Description
This report covers the Metal Chemicals market trends and supply-chain as it applied to Advanced Packaging (wafer level) and Semiconductor Device Manufacturing (damascene process). Included are forecasts for copper plating and additives, market shares, technical trends, and supplier profiles. Also included in the appendix is a supplier product comparison table of publicly available information on plating products used for advanced packaging.
Featured Press Release on Metal Chemicals Market Updates and Report Highlights:
Table of Contents:
Click here for a pdf download of table of contents
1.1 EXECUTIVE SUMMARY 8 1.1 EXECUTIVE SUMMARY 9 1.2 ADVANCED PACKAGING PER WAFER STARTS 10 1.3 DEVICE DEMAND DRIVERS - LOGIC 11 1.4 CU PLATING FORECAST FOR DAMASCENE (FE) AND ADVANCED PACKAGING 12 1.5 MARKET SHARES 13 1.6 SUPPLIER ACTIVITIES – VARIOUS ANNOUNCEMENTS 14 1.7 RISK FACTORS 15 1.8 ANALYST ASSESSMENT 16 2 SCOPE, PURPOSE AND METHODOLOGY 17 2.1 SCOPE 18 2.2 PURPOSE 19 2.3 METHODOLOGY 20 2.4 OVERVIEW OF OTHER TECHCET CMR™ 2022 REPORTS 21 3 SEMICONDUCTOR INDUSTRY MARKET OUTLOOK 22 3.1 WORLDWIDE ECONOMY 23 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY 25 3.1.2 SEMICONDUCTOR SALES GROWTH 26 3.1.3 TAIWAN MONTHLY SALES TRENDS 27 3.1.4 UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023 – SLOWER TO NEGATIVE SEMI REVENUE GROWTH EXPECTED 28 3.2 ELECTRONIC GOODS MARKET 29 3.2.1 SMARTPHONES 30 3.2.2 PC UNIT SHIPMENTS 31 3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS 32 3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS 33 3.2.3 SERVERS / IT MARKET 34 3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION 35 3.3.1 FAB EXPANSION ANNOUNCEMENT SUMMARY 36 3.3.2 WW FAB EXPANSION DRIVING GROWTH 37 3.3.3 EQUIPMENT SPENDING TRENDS 38 3.3.4 TECHNOLOGY ROADMAPS 39 3.3.5 FAB INVESTMENT ASSESSMENT 40 3.4 POLICY & TRADE TRENDS AND IMPACT 41 3.4.1 POLICY AND TRADE ISSUES 42 3.5 SEMICONDUCTOR MATERIALS OUTLOOK 43 3.5.1 COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES? 44 3.5.2 CONTINUED LOGISTICS ISSUES PLAGUE THE WESTERN WORLD 45 3.5.3 TECHCET WAFER STARTS FORECAST THROUGH 2026 46 3.5.3.1 TECHCET WAFER START MODELING METHODOLOGY 47 3.5.4 TECHCET’S MATERIAL FORECAST 48 4 METAL CHEMICALS MARKET BY SEGMENT 49 4.1 DEFINITIONS 50 4.1.1 DEFINITIONS, CONTINUED 51 4.2 METAL PLATING CHEMICALS MARKET OVERVIEW 52 4.2.1 OVERVIEW - ADVANCED PACKAGING AND DAMASCENE METALLIZATION 53 4.2.2 OVERVIEW - PLATING MARKET TRANSITIONAL TRENDS 54 4.3 ADVANCED PACKAGING METALLIZATION – MARKET DRIVERS 55 4.3.1 ADVANCED PACKAGING - ADDITIVES FOR CU PLATING REVENUE 56 4.3.2 ADVANCED PACKAGING – COPPER CHEMICALS REVENUE 57 4.3.3 ADVANCED PACKAGING ADDITIVE VOLUMES 58 4.3.4 OTHER PLATING MATERIALS FOR ADVANCED PACKAGING 59 4.3.5 SN / SNAG PLATING 60 4.3.5.1 WW NI PLATING MARKET FORECAST 61 4.4 DAMASCENE GROWTH TRENDS 62 4.4.1 DAMASCENE GROWTH DRIVERS 63 4.4.2 DAMASCENE CU PLATING REVENUES 64 4.4.3 DAMASCENE ADDITIVE VOLUMES 65 5 TECHNICAL TRENDS 66 5.1 PACKAGING TECH TRENDS 67 5.1.1 PACKAGING TECHNICAL CHALLENGES 68 5.2 TECH TRENDS 69 5.2.1 MARKET DRIVES TECHNOLOGY TRENDS 70 5.2.2 ADV LOGIC INTERCONNECT WIRING TECHNOLOGY EVOLUTION 71 5.2.2.1 TRENDS - MOL AND BEOL IRDS ROADMAP 72 5.2.3 CU DAMASCENE QUALIFICATION REQUIREMENTS 73 5.2.4 LOGIC METALLIZATION ROADMAP 74 5.2.4.1 INTERCONNECT FOR ADVANCED LOGIC 75 5.2.5 ADV LOGIC BURIED POWER RAIL 76 5.2.6 TECHNOLOGY ROADMAP: DRAM WITH MO OR RU 77 5.2.6.1 GENERAL PROCESS FLOW ADVANCED DRAM 78 5.2.7 PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO OR RU 79 5.2.7.1 3D-NAND GENERATIONS 2020 -2025 80 5.2.8 EXAMPLE OF LOGIC PRO CESS FLOW 20 NM TO 32 NM LOGIC PVD 81 5.2.8 TECHNICAL REQUIREMENTS SUMMARY 1/2 82 5.2.8.1 TECHNICAL REQUIREMENTS SUMMARY 2/2 83 6 COMPETITIVE LANDSCAPE 84 6.1 TOTAL ADVANCED PACKAGING AND DAMASCENE MARKET SHARES 85 6.2 OEM MARKET SHARE– PLATING EQUIPMENT 86 6.3 MARKET SHARE BY APPLICATION – CU PLATING FOR ADVANCED PACKAGING 87 6.4 REGIONAL PLAYERS AND OTHERS 88 6.5 M&A ACTIVITY 89 7 ANALYST ASSESSMENT 90 7.1 ADVANCED METAL PLATING APPLICATIONS MARKET ASSESSMENT 91 8 SUPPLIER PROFILES 90 BASF DUPONT CHANG CHUN GROUP INCHEON CHEMICAL COMPANY ISHIHARA CHEMICAL/UNICON JX NIPPON MINING AND METALS AND MORE… 9 APPENDIX A: PACKAGING TECH TRENDS 153 List of Figures FIGURE 1: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M’S) 9 FIGURE 2: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS 10 FIGURE 3: ADVANCED LOGIC DEVICES GROWTH FORECAST 11 FIGURE 4: COPPER PLATING CHEMICALS REVENUES ($M’S) FOR ADVANCED PACKAGING & FE/DAMASCENE 12 FIGURE 5: TOTAL PLATING MARKET SHARES FOR ADVANCED PACKAGING AND SEMICONDUCTOR DEVICE MFG. 2022 13 FIGURE 6: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2021) 25 FIGURE 7: WORLDWIDE SEMICONDUCTOR SALES 26 FIGURE 8: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX* 27 FIGURE 9: 2022 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS 28 FIGURE 10: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS 28 FIGURE 11: SEMICONDUCTOR CHIP APPLICATIONS 29 FIGURE 12: MOBILE PHONE SHIPMENTS WW ESTIMATES 30 FIGURE 13: WORLDWIDE PC AND TABLET FORECAST, 2021, Q3 31 FIGURE 14: GLOBAL EV TRENDS 32 FIGURE 15: SEMICONDUCTOR SPEND PER VEHICLE TYPE 33 FIGURE 16: TSMC CONSTRUCTION SITE IN ARIZONA 35 FIGURE 17: CHIP EXPANSIONS 2021-2026 > US$460 B 36 FIGURE 18: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD 37 FIGURE 19: 3-MONTH AVERAGE SEMICONDUCTOR EQUIPMENT BILLINGS 38 FIGURE 20: OVERVIEW OF DEVICE TECHNOLOGY ROADMAP 39 FIGURE 21: EUROPE CHIP EXPANSION UPSIDE 44 FIGURE 22: TECHCET WAFER START FORECAST BY NODE 46 FIGURE 23: TECHCET MATERIALS FORECAST 48 FIGURE 24: PACKAGING METALLIZATION APPLICATIONS 50 FIGURE 25: USE OF SILICON INTERPOSER 51 FIGURE 26: VERSIONS OF TSV & PROCESS FLOW EXAMPLE 51 FIGURE 27: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M’S) 52 FIGURE 28: CU PLATING CHEMICALS 5-YEAR FORECAST 53 FIGURE 29: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS 55 FIGURE 30: CU PLATING ADVANCED PACKAGING REVENUE FORECAST ESTIMATES 56 FIGURE 31: CU PILLAR & CU RDL SEGMENTED FORECAST 57 FIGURE 32: ADV. PACKAGING CU/VMS VOLUME DEMAND FORECAST 58 FIGURE 33: ADV. PACKAGING CU PLATING ADDITIVES VOLUME DEMAND FORECAST 58 FIGURE 34: MATERIALS STACK USING CU PILLAR (< 40 UM PITCH) 59 FIGURE 35: SN AND SNAG PLATING REVENUE 60 FIGURE 36: NICKEL PLATING REVENUE 61 FIGURE 37: ADVANCED LOGIC DEVICES GROWTH FORECAST 62 FIGURE 38: ADV LOGIC METAL PLATING WAFER PASSES 63 FIGURE 39: WW DAMASCENE REVENUE FORECAST ESTIMATES 64 FIGURE 40: DAMASCENE CU VMS VOLUME DEMAND FORECAST ESTIMATES 65 FIGURE 41: DAMASCENE CU PLATING ADDITIVES CHEMICAL VOLUME DEMAND FORECAST 65 FIGURE 42: KEY TRENDS IN ADVANCED PACKAGING 67 FIGURE 43: CHALLENGES OF ELECTROPLATING VIA FILL 68 FIGURE 44: METAL LEVELS PER LOGIC NODE 70 FIGURE 45: INTERCONNECT METAL COMPARISON BY RESISTIVITY 71 FIGURE 46: CU DAMASCENE QUALIFICATION 73 FIGURE 47: LEADING EDGE LOGIC POWER RAIL SCHEMES 76 FIGURE 48: DRAM STRUCTURE 77 FIGURE 49: 3D NAND STRUCTURE 79 FIGURE 50: TOTAL PLATING FOR ADV. PACKAGING AND SEMICONDUCTOR DEVICE MANUFACTURING 2022 85 FIGURE 51: PLATING EQUIPMENT OEM MARKET SHARES 2020% 86 FIGURE 52: PLATING CHEMICAL SUPPLIER FOR DAMASCENE AND ADVANCED PACKAGING APPLICATIONS 87 FIGURE 53: CLEANING COMPLEXITY 94 FIGURE 54: OSATS PACKAGING BUSINESS CANNIBALIZATION TREND 96 FIGURE 55: WAFER LEVEL PLATING 97 FIGURE 56: ADVANCED PACKAGING MARKET DRIVERS AND APPLICATIONS. 98 FIGURE 57: COMPARISON WITH DAMASCENE- TYPE RDL 100 FIGURE 58: USE OF SILICON INTERPOSER 101 FIGURE 59: APPLE EXAMPLE INTERPOSERS 102 FIGURE 60: TSV PROCESS FLOW EXAMPLE 103 List of Tables TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES* 23 TABLE 2: IMF ECONOMIC OUTLOOK* 24 TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES FORECAST 2021 34 TABLE 4: IRDS 2022 LOGIC CORE INTERCONNECT ROADMAP 72 TABLE 5: LOGIC DEVICE ROADMAP FOR METALS 74 TABLE 6: METALS REQUIRED FOR DEVICE FEATURES 75 TABLE 7: DRAM USE OF MO OR RU PRESENT & FUTURE 77 TABLE 8: GENERAL PROCESS FLOW ADVANCED DRAM 78 TABLE 9: 3D NAND MATERIAL CHANGES PRESENT & FUTURE 79 TABLE 10: NUMBER OF STACKS (S) & LAYERS (L) PER GENERATION OF 3DNAND 80 TABLE 11: EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD 81 TABLE 12: TECHNICAL REQUIREMENTS SUMMARY 1/2 83 TABLE 13: TECHNICAL REQUIREMENTS SUMMARY 2/2 83 TABLE 14: REGIONAL PLAYERS – MARKET LEADER AND “OTHERS” 88 TABLE 15: CU PACKAGING APPLICATIONS AND REQUIREMENTS 105
Reviews
There are no reviews yet.