San Diego, CA, June 19, 2019: TECHCET—the advisory services firm providing electronic materials information— announced that the global market for chemical-mechanical planarization (CMP) consumable materials in semiconductor manufacturing is forecasted to grow to US$2.7 billion in 2019. However, several suppliers report softening orders for the first half of 2019 due to shifting wafer starts combined with intensified industry efforts to save slurry costs through increasing dilution. There is also substantial uncertainty in the slurry supply-chain due to China’s dominance of ceria refining. The latest quarterly update to the Critical Materials Report™ (CMR) on CMP Slurry, Pads, and Conditioners, shows global sub-market sizes of US$1.4 billion, US$1.0 billion, and US$300 million (respectively).
“Colloidal ceria nano-particles have long been established as the preferred abrasive for CMP slurries for shallow trench isolation and other specialty planarization processes in device manufacturing,” explained Dr. Diane Scott, TECHCET senior analyst and coauthor of the report along with Dr. Rob Rhoades. “However, recent threats to the ceria supply-chain from China are leading many fabs to begin qualifying alternative slurries to reduce the risks of either dramatic cost increases or production disruptions.”
Increased use of 3D structures in leading edge digital ICs leads to the need for more CMP process steps in their fabrication. Advanced process integrations are also driving increased customization of consumable materials to achieve the necessary planarization at each level. Consequently, the market growth for CMP consumables should outpace the market growth for silicon wafers in IC fabs.
This report covers 58 supplier profiles: 3M, Ace Nanochem, Adcon Lab, Anii Microelectronics, Asahi Glass, BASF, Bailkowski/PSB, Cabot, Dongjin SemiChem, DowDupont, Eka Chemical/Akzo Nobel, Eikem, Eminess Technologies, Evonik Industries,Ehwa, Ferro, FujiFilm, Fujimi, Fuso Chemical, General Engineering and Research, W.R.Grace, Hitachi Chemical, Innovative Organics, Intersurface Dynamics, JGC C&C, JSR, KC Tech, Kemesys, Kinik, Merck (incl. former AZ Chemical), Mitsui Mining & Smelting, Morgan Advanced Ceramics, Nalco, Nano Phase Technologies, Nissan Chemical Industries, Nitta-Haas, Precision Colloids, Rhodia (Solvay), Samsung (Cheil Industries), Showa Denko, Sibond, Saint-Gobain, Soulbrain, UK Abrasives, U Wiz Technology, Universal Photonics, Versum, and Wacker Chemie.
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