Metal Chemicals for FE & Advanced Packaging Market Report CMR 2023-2024 (Single User License)

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•Provides strategic market and supply-chain analysis on metal plating chemicals used for semiconductor manufacturing including advanced packaging (wafer level) and semiconductor device manufacturing (damascene process) applications.
•Covers information about forecasts for copper plating and additives, market shares, technical trends, and supplier profiles.
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Description

This report covers the Metal Chemicals market trends and supply-chain as it applied to Advanced Packaging (wafer level) and Semiconductor Device Manufacturing (damascene process). Included are forecasts for copper plating and additives, market shares, technical trends, and supplier profiles. Also included in the appendix is a supplier product comparison table of publicly available information on plating products used for advanced packaging.
 

Featured Press Release on Metal Chemicals Market Updates and Report Highlights:

Table of Contents:

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1.1 EXECUTIVE SUMMARY 	     9			                  
1.1 EXECUTIVE SUMMARY                                                10​
1.2 ADVANCED PACKAGING PER WAFER STARTS                              11​
1.3 DEVICE DEMAND DRIVERS  - LOGIC                                   12​
1.4 CU PLATING FORECAST FOR CU INTERCONNECTS AND ​ADVANCED PACKAGING  13​
1.5 MARKET SHARES                                                    14​
1.6 SUPPLIER ACTIVITIES – VARIOUS ANNOUNCEMENTS                      15 ​
1.7  RISK FACTORS                                                    16​
1.8  ANALYST ASSESSMENT                                              17

2 SCOPE, PURPOSE AND METHODOLOGY	18
2.1 SCOPE                                                            19​
2.2 PURPOSE                                                          20​
2.3 METHODOLOGY                                                      21​
2.4 OVERVIEW OF OTHER TECHCET CMR™ REPORTS                           22​

3 SEMICONDUCTOR INDUSTRY MARKET OUTLOOK	      23
3.1 WORLDWIDE ECONOMY                                                24​
3.1.1  SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY           26​
3.1.2 SEMICONDUCTOR SALES GROWTH                                     27​
3.1.3 TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS             28​
3.2 CHIPS SALES BY ELECTRONIC GOODS SEGMENT                          29
3.2.1 SMARTPHONES                                                    30​
3.2.2 PC UNIT SHIPMENTS                                              31​
3.2.3  SERVERS / IT MARKET                                           34​
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION                     35​
3.3.1 FAB EXPANSION ANNOUNCEMENT SUMMARY                             36​
3.3.2 WW FAB EXPANSION DRIVING GROWTH                                38​
3.3.3 EQUIPMENT SPENDING TRENDS                                      39​
3.3.4 TECHNOLOGY ROADMAPS                                            40​
3.3.5 FAB INVESTMENT ASSESSMENT                                      41​
3.4 POLICY & TRADE TRENDS AND IMPACT                                 42​
3.5 SEMICONDUCTOR MATERIALS OUTLOOK                                  43​
3.5.1 COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION ​SCHEDULES?      44​
3.5.2 LOGISTICS ISSUES EASED DOWN                                    45​
3.5.3 TECHCET WAFER STARTS FORECAST THROUGH 2027                     46​
3.5.4 TECHCET’S MATERIAL FORECAST                                    47​

4 METAL CHEMICALS MARKET BY SEGMENT	48
4.1 DEFINITIONS                                                      49​
4.1.1 DEFINITIONS, CONTINUED                                         50​
4.2 METAL PLATING CHEMICALS MARKET OVERVIEW                          51​
4.2.1 OVERVIEW – CU ADVANCED PACKAGING AND CHIP ​
INTERCONNECTS METALLIZATION                                          52​
4.2.2 OVERVIEW - PLATING MARKET TRANSITIONAL TRENDS                  53​
4.3  ADVANCED PACKAGING METALLIZATION – ​MARKET DRIVERS               54​
4.3.1 ADVANCED PACKAGING - ADDITIVES FOR CU ​PLATING REVENUE          55​
4.3.2 ADVANCED PACKAGING – COPPER CHEMICALS REVENUE                  56​
4.3.3  ADVANCED PACKAGING ADDITIVE VOLUMES                           57​
4.3.4  OTHER PLATING MATERIALS FOR ADVANCED PACKAGING                58​
4.3.5 SN / SNAG PLATING                                              59​
4.4 CHIP INTERCONNECTS GROWTH TRENDS                                 61​
4.4.1 CHIP INTERCONNECTS GROWTH DRIVERS                              62​
4.4.2 CHIP INTERCONNECTS CU PLATING REVENUES                         63​
4.4.3  CHIP INTERCONNECTS ADDITIVE VOLUMES                           64​
4.5 MINE LOCATIONS FOR METALS IN PLATING CHEMICALS                   64​
4.6 POSSIBLE CHOKE POINTS FOR METALS USED IN IC PLATING              66​
4.7 FUTURE POSSIBLE DEMAND PRICE PRESSURES                           67

5 TECHNICAL TRENDS	68
5.1 CHEMISTRIES USE FOR SEMICONDUCTOR METAL PLATING                  69​
5.2 PACKAGING TECH TRENDS                                            70​
5.2.1 PACKAGING TECHNICAL CHALLENGES                                 71​
5.3 TECH TRENDS                                                      72​
5.3.1 MARKET DRIVES TECHNOLOGY TRENDS                                73​
5.3.2 ADV LOGIC INTERCONNECT WIRING TECHNOLOGY EVOLUTION             74​
5.3.3  CU INTERCONNECTS QUALIFICATION REQUIREMENTS                   76
5.3.4  LOGIC METALLIZATION ROADMAP                                   77​
5.3.5 ADV LOGIC BURIED POWER RAIL                                    79​
5.3.6  TECHNOLOGY ROADMAP: DRAM WITH  MO OR RU                       80​
5.3.7 PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO ​OR RU           82​
5.3.8 EXAMPLE OF LOGIC PRO CESS FLOW 20 NM TO 32 NM ​LOGIC PVD        84​
5.3.9 TECHNICAL REQUIREMENTS SUMMARY 1/2                             85​

6 COMPETITIVE LANDSCAPE		87
6.1 TOTAL ADVANCED PACKAGING AND INTERCONNECTS MARKET SHARES         88​
6.2  OEM MARKET SHARE – PLATING EQUIPMENT                            89​
6.3  MARKET SHARE BY APPLICATION – CU PLATING FOR ​ADVANCED PACKAGING 90​
6.4   REGIONAL PLAYERS AND OTHERS                                    91​
6.5  M&A ACTIVITY                                                    92

7 ANALYST ASSESSMENT  		93
7.1  ADVANCED METAL PLATING APPLICATIONS MARKET ASSESSMENT ​          94

8 SUPPLIER PROFILES		95
ATOTECH​
BASF ​
DUPONT ​
INCHEON CHEMICAL COMPANY ​
ISHIHARA CHEMICAL/UNICON ​
...AND MORE

9 APPENDIX A: PACKAGING TECH TRENDS   158
9.1 TECHNOLOGY CHALLENGE                                             159​
9.1.1 METAL CLEANINGS CHALLENGE                                      160​
9.1.2 MARKET DYNAMIC                                                 161​
9.1.3 IDM – WAFER LEVEL PLATING                                      162​
9.1.4 MARKET DRIVERS OF ADVANCED PACKAGING APPLICATIONS              163​
9.1.5 TECH TRENDS – RDL                                              164​
9.1.6 INTERPOSERS (NOT WLPS)                                         166​
9.1.7 TSV FILLING 2.5-3D                                             168​
9.1.8 PACKAGING ELECTROPLATING REQUIREMENTS                          169

List of Figures
FIGURE 1: PLATING MATERIALS FOR ADVANCED PACKAGING ​AND 
INTERCONNECT REVENUES ($M’S)                                         10​
FIGURE 2:  WAFERS/YR & % OF PACKAGING THAT IS ADVANCED ​
PACKAGING (AP)                                                       11​
FIGURE 3: WAFER STARTS FORECAST - ADV. LOGIC DEVICE                  12​
FIGURE 4: COPPER PLATING CHEMICALS REVENUES ($M’S) ​
FOR ADVANCED PACKAGING & DEVICE CU INTERCONNECTS                     13​
FIGURE 5: TOTAL PLATING MARKET SHARES FOR ADVANCED ​
PACKAGING AND SEMICONDUCTOR DEVICE MFG. 2022                         14​
FIGURE 6: GLOBAL ECONOMY AND THE ELECTRONICS ​SUPPLY CHAIN  (2022)    26​
FIGURE 7: WORLDWIDE SEMICONDUCTOR SALES                              27​
FIGURE 8: SEMICONDUCTOR INDUSTRY TREND INDICATOR –​
TOP TAIWAN COMPANY REVENUES                                          28​
FIGURE 9: 2022 SEMICONDUCTOR CHIP APPLICATIONS                       29​
FIGURE 10: MOBILE PHONE SHIPMENTS WW ESTIMATES                       30​
FIGURE 11: WORLDWIDE PC AND TABLET FORECAST                          31​
FIGURE 12: ELECTRIFICATION TREND BY WORLD REGION                     32​
FIGURE 13: SEMICONDUCTOR AUTOMOTIVE PRODUCTION                       33​
FIGURE 14: TSMC PHOENIX INVESTMENT ESTIMATED WILL ​BE US US$40 B      35​
FIGURE 15: CHIP EXPANSIONS 2022-2027 US$500 B                        36​
FIGURE 16: SEMICONDUCTOR CHIP MANUFACTURING REGIONS ​
OF THE WORLD                                                         38​
FIGURE 17: REVENUE FORECAST - GLOBAL TOTAL EQUIPMENT ​
SPENDING BY SEGMENT (USUS$ B)                                        39​
FIGURE 18: OVERVIEW OF ADVANCED LOGIC DEVICE ​
TECHNOLOGY ROADMAP                                                   40​
FIGURE 19: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST ​
RENDERING (ON BOTTOM)                                                41​
FIGURE 20: EUROPE CHIP EXPANSION UPSIDE                              44​
FIGURE 21: PORT OF LA                                                45​
FIGURE 22:  TECHCET WAFER START FORECAST BY NODE SEGMENTS**          46​
FIGURE 23:  GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK                   47​
FIGURE 24: PACKAGING METALLIZATION APPLICATIONS                      49​
FIGURE 25: USE OF SILICON INTERPOSER                                 50​
FIGURE 26:  VERSIONS OF TSV & PROCESS FLOW EXAMPLE                   50​
FIGURE 27: PLATING MATERIALS FOR ADVANCED PACKAGING AND ​
DEVICE CU INTERCONNECT REVENUES ($M’S)                               51​
FIGURE 28: 5-YEAR REVENUE FORECAST – CU PLATING CHEMICALS            52​
FIGURE 29: WAFERS/YR & % OF PACKAGING THAT IS ​ADVANCED PACKAGING     54​
FIGURE 30: REVENUE FORECAST – CU PLATING ​ADVANCED PACKAGING          55​
FIGURE 31: REVENUE FORECAST - CU PILLAR & CU RDL SEGMENTED           56​
FIGURE 32: ADV. PACKAGING CU CUSO4 AMOUNT DEMAND FORECAST            57​
FIGURE 33: ADV. PACKAGING CU/VMS VOLUME DEMAND FORECAST ​
ADV. PACKAGING CU PLATING ADDITIVES                                  57​
FIGURE 34: MATERIALS STACK USING CU PILLAR (< 40 UM PITCH)           58​
FIGURE 35: SN AND SNAG PLATING REVENUE                               59​
FIGURE 36: REVENUE FORECAST - NICKEL PLATING REVENUE                 60 ​
FIGURE 37: WAFER START FORECAST - ADV LOGIC DEVICE ​GROWTH FORECAST   61​
FIGURE 38: METAL PLATING WAFER PASSES FORECAST                       62​
FIGURE 39: WW COPPER INTERCONNECT PLATING REVENUE ​FORECAST ESTIMATES 63​
FIGURE 40: INTERCONNECT CU PLATING CHEMICAL AMOUNT ​DEMAND FORECAST   64​
FIGURE 41: INTERCONNECT CU PLATING ADDITIVES CHEMICAL ​
VOLUME DEMAND FORECAST                                               64​
FIGURE 42: KEY TRENDS IN ADVANCED PACKAGING                          70​
FIGURE 43: CHALLENGES OF ELECTROPLATING VIA FILL                     71​
FIGURE 44: METAL INTERCONNECTS BY LOGIC NODE                         73​
FIGURE 45: INTERCONNECT METAL COMPARISON BY RESISTIVITY              74​
FIGURE 46: CU CHIP INTERCONNECTS QUALIFICATION                       76​
FIGURE 47: LEADING EDGE LOGIC POWER RAIL SCHEMES                     79​
FIGURE 48: DRAM STRUCTURE                                            80​
FIGURE 49: 3D NAND STRUCTURE                                         82​
FIGURE 50: TOTAL PLATING FOR ADV. PACKAGING AND ​
CU INTERCONNECT DEVICE MANUFACTURING 2022                            88​
FIGURE 51: PLATING EQUIPMENT OEM MARKET SHARES % 2022                89​
FIGURE 52: PLATING CHEMICAL SUPPLIER FOR INTERCONNECTS ​
AND ADVANCED PACKAGING APPLICATIONS                                  90​
FIGURE 53: CLEANING COMPLEXITY CANNIBALIZATION TREND                 97​
FIGURE 54: OSATS PACKAGING BUSINESS                                  99​
FIGURE 55: WAFER LEVEL PLATING                                       100​
FIGURE 56: ADVANCED PACKAGING MARKET DRIVERS AND​ APPLICATIONS        101​
FIGURE 57: COMPARISON WITH DAMASCENE- TYPE RDL                       103​
FIGURE 58:  USE OF SILICON INTERPOSER                                104​
FIGURE 59: APPLE EXAMPLE INTERPOSERS                                 105​
FIGURE 60: TSV PROCESS FLOW EXAMPLE                                  106

List of Tables
TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES*                      24​
TABLE 2: IMF ECONOMIC OUTLOOK*                                       25​
TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES ​
MARKET SPENDING 2022                                                 34​
TABLE 4: IRDS 2022 MORE MOORE INTERCONNECT ROADMAP ​
(2023 NOT YET RELEASED)                                              75​
TABLE 5: LOGIC DEVICE ROADMAP FOR METALS                             77​
TABLE 6: METALS REQUIRED FOR DEVICE FEATURES                         78​
TABLE 7: DRAM USE OF MO OR RU PRESENT & FUTURE                       80​
TABLE 8: GENERAL PROCESS FLOW ADVANCED DRAM                          81​
TABLE 9: 3D NAND MATERIAL CHANGES PRESENT & FUTURE                   82​
TABLE 10: NUMBER OF STACKS (S) & LAYERS (L) PER GENERATION OF ​
3DNAND – SOME ARE ESTIMATES FOR THE FUTURE                           83​
TABLE 11: EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM ​
LOGIC PVD                                                            84​
TABLE 12: TECHNICAL REQUIREMENTS SUMMARY                             85​
TABLE 13: TECHNICAL REQUIREMENTS SUMMARY                             86​
TABLE 14: REGIONAL PLAYERS – MARKET LEADER AND “OTHERS”              91​
TABLE 15: CU PACKAGING APPLICATIONS AND REQUIREMENTS                 108​
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