“How long will it last?” Heightened Demand for Plating in Advanced Packaging & Front-End (FE)/Damascene Chemicals

Healthy growth through 2022, but softening expected in 2023 San Diego, CA, September 23, 2021:  TECHCET—the electronic materials advisory firm providing business and technology information— announced a heightened need for plating chemistries consumed in advanced packaging & FE/damascene driven by huge growth in chips in all sectors. This includes plating chemicals for copper (Cu), nickel (Ni), tin (Sn), and silver (Ag). Total copper plating chemicals are expected to grow…

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