUCTOR SALES 33
FIGURE 13: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX* 34
FIGURE 14: SEMICONDUCTOR CHIP APPLICATIONS 35
FIGURE 15: MOBILE PHONE SHIPMENTS WW ESTIMATES 36
FIGURE 16: WORLDWIDE PC AND TABLET FORECAST, 2021, Q3 37
FIGURE 17: GLOBAL EV TRENDS 38
FIGURE 18: SEMICONDUCTOR SPEND PER VEHICLE TYPE 39
FIGURE 19: TSMC CONSTRUCTION SITE IN ARIZONA. 41
FIGURE 20: CHIP EXPANSIONS 2021-2026 > US$460 B 42
FIGURE 21: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF
THE WORLD 43
FIGURE 22: 3-MONTH AVERAGE SEMICONDUCTOR EQUIPMENT BILLINGS 44
FIGURE 23: OVERVIEW OF DEVICE TECHNOLOGY ROADMAP 45
FIGURE 24: EUROPE CHIP EXPANSION UPSIDE 50
FIGURE 25: TECHCET WAFER START FORECAST BY NODE 52
FIGURE 26: TECHCET WAFER START FORECAST BY NODE 53
FIGURE 27: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK 54
FIGURE 28: CMP CONSUMABLES REVENUE FOR 2022 56
FIGURE 29: NUMBER OF CMP STEPS FOR ADVANCED TECHNOLOGY NODES 57
FIGURE 30: 14NM VS. 3NM METALLIZATION TECHNIQUES 58
FIGURE 31: COMPARISON OF MATERIAL CHARACTERISTICS OF METALS 58
FIGURE 32: XTACKING HYBRID BONDING TECHNOLOGY FOR 3D NAND 60
FIGURE 33: CMP OPPORTUNITIES IN ADVANCED PACKAGING 61
FIGURE 34: KEY TRENDS IN ADVANCED PACKAGING 62
FIGURE 35: CMP OPPORTUNITIES IN ADVANCED PACKAGING 63
FIGURE 36: RDL CHALLENGES FOR ADVANCED PACKAGING 64
FIGURE 37: POWER SIC DEVICE MARKET REVENUES 66
FIGURE 38: SILICON CARBIDE WAFER DEMAND BY APPLICATION 67
FIGURE 39: SILICON CARBIDE-BASED POWER DEVICE 68
FIGURE 40: DEFECTS IN SILICON CARBIDE SUBSTRATES AND EPI WAFERS 69
FIGURE 41: SILICON CARBIDE DEFECTS 69
FIGURE 42: BATCH POLISH VS. CMP 70
FIGURE 43: SLURRY AND PAD REVENUE BY HQ REGION 71
FIGURE 44: CMP SLURRY REVENUE BY APPLICATION 79
FIGURE 45: FORECASTED SLURRY VOLUME DEMAND 80
FIGURE 46: SLURRY SUPPLIER MARKET SHARES IN 2021 82
FIGURE 47: OXIDE (CERIA) SLURRY MARKET SHARES 83
FIGURE 48: STI CMP PROCESS 84
FIGURE 49: HKMG/FRONT-END SLURRY MARKET SHARES 85
FIGURE 50: POLYSILICON SLURRY MARKET SHARES 87
FIGURE 51: MEMS CMP CROSS SECTION 88
FIGURE 52: OXIDE (SILICA) SLURRY MARKET SHARES 89
FIGURE 53: TUNGSTEN SLURRY MARKET SHARES 90
FIGURE 54: CU-BULK SLURRY MARKET SHARES 91
FIGURE 55: CU-BARRIER CMP SLURRY MARKET SHARE 92
FIGURE 56: NEW METALS SLURRY MARKET SHARES 94
FIGURE 57: CMP PAD REVENUE BY APPLICATION 104
FIGURE 58: CMP PAD REVENUE BY WAFER SIZE 105
FIGURE 59: FORECASTED PAD USAGE 106
FIGURE 60: CMP FOR IC MANUFACTURING PROCESS 333
FIGURE 61: IC1000 LIKE PAD CROSS-SECTION 342
FIGURE 62: IC1000 SEM CROSS-SECTION 343
TABLES
TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES* 30
TABLE 2: IMF ECONOMIC OUTLOOK* 31
TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES
FORECAST 2021 40
TABLE 4: 3D NAND ROADMAP BY NODE 59
TABLE 5: SILICON CARBIDE WAFER MANUFACTURERS 65
TABLE 6: CONSUMABLES SUPPLIERS 66
TABLE 7: REGIONAL WAFER MARKETS 72
TABLE 8: REGIONAL WAFER MARKETS BY SUPPLIER HEADQUARTER
REGION 73
TABLE 9: 2022 SLURRY MARKET LEADERS AND TAM BY APPLICATION 81
TABLE 10: ABRASIVE SUPPLIERS 115
TABLE 11: VERTICALLY INTEGRATED SUPPLIERS 116
TABLE 12: PHYSICAL AND ELECTRICAL PROPERTY COMPARISON OF SI
AND SIC 335
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