Metal Chemicals for FE & Advanced Packaging-NEW

$8,599.00

•Provides focused information on metal chemicals market trends and supply-chain as it applied to advanced packaging (wafer level) and semiconductor device manufacturing (damascene process).
•Covers information about forecasts for copper plating and additives, market shares, technical trends, and supplier profiles.
 
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Description

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1.1 EXECUTIVE SUMMARY 	     11			                  
 1.2 ADVANCED PACKAGING PER WAFER STARTS 		             12
 1.3 DEVICE DEMAND DRIVERS  - LOGIC			             13
 1.4 PLATING FORECAST FOR DAMASCENE (FE) AND ADVANCED PACKAGING	     14
 1.5 MARKET SHARES				                     15
 1.6 SUPPLIER ACTIVITIES – VARIOUS ANNOUNCEMENTS		     16
 1.7 ANNOUNCEMENTS 				                     17
 1.8 RISK FACTORS 				                     18
 1.9 ANALYST ASSESSMENT				                     19
2 SCOPE, PURPOSE AND METHODOLOGY	20
 2.1 SCOPE					                     21
 2.2 PURPOSE					                     22
 2.3 METHODOLOGY				                     23
 2.4 OVERVIEW OF OTHER TECHCET CMR™ REPORTS		             24
3 SEMICONDUCTOR INDUSTRY MARKET OUTLOOK	      25
 3.0 SEMICONDUCTOR INDUSTRY STATUS & OUTLOOK		             26
 3.1 SEMICONDUCTOR INDUSTRY TIED TO WORLDWIDE ECONOMY	             27
 3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY	     29
 3.1.2 SEMICONDUCTOR SALES GROWTH			             30
 3.1.3 TAIWAN MONTHLY SALES TRENDS			             31
 3.1.4 SEMICONDUCTOR UNITS AND WAFER SHIPMENT GROWTH FORECAST	     32
 3.2 ELECTRONIC GOODS MARKET			                     33
 3.2.1 SMARTPHONES				                     34
 3.2.2 PC UNIT SHIPMENTS				             35
 3.2.3 AUTOMOTIVE SALES				                     36
 3.2.3.1 AUTOMOTIVE SALES AND IMPACT ON SEMICONDUCTOR SALES	     37
 3.2.3.2 ELECTRIC VEHICLE (EV) MARKET TRENDS		             38
 3.2.3.3 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS		     39
 3.2.3.4 SEMICONDUCTOR CONTENT BY AUTOMOTIVE ELECTRONIC SYSTEM 	     40
 3.2.4 SERVERS / IT				                     41
 3.2.4.1 SERVERS / IT, CONTINUED – FORECASTS		             42
 3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION		     43
 3.3.1 EQUIPMENT SPENDING TRENDS			             44
 3.3.2 RECENT INVESTMENT AND FAB/PLANT EXPANSION ACTIVITY	     46
 3.4 POLICY & TRADE TRENDS AND IMPACT			             48 
 3.4.1 POLICY AND TRADE ISSUES			                     49 
 3.4.2 U.S. CHIPS ACT				                     51
 3.4.3 OTHER SEMICONDUCTOR FUNDING ACTIVITY		             52 
 3.4.4 OVERALL CHINA MARKET TRENDS			             53
 3.5 SEMICONDUCTOR MATERIALS OUTLOOK			             55
 3.5.1 TECHCET WAFER START FORECAST			             56 
 3.5.2 SEMICONDUCTOR – LEADING EDGE NODE GROWTH		             57 
 3.5.3 WAFER STARTS OTHER DEVICES			             58
 3.5.4 SEMICONDUCTOR MATERIALS MARKET FORECAST		             59
4 METAL CHEMICALS MARKET BY SEGMENT	60
 4.1 DEFINITIONS				                     61
 4.2 METAL CHEMS MARKET OVERVIEW			             62
 4.2.1 OVERIVEW - ADVANCED PACKAGING AND DAMASCENE METALLIZATION     63
 4.2.2 OVERVIEW - PLATING MARKET TRANSITIONAL TRENDS		     64
 4.3 ADVANCED PACKAGING METALLIZATION – MARKET DRIVERS	             65
 4.3.1 ADVANCED PACKAGING - ADDITIVES FOR CU PLATING REVENUE	     66
 4.3.2 ADVANCED PACKAGING – COPPER CHEMICALS REVENUE 	             67 
 4.3.3 ADVANCED PACKAGING ADDITIVE VOLUMES  		             68
 4.3.4 OTHER PLATING MATERIALS FOR ADVANCED PACKAGING	             69
 4.3.5 SN/SNAG PLATING 				                     70
 4.3.5.1 WW NI PLATING MARKET FORECAST			             71
 4.4 DAMASCENE GROWTH TRENDS			                     72 
 4.4.1 DAMASCENE GROWTH DRIVERS			                     73
 4.4.2 DAMASCENE CU PLATTING REVENUES			             74
 4.4.3 DAMASCENE ADDITIVE VOLUMES  			             75
5 TECHNICAL TRENDS	76
 5.0 TECHNOLOGY CHALLENGE 			                     77
 5.0.1 METAL CLEANINGS  CHALLENGE 			             78
 5.1 PACKAGING TECH TRENDS			                     79
 5.1.1 KEY TRENDS IN ADVANCED PACKAGING 		             80
 5.1.2 MARKET DYNAMICS				                     81
 5.1.3 IDM—WAFER LEVEL PLATING			                     82
 5.1.4 MARKET DRIVERS OF ADVANCED PACKAGING APPLICATIONS	     83
 5.1.5 TECH TRENDS – RDL				             84
 5.1.5.1 DAMASCENE-TYPE RDL 			                     85
 5.1.6 INTERPOSERS (NOT WLP)S			                     86
 5.1.6.1 APPLE EXAMPLE INTERPOSERS (EPWORK CONFIDENTIAL)	     87
 5.1.7 TSV FILLING  2.5-3D				             88
 5.1.8 PACKAGING ELECTROPLATING REQUIREMENTS 		             89
 5.1.8.1 PACKAGING ELECTROPLATING REQUIREMENTS - LISTING	     90
 5.2 DAMASCENE TECH TRENDS			                     91
 5.2.1 MARKET DRIVES TECHNOLOGY TRENDS			             92
 5.2.1.2 TRENDS - MOL AND BEOL PERFORMANCE CHALLENGES       	     93
 5.2.2 CU DAMASCENE QUALIFICATION REQUIREMENTS		             94
 5.2.3 LOGIC METALLIZATION ROADMAP			             95
 5.2.3.1 INTERCONNECT FOR  ADVANCED LOGIC 		             96
 5.2.4.1 GENERAL PROCESS FLOW ADVANCED DRAM 		             98 
 5.2.5 PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO OR RU	     99
 5.2.5.1 3D-NAND GENERATIONS 2020 -2025			             100
 5.2.6 EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD 	     101
 5.2.7 TECHNICAL REQUIREMENTS SUMMARY ½		                     102
 5.2.7.1 TECHNICAL REQUIREMENTS SUMMARY 2/2		             103
6 COMPETITIVE LANDSCAPE		104
 6.1 TOTAL ADVANCED PACKAGING AND DAMASCENE MARKET SHARES	     105
 6.2 MARKET SHARE BY APPLICATION			             106 
 6.3 MARKET SHARE BY APPLICATION			             107
 6.4 REGIONAL PLAYERS AND OTHERS			             108
 6.5 M&A ACTIVITY				                     109
7 ANALYST ASSESSMENT  		110
 7.1 ANALYST ASSESSMENT				                     111
8 SUPPLIER PROFILES		112
 MACDERMID ENTHONE INDUSTRIAL SOLUTIONS
 UYEMURA
 ATOTECH
 ISHIHARA CHEMICAL/UNICON 
 DUPONT 
 MOSES LAKE INDUSTRIES 
 JX NIPPON MINING AND METALS 
 INCHEON CHEMICAL COMPANY 
 MITSUYA 
 SHANGHAI SINYANG  
 BASF 
 SOULBRAIN 
List of Figures
FIGURE 1: PLATING MATERIALS FOR ADVANCED PACKAGING AND 
          INTERCONNECT REVENUES ($M’S) 			            11
FIGURE 2: ADVANCED PACKAGING (AP) 			            12
FIGURE 3: ADVANCED LOGIC DEVICES GROWTH FORECAST 	            13
FIGURE 4: COPPER PLATING CHEMICALS REVENUES ($M’S)  FOR 
          ADVANCED PACKAGING & FE/DAMASCENE 		            14
FIGURE 5: TOTAL PLATING MARKET SHARES FOR ADVANCED PACKAGING 
          AND SEMICONDUCTOR DEVICE MFG 2021 			    15
FIGURE 6: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN  (2020)   28
FIGURE 7: WORLDWIDE SEMICONDUCTOR SALES 		            30
FIGURE 8: WORLDWIDE SEMICONDUCTOR SALES 
          (TSMC, UMC, VIS, ASE, CHIPMOS, KYEC) 			    31
FIGURE 9: SEMICONDUCTOR WAFER AREA SHIPMENTS 		            32
FIGURE 10: SEMICONDUCTOR CHIP APPLICATIONS 		            33
FIGURE 11: MOBILE PHONE SHIPMENTS WW ESTIMATES 		            34
FIGURE 12: PC NOTEBOOK SHIPMENTS 			            35
FIGURE 13 : U.S. AUTOMOTIVE SALES 			            36
FIGURE 14: MONTHLY AUTOMOTIVE SALES TRENDS 		            37
FIGURE 15: GLOBAL EV TRENDS 			                    38
FIGURE 16: SEMICONDUCTOR SPEND PER VEHICLE TYPE. 		    39
FIGURE 17: SEMICONDUCTOR CONTENT BY AUTOMOTIVE APPLICATION.	    40
FIGURE 18: AMAZON SERVER FARM 			                    41
FIGURE 19: SEMICONDUCTOR REVENUE GROWTH FORECASTS 
           (AS OF MARCH 2020) 				            43
FIGURE 20: CAPITAL SPENDING TRENDS BY TECHNOLOGY NODE.  	    44
FIGURE 21 OVERVIEW OF LOGIC ROADMAP TRENDS 		            45
FIGURE 22: CHINA IC MARKET AND PRODUCTION TRENDS 		    53
FIGURE 23: 300MM WAFER STARTS 			                    57
FIGURE 24: >32NM NODE LOGIC DEVICES GROWTH FORECAST(200MM EQUIV.)   58
FIGURE 25: GLOBAL SEMICONDUCTOR MATERIALS HISTORY & FORECAST   	    59
FIGURE 26: PACKAGING METALLIZATION APPLICATIONS 		    61
FIGURE 27: PLATING MATERIALS FOR ADVANCED PACKAGING AND FE 
           INTERCONNECT REVENUES ($M’S). 			    62
FIGURE 28: CU PLATING CHEMICALS 5-YEAR FORECAST 		    63
FIGURE 29: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS    65
FIGURE 30: CU PLATING ADVANCED PACKAGING REVENUE FORECAST ESTIMATES 66
FIGURE 31: CU PILLAR/BUMP & CU RDL SEGMENTED FORECAST 	            67
FIGURE 32: ADV. PACKAGING CU/VMS VOLUME DEMAND FORECAST 	    68
FIGURE 33: ADV. PACKAGING CU PLATING ADDITIVES VOLUME 
           DEMAND FORECAST 				            68
FIGURE 34: OTHER PLATING MATERIALS FOR ADVANCED PACKAGING 	    69
FIGURE 35: SN AND SNAG PLATING REVENUE 		                    70
FIGURE 36: NICKEL PLATING REVENUE 			            71
FIGURE 37: ADVANCED LOGIC DEVICES GROWTH FORECAST 	            72
FIGURE 38: METAL PLATING WAFER PASSES 			            73
FIGURE 39: WW DAMASCENE REVENUE FORECAST ESTIMATES 	            74
FIGURE 40: DAMASCENE CU VMS VOLUME DEMAND FORECAST ESTIMATES 	    75
FIGURE 41: DAMASCENE CU PLATING ADDITIVES CHEMICAL VOLUME 
           DEMAND FORECAST 				            75
FIGURE 42: CLEANING COMPLEXITY 			                    77
FIGURE 43: KEY TRENDS IN ADVANCED PACKAGING 	                    80
FIGURE 44: OSATS PACKAGING BUSINESS CANNIBALIZATION TREND 	    81
FIGURE 45: WAFER LEVEL PLATING 			                    82
FIGURE 46: ADVANCED PACKAGING MARKET DRIVERS AND APPLICATIONS       83
FIGURE 47: COMPARISON WITH DAMASCENE- TYPE RDL 		            85
FIGURE 48: APPLE EXAMPLE INTERPOSERS 			            87
FIGURE 49: TSV PROCESS FLOW EXAMPLE 			            88
FIGURE 50: METAL LEVELS PER LOGIC NODE 		                    92
FIGURE 51: METAL LEVELS PER LOGIC NODE 		                    93
FIGURE 52: CU DAMASCENE QUALIFICATION 		                    94
FIGURE 53: DRAM Structure			                    97
FIGURE 54: 3DNAND Structure			                    99
FIGURE 55: TOTAL PLATING FOR ADV. PACKAGING AND SEMICONDUCTOR 
           DEVICE MANUFACTURING 2021 		                    101
FIGURE 56: PLATING EQUIPMENT OEM MARKET SHARES 2020 	            106
FIGURE 57: PLATING CHEMICAL SUPPLIER FOR DAMASCENE AND 
           ADVANCED PACKAGING APPLICATIONS 			    107
List of Tables
TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES* 		    27
TABLE 2: WORLD BANK ECONOMIC OUTLOOK*  		                    28
TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES 
         FORECAST 2021. 				            42
TABLE 4: DEVICE MAKER INVESTMENT ACTIVITY 		            46
TABLE 5: DEVICE MAKER INVESTMENT ACTIVITY, CONTINUED 	            47
TABLE 6: US CHIPS ACT PROVISIONS 			            51
TABLE 7: CU PACKAGING APPLICATIONS AND REQUIREMENTS	            90
TABLE 8: LOGIC DEVICE ROADMAP FOR METALS 		            95
TABLE 9: METALS REQUIRED FOR DEVICE FEATURES 		            96
TABLE 10: DRAM USE OF MO OR RU PRESENT & FUTURE 		    97
TABLE 11: GENERAL PROCESS FLOW ADVANCED DRAM 		            98
TABLE 11: 3DNAND MATERIAL CHANGES PRESENT & FUTURE 	            99
TABLE 12: NUMBER OF STRINGS PER GENERATION OF 3DNAND 	            100
TABLE 13: EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD    101
TABLE 14: TECHNICAL REQUIREMENTS SUMMARY 		            102
TABLE 15: TECHNICAL REQUIREMENTS SUMMARY		            103
TABLE 16: REGIONAL PLAYERS – MARKET LEADER AND “OTHERS” 	    108

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