2023 Semiconductor Plating for Device and Packaging Expecting Slowdown as Global Economic Conditions Weaken

New Technologies such as Ruthenium and Molybdenum in Barrier Layers May Also Replace Old Plating Standards San Diego, CA, January 4, 2023:  TECHCET—the advisory firm providing business and technology information on the semiconductor materials supply chain — announced that the revenue growth for the 2023 Semiconductor Plating Market is expected to rise only 2% above 2022. This is a significant decline compared to the 8.3% growth seen in the…

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CVD Deposition, Plating and Sputter Target Materials Looking Strong Despite Threat of Semiconductor Market Slowdown

Advanced packaging and interconnect layers driving growth through ‘26 San Diego, CA, November 30, 2022:  TECHCET—the advisory firm providing information on the electronics and semiconductor materials market supply-chain — announced that total deposition material revenues, including Sputtering Targets, ALD/CVD Precursors, and Metal Chemicals, will approach US$3.9 billion in 2022 and over US$4.1 billion in 2023. Growth drivers include increased use of advanced packaging with redistribution layers and copper pillar…

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Electroplating Materials – Any Slowdown in Sight?

Advanced logic device expected to drive metal plating market forward San Diego, CA, September 13, 2022:  TECHCET—the electronic materials advisory firm providing business and technology information— forecasts the total 2022 IC electroplating (Metal Chemicals) revenues to grow 8.1% to reach US$1,019 million. “A key growth driver for the electroplating market includes increases in interconnect layers in next generation advanced logic device nodes,” states Karey Holland, Ph.D., TECHCET’s Chief Strategist…

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