Metal Chemicals for FE & Advanced Packaging Market Report CMR-NEW

$8,900.00

•Provides focused information on metal chemicals market trends and supply-chain as it applied to advanced packaging (wafer level) and semiconductor device manufacturing (damascene process).
•Covers information about forecasts for copper plating and additives, market shares, technical trends, and supplier profiles.

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Description

Market Research & Supply-Chain Analysis Report on Metal Chemicals used for Semiconductor Device Manufacturing

Click here for a pdf download of table of contents

1.1 EXECUTIVE SUMMARY 	     8			                  
1.1 EXECUTIVE SUMMARY                                                9
1.2 ADVANCED PACKAGING PER WAFER STARTS                              10
1.3 DEVICE DEMAND DRIVERS  - LOGIC                                   11
1.4 CU PLATING FORECAST FOR DAMASCENE (FE) AND 
ADVANCED PACKAGING    12
1.5 MARKET SHARES                                                    13
1.6 SUPPLIER ACTIVITIES – VARIOUS ANNOUNCEMENTS                      14 
1.7 RISK FACTORS                                                     15
1.8 ANALYST ASSESSMENT                                               16
2 SCOPE, PURPOSE AND METHODOLOGY	17
2.1 SCOPE					                     18
2.2 PURPOSE					                     19
2.3 METHODOLOGY				                             20
2.4 OVERVIEW OF OTHER TECHCET CMR™ 2022 REPORTS		             21
3 SEMICONDUCTOR INDUSTRY MARKET OUTLOOK	      22
3.1 WORLDWIDE ECONOMY 						     23
3.1.1  SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY           25
3.1.2 SEMICONDUCTOR SALES GROWTH 				     26
3.1.3 TAIWAN MONTHLY SALES TRENDS 			             27
3.1.4 UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023 – 
SLOWER TO 
      NEGATIVE SEMI REVENUE GROWTH EXPECTED                          28
3.2 ELECTRONIC GOODS MARKET  					     29 
3.2.1 SMARTPHONES 						     30
3.2.2 PC UNIT SHIPMENTS						     31
3.2.2.1 ELECTRIC VEHICLE (EV) MARKET TRENDS 			     32
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS  		     33
3.2.3  SERVERS / IT MARKET				             34
3.3 SEMICONDUCTOR FABRICATION GROWTH & EXPANSION		     35
3.3.1 FAB EXPANSION ANNOUNCEMENT SUMMARY  			     36
3.3.2 WW FAB EXPANSION DRIVING GROWTH   			     37
3.3.3 EQUIPMENT SPENDING TRENDS  			             38
3.3.4 TECHNOLOGY ROADMAPS  					     39
3.3.5 FAB INVESTMENT ASSESSMENT 			             40
3.4 POLICY & TRADE TRENDS AND IMPACT  			             41
3.4.1 POLICY AND TRADE ISSUES  			                     42
3.5 SEMICONDUCTOR MATERIALS OUTLOOK 			             43
3.5.1 COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION 
SCHEDULES?      44
3.5.2 CONTINUED LOGISTICS ISSUES PLAGUE THE WESTERN WORLD            45
3.5.3 TECHCET WAFER STARTS FORECAST THROUGH 2026                     46
3.5.3.1 TECHCET WAFER START MODELING METHODOLOGY 		     47
3.5.4 TECHCET’S MATERIAL FORECAST  			             48
4 METAL CHEMICALS MARKET BY SEGMENT	49
4.1 DEFINITIONS   	 	 	 	 	 	     50
4.1.1 DEFINITIONS, CONTINUED  	 	 	 	 	     51
4.2 METAL PLATING CHEMICALS MARKET OVERVIEW   	 	 	     52
4.2.1 OVERVIEW -  ADVANCED PACKAGING AND 
DAMASCENE METALLIZATION     53
4.2.2 OVERVIEW - PLATING MARKET TRANSITIONAL TRENDS  	 	     54
4.3  ADVANCED PACKAGING METALLIZATION – 
MARKET DRIVERS 	   	     55
4.3.1 ADVANCED PACKAGING - ADDITIVES FOR CU 
PLATING REVENUE 	     56
4.3.2 ADVANCED PACKAGING – COPPER CHEMICALS REVENUE   	 	     57
4.3.3  ADVANCED PACKAGING ADDITIVE VOLUMES    	 	 	     58
4.3.4  OTHER PLATING MATERIALS FOR ADVANCED PACKAGING  	 	     59
4.3.5 SN / SNAG PLATING  	 	 	 	 	     60
4.3.5.1 WW NI PLATING MARKET FORECAST  	 	 	 	     61
4.4 DAMASCENE GROWTH TRENDS   	 	 	 	 	     62
4.4.1 DAMASCENE GROWTH DRIVERS  	 	 	 	     63
4.4.2 DAMASCENE CU PLATING REVENUES  	 	 	 	     64
4.4.3  DAMASCENE ADDITIVE VOLUMES 	 	 	 	     65
5 TECHNICAL TRENDS	66
5.1 PACKAGING TECH TRENDS   	 	 	 	 	     67
5.1.1 PACKAGING TECHNICAL CHALLENGES 	 	 	 	     68
5.2 TECH TRENDS   	 	 	 	 	 	     69
5.2.1 MARKET DRIVES TECHNOLOGY TRENDS  	 	 	 	     70
5.2.2 ADV LOGIC INTERCONNECT WIRING TECHNOLOGY EVOLUTION 	     71
5.2.2.1 TRENDS  - MOL AND BEOL IRDS ROADMAP 	 	 	     72
5.2.3  CU DAMASCENE QUALIFICATION REQUIREMENTS	 	 	     73
5.2.4  LOGIC METALLIZATION ROADMAP 	 	 	 	     74
5.2.4.1 INTERCONNECT FOR  ADVANCED LOGIC   	 	 	     75
5.2.5 ADV LOGIC BURIED POWER RAIL  	 	 	 	     76
5.2.6  TECHNOLOGY ROADMAP: DRAM WITH  MO OR RU  	 	     77
5.2.6.1 GENERAL PROCESS FLOW ADVANCED DRAM   	 	 	     78
5.2.7 PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO 
OR RU           79
5.2.7.1 3D-NAND GENERATIONS 2020 -2025  	 	 	     80
5.2.8 EXAMPLE OF LOGIC PRO  CESS FLOW 20 NM TO 32 NM 
LOGIC PVD       81
5.2.8 TECHNICAL REQUIREMENTS SUMMARY 1/2  	 	 	     82
5.2.8.1 TECHNICAL REQUIREMENTS SUMMARY 2/2  	 	 	     83
6 COMPETITIVE LANDSCAPE		84
6.1 TOTAL ADVANCED PACKAGING AND DAMASCENE 
MARKET SHARES  	     85
6.2 OEM MARKET SHARE– PLATING EQUIPMENT    	 	 	     86
6.3 MARKET SHARE BY APPLICATION – CU PLATING FOR 
ADVANCED PACKAGING  87
6.4 REGIONAL PLAYERS AND OTHERS    	 	 	 	     88
6.5 M&A ACTIVITY    	 	 	 	 	 	     89
7 ANALYST ASSESSMENT  		90
7.1  ADVANCED METAL PLATING APPLICATIONS MARKET ASSESSMENT           91
8 SUPPLIER PROFILES		90
BASF
DUPONT
CHANG CHUN GROUP
INCHEON CHEMICAL COMPANY
ISHIHARA CHEMICAL/UNICON
JX NIPPON MINING AND METALS
AND MORE…
9 APPENDIX A: PACKAGING TECH TRENDS   153
List of Figures
FIGURE 1: PLATING MATERIALS FOR ADVANCED PACKAGING 
AND DEVICE CU 
          INTERCONNECT REVENUES ($M’S) 				     9
FIGURE 2: ADVANCED PACKAGING APPLICATIONS IN MILLIONS 
OF WAFERS      10
FIGURE 3: ADVANCED LOGIC DEVICES GROWTH FORECAST 		     11
FIGURE 4: COPPER PLATING CHEMICALS REVENUES ($M’S)   

          FOR ADVANCED PACKAGING & FE/DAMASCENE 		     12
FIGURE 5: TOTAL PLATING MARKET SHARES FOR ADVANCED 
PACKAGING AND 
          SEMICONDUCTOR DEVICE MFG. 2022 		             13
FIGURE 6: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY 
CHAIN (2021)     25
FIGURE 7: WORLDWIDE SEMICONDUCTOR SALES 			     26
FIGURE 8: TECHCET’S TAIWAN SEMICONDUCTOR INDUSTRY INDEX*             27
FIGURE 9: 2022 SEMICONDUCTOR INDUSTRY REVENUE 
GROWTH FORECASTS       28
FIGURE 10: 2023 SEMICONDUCTOR INDUSTRY REVENUE 
GROWTH FORECASTS      28
FIGURE 11: SEMICONDUCTOR CHIP APPLICATIONS  			     29
FIGURE 12: MOBILE PHONE SHIPMENTS WW ESTIMATES  		     30
FIGURE 13: WORLDWIDE PC AND TABLET FORECAST, 2021, Q3  		     31
FIGURE 14: GLOBAL EV TRENDS  					     32
FIGURE 15: SEMICONDUCTOR SPEND PER VEHICLE TYPE 		     33
FIGURE 16: TSMC CONSTRUCTION SITE IN ARIZONA 		             35
FIGURE 17: CHIP EXPANSIONS 2021-2026 > US$460 B  		     36
FIGURE 18: SEMICONDUCTOR CHIP MANUFACTURING REGIONS 
OF THE WORLD     37
FIGURE 19: 3-MONTH AVERAGE SEMICONDUCTOR EQUIPMENT 
BILLINGS          38
FIGURE 20: OVERVIEW OF DEVICE TECHNOLOGY ROADMAP 		     39
FIGURE 21: EUROPE CHIP EXPANSION UPSIDE  			     44
FIGURE 22: TECHCET WAFER START FORECAST BY NODE  		     46
FIGURE 23: TECHCET MATERIALS FORECAST  			             48
FIGURE 24: PACKAGING METALLIZATION APPLICATIONS  		     50
FIGURE 25: USE OF SILICON INTERPOSER   				     51
FIGURE 26: VERSIONS OF TSV & PROCESS FLOW EXAMPLE  		     51
FIGURE 27: PLATING MATERIALS FOR ADVANCED PACKAGING   

           AND DEVICE CU INTERCONNECT REVENUES ($M’S)  	             52
FIGURE 28: CU PLATING CHEMICALS 5-YEAR FORECAST 		     53
FIGURE 29: ADVANCED PACKAGING APPLICATIONS IN MILLIONS 
OF WAFERS     55
FIGURE 30: CU PLATING ADVANCED PACKAGING 
REVENUE FORECAST ESTIMATES  56
FIGURE 31: CU PILLAR & CU RDL SEGMENTED FORECAST  		     57
FIGURE 32: ADV. PACKAGING CU/VMS VOLUME DEMAND FORECAST 	     58
FIGURE 33: ADV. PACKAGING CU PLATING ADDITIVES 
           VOLUME DEMAND FORECAST  				     58
FIGURE 34: MATERIALS STACK USING CU PILLAR (< 40 UM PITCH)           59
FIGURE 35: SN AND SNAG PLATING REVENUE				     60
FIGURE 36: NICKEL PLATING REVENUE 				     61
FIGURE 37: ADVANCED LOGIC DEVICES GROWTH FORECAST		     62
FIGURE 38: ADV LOGIC METAL PLATING WAFER PASSES  		     63
FIGURE 39: WW DAMASCENE REVENUE FORECAST ESTIMATES  		     64
FIGURE 40: DAMASCENE CU VMS VOLUME DEMAND 
FORECAST ESTIMATES         65
FIGURE 41: DAMASCENE CU PLATING ADDITIVES CHEMICAL 
VOLUME 
           DEMAND FORECAST  					     65
FIGURE 42: KEY TRENDS IN ADVANCED PACKAGING  		  	     67
FIGURE 43: CHALLENGES OF ELECTROPLATING VIA FILL 		     68
FIGURE 44: METAL LEVELS PER LOGIC NODE  		             70
FIGURE 45: INTERCONNECT METAL COMPARISON BY RESISTIVITY  	     71
FIGURE 46: CU DAMASCENE QUALIFICATION  				     73
FIGURE 47: LEADING EDGE LOGIC POWER RAIL SCHEMES 		     76
FIGURE 48: DRAM STRUCTURE 					     77
FIGURE 49: 3D NAND STRUCTURE 					     79
FIGURE 50: TOTAL PLATING FOR ADV. PACKAGING AND 
SEMICONDUCTOR 
           DEVICE MANUFACTURING 2022 				     85
FIGURE 51: PLATING EQUIPMENT OEM MARKET SHARES 2020% 		     86
FIGURE 52: PLATING CHEMICAL SUPPLIER FOR DAMASCENE AND 
ADVANCED 
           PACKAGING APPLICATIONS 				     87
FIGURE 53: CLEANING COMPLEXITY   				     94
FIGURE 54: OSATS PACKAGING BUSINESS CANNIBALIZATION TREND            96
FIGURE 55: WAFER LEVEL PLATING 				             97
FIGURE 56: ADVANCED PACKAGING MARKET DRIVERS 
AND APPLICATIONS.       98
FIGURE 57: COMPARISON WITH DAMASCENE- TYPE RDL                       100
FIGURE 58: USE OF SILICON INTERPOSER  				     101
FIGURE 59: APPLE EXAMPLE INTERPOSERS 				     102
FIGURE 60: TSV PROCESS FLOW EXAMPLE  				     103
List of Tables
TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES*                      23
TABLE 2: IMF ECONOMIC OUTLOOK*                                       24
TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES 
FORECAST 
         2021                                                        34
TABLE 4: IRDS 2022 LOGIC CORE INTERCONNECT ROADMAP                   72
TABLE 5: LOGIC DEVICE ROADMAP FOR METALS                             74
TABLE 6: METALS REQUIRED FOR DEVICE FEATURES                         75
TABLE 7: DRAM USE OF MO OR RU PRESENT & FUTURE                       77
TABLE 8: GENERAL PROCESS FLOW ADVANCED DRAM                          78
TABLE 9: 3D NAND MATERIAL CHANGES PRESENT & FUTURE                   79
TABLE 10: NUMBER OF STACKS (S) & LAYERS (L) PER GENERATION OF 
3DNAND 80
TABLE 11: EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM 
LOGIC PVD     81
TABLE 12: TECHNICAL REQUIREMENTS SUMMARY 1/2                         83
TABLE 13: TECHNICAL REQUIREMENTS SUMMARY  2/2                        83
TABLE 14: REGIONAL PLAYERS – MARKET LEADER AND “OTHERS”              88
TABLE 15: CU PACKAGING APPLICATIONS AND REQUIREMENTS                 105

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