CMP Materials Market to Reach $2.4B by 2022
Slurry and Pad Sub-Markets both ~6% CAGR San Diego, CA, January 18, 2018: TECHCET—the advisory services firm providing electronic materials information— announced that increased use of 3D structures in commercial ICs leads to the need for more Chemical-Mechanical Planarization (CMP) process steps in commercial IC fabrication to keep the different layers properly aligned. The growing importance of CMP technology will lead to steady growth in the market for consumable…