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Category: Metal Chem

2023 Semiconductor Plating for Device and Packaging Expecting Slowdown as Global Economic Conditions Weaken

January 4, 2023
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| Categories: Metal Chem

New Technologies such as Ruthenium and Molybdenum in Barrier Layers May Also Replace Old Plating Standards San Diego, CA, January 4, 2023:  TECHCET—the advisory firm providing business and technology information on the semiconductor materials supply chain — announced that the revenue growth for the 2023 Semiconductor Plating Market is expected to rise only 2% above 2022. This is a significant decline compared to the 8.3% growth seen in the…

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CVD Deposition, Plating and Sputter Target Materials Looking Strong Despite Threat of Semiconductor Market Slowdown

November 30, 2022
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| Categories: CVD and ALD Precursors, Metal Chem, Sputtering Targets

Advanced packaging and interconnect layers driving growth through ‘26 San Diego, CA, November 30, 2022:  TECHCET—the advisory firm providing information on the electronics and semiconductor materials market supply-chain — announced that total deposition material revenues, including Sputtering Targets, ALD/CVD Precursors, and Metal Chemicals, will approach US$3.9 billion in 2022 and over US$4.1 billion in 2023. Growth drivers include increased use of advanced packaging with redistribution layers and copper pillar…

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Electroplating Materials – Any Slowdown in Sight?

September 13, 2022
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| Categories: Metal Chem

Advanced logic device expected to drive metal plating market forward San Diego, CA, September 13, 2022:  TECHCET—the electronic materials advisory firm providing business and technology information— forecasts the total 2022 IC electroplating (Metal Chemicals) revenues to grow 8.1% to reach US$1,019 million. “A key growth driver for the electroplating market includes increases in interconnect layers in next generation advanced logic device nodes,” states Karey Holland, Ph.D., TECHCET’s Chief Strategist…

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